JPH0350131A - Device for molecular-beam epitaxy - Google Patents

Device for molecular-beam epitaxy

Info

Publication number
JPH0350131A
JPH0350131A JP2064599A JP6459990A JPH0350131A JP H0350131 A JPH0350131 A JP H0350131A JP 2064599 A JP2064599 A JP 2064599A JP 6459990 A JP6459990 A JP 6459990A JP H0350131 A JPH0350131 A JP H0350131A
Authority
JP
Japan
Prior art keywords
crucible
beam source
molecular beam
molecular
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2064599A
Other languages
Japanese (ja)
Other versions
JPH0525835B2 (en
Inventor
Takuji Sonoda
琢二 園田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2064599A priority Critical patent/JPH0350131A/en
Publication of JPH0350131A publication Critical patent/JPH0350131A/en
Publication of JPH0525835B2 publication Critical patent/JPH0525835B2/ja
Granted legal-status Critical Current

Links

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00Technologies relating to the processing of minerals
    • Y02P40/50Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57Improving the yield, e-g- reduction of reject rates

Landscapes

  • Crystals, And After-Treatments Of Crystals (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)

Abstract

PURPOSE:To improve the reproducibility, production efficiency and quality of an epitaxial film by charging a molecular-beam source material highly purified in an exclusive device or a molecular-beam source feeder into a molecular-beam source crucible of a reaction chamber without the material being brought into contact with air. CONSTITUTION:A discharge port 21 is opened, a treating crucible 15 charged with a molecular-beam source material 14 is set in a treating chamber 16, a vacuum valve 20 is opened to evacuate the chamber 16 to 10<-9>Torr, and then the material 14 is melted by a heater 17b. A valve 19a is opened to introduce gaseous H2 into the chamber 16, the valve 20 is simultaneously closed, a valve 19b is closed when the gaseous H2 pressure in the chamber 16 is increased above atmospheric pressure, the material 14 is heat-treated, and then the material 14 is cooled, solidified and highly purified. The valves 19a and 19b are then closed, the valve 20 is opened to evacuate the chamber 16 to the order of 10<-9>Torr, and then a molecular-beam source transter gate valve 7b is opened. An external magnet 22c is operated to insert the crucible 15 into a molecular-beam source crucible 1, a heater 8 is energized to heat the material 14 in the crucible 1 above its melting point, and the liquefied material 14 is dropped into the crucible 1 from a small hole 15a provided at the bottom of the crucible 15.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、分子線エピタキシ装置の改良に関するもので
ある。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to improvements in molecular beam epitaxy equipment.

〔従来の技術〕[Conventional technology]

分子線エピタキシ装置は、急峻な界面及び高度な膜厚制
御性を要求される半導体素子用エピタキシャル装置とし
て重要視されており、従来の分子線エピタキシ装置とし
て第3図に示すものがあった0図において、分子線エピ
タキシ装置は、反応室であるベルジャ12と、これの内
部に収容された、分子線源るつぼ1.基板2を昇温加熱
するための基板ホルダー3.及び不純物ガスを吸着させ
るための液体窒素冷却トラップ4a、4bと、上記ベル
ジャ12に接続された、真空排気系5.リークバルブ6
、及び基板移送用ゲートバルブ7aとを備えている。ま
た上記分子線源るつぼ1は加熱用ヒータ8.熱電対9及
び熱放射板10aを備え、該るつぼ1内を所望の温度に
制御できる構造になっている。またこの分子線源るつぼ
1にはるつぼフランジ11が取り付けられており、この
るつぼフランジ11はベルジャ12に固着されたるつぼ
用ポートフランジ13に着脱可能に取付られている。
Molecular beam epitaxy equipment is considered important as an epitaxial equipment for semiconductor devices that requires steep interfaces and high controllability of film thickness. The molecular beam epitaxy apparatus includes a bell jar 12 which is a reaction chamber, and a molecular beam source crucible 1 housed inside the bell jar 12. Substrate holder 3 for heating the substrate 2; and liquid nitrogen cooling traps 4a and 4b for adsorbing impurity gas, and a vacuum exhaust system 5 connected to the bell jar 12. leak valve 6
, and a substrate transfer gate valve 7a. The molecular beam source crucible 1 also has a heating heater 8. It is equipped with a thermocouple 9 and a heat radiation plate 10a, and has a structure that allows the temperature inside the crucible 1 to be controlled to a desired temperature. Further, a crucible flange 11 is attached to this molecular beam source crucible 1, and this crucible flange 11 is detachably attached to a crucible port flange 13 fixed to a bell jar 12.

上記従来の分子線エピタキシ装置において、分子線源材
料14を分子線源るつぼ1に充填する場合は、リークバ
ルブ6から窒素ガスをベルジャ12内に導入して真空を
破り、分子線源るつぼ1を、るつぼフランジ11をるつ
ぼ用ポートフランジ13から取り外すことにより大気中
に取り出し、大気中で分子線源材料14を分子線源るつ
ぼ1内に充填していた。
In the conventional molecular beam epitaxy apparatus described above, when filling the molecular beam source crucible 1 with the molecular beam source material 14, nitrogen gas is introduced into the bell jar 12 from the leak valve 6 to break the vacuum and the molecular beam source crucible 1 is filled with the molecular beam source material 14. The crucible flange 11 was removed from the crucible port flange 13 to take it out into the atmosphere, and the molecular beam source material 14 was filled into the molecular beam source crucible 1 in the atmosphere.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

従来の分子線エピタキシ装置は以上のように構成されて
いるため、以下の欠点があった。
Since the conventional molecular beam epitaxy apparatus is configured as described above, it has the following drawbacks.

(1)真空を破ることにより、分子線源るつぼ1゜基板
ホルダー3.液体窒素冷却トラップ4a、4b等の構成
部材が汚染され、エピタキシャル膜の結晶性及び再現性
に悪影響を及ぼす。
(1) By breaking the vacuum, the molecular beam source crucible 1° substrate holder 3. Constituent members such as the liquid nitrogen cooling traps 4a and 4b are contaminated, which adversely affects the crystallinity and reproducibility of the epitaxial film.

(IF)真空を破った後再び結晶成長開始までに必要な
工程、即ちベルジャ12のベーキング、分子線源るつぼ
1及び分子線源材料14の真空熱処理等の工程により、
約−週間の成長準備期間を必要とするため、生産能率が
低い。
(IF) Through the steps necessary before starting crystal growth again after breaking the vacuum, such as baking the bell jar 12 and vacuum heat treatment of the molecular beam source crucible 1 and the molecular beam source material 14,
The production efficiency is low because it requires a growth preparation period of about -weeks.

(III)分子線源材料14の大気中での汚染物質は真
空熱処理だけでは完全には除去されず、この問題は特に
■族元素の酸化物において顕著であり、さらに熱処理中
の不純物ガスが成長を行なうチャンバー内に放出され、
これらはエピタキシャル膜の結晶性を悪(するとともに
エピタキシャル膜の表面の欠陥の原因ともなる。
(III) Contaminants in the atmosphere of the molecular beam source material 14 cannot be completely removed by vacuum heat treatment alone, and this problem is particularly noticeable with oxides of group III elements, and furthermore, impurity gases grow during heat treatment. is released into a chamber where
These impair the crystallinity of the epitaxial film (and also cause defects on the surface of the epitaxial film).

本発明はこのような従来の問題点を解決するためになさ
れたもので、成長室内を大気にさらすことなくエピタキ
シャル成長ができ、エピタキシャル膜の再現性、生産能
率を向上でき、かつ該エピタキシャル膜の品質を大きく
向上できる分子線エピタキシ装置を提供することを目的
としている。
The present invention was made to solve these conventional problems, and allows epitaxial growth without exposing the inside of the growth chamber to the atmosphere, improving the reproducibility and production efficiency of epitaxial films, and improving the quality of the epitaxial films. The purpose of the present invention is to provide a molecular beam epitaxy device that can greatly improve the performance.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は、分子線エピタキシ装置において、真空熱処理
もしくは水素雰囲気内での熱処理により高純度化した分
子線源材料をエアーロック方式により大気にさらすこと
な(分子線源るつぼに充填する分子線源材料処理装置を
設けたものである。
The present invention uses a molecular beam epitaxy apparatus to prevent molecular beam source materials that have been highly purified through vacuum heat treatment or heat treatment in a hydrogen atmosphere from being exposed to the atmosphere using an airlock system (molecular beam source materials filled into a molecular beam source crucible). It is equipped with a processing device.

〔作用〕[Effect]

本発明に係る分子線エピタキシ装置では、分子線源材料
は、分子線源材料を高純度化するための専用装置もしく
は反応室と別に設けられた分子線源供給装置内において
予め高純度化され、しかる後大気に触れることなく反応
室内の分子線源るつぼ内に充填される。
In the molecular beam epitaxy apparatus according to the present invention, the molecular beam source material is highly purified in advance in a dedicated device for highly purifying the molecular beam source material or in a molecular beam source supply device provided separately from the reaction chamber, Thereafter, it is filled into a molecular beam source crucible in a reaction chamber without being exposed to the atmosphere.

〔実施例〕〔Example〕

以下、この発明の実施例を分子線源材料としてGaを例
に取り図を用いて説明する。
Embodiments of the present invention will be described below with reference to the drawings, taking Ga as an example of the molecular beam source material.

第1図及び第2図は本発明の一実施例を示す。1 and 2 show an embodiment of the present invention.

図において、第3図と同一符号は同−又は相当部分を示
し、30は分子線源供給装置であり、これの密閉容器で
ある分子線源処理室16はゲート弁7bを介してベルジ
ャ12に接続されている。20は真空排気バルブ、21
は分子線源処理用るつぼ取り出しボート、19は上記処
理室16内に水素ガスを供給するためのガス供給装置で
あり、これは水素導入バルブ19a、水素放出バルブ1
9bからなる。
In the figure, the same reference numerals as in FIG. 3 indicate the same or equivalent parts, and 30 is a molecular beam source supply device, and the molecular beam source processing chamber 16, which is a closed container thereof, is connected to the bell jar 12 via the gate valve 7b. It is connected. 20 is a vacuum exhaust valve, 21
19 is a boat for taking out a crucible for molecular beam source processing; 19 is a gas supply device for supplying hydrogen gas into the processing chamber 16;
Consists of 9b.

、また上記分子線源処理室16内には処理用るつぼ15
と、このるつぼ15に入れられた分子線源材料14と熱
処理するためのPBN製昇温炉17a、昇温ヒータ17
b、熱放射板17cからなる加熱装置17及び熱処理中
の放出ガスを吸着するための液体窒素トラップ4Cが配
設されている。
In addition, a processing crucible 15 is provided in the molecular beam source processing chamber 16.
A PBN heating furnace 17a and a heating heater 17 are used to heat-treat the molecular beam source material 14 placed in the crucible 15.
b, a heating device 17 consisting of a heat radiation plate 17c, and a liquid nitrogen trap 4C for adsorbing gas released during heat treatment.

そして上記処理用るつぼ15の底部には、小孔15aが
形成されており、これは上記分子線源材料14が溶融し
た際にこれを上記分子線源るつぼ1内に落下させるため
のものである。
A small hole 15a is formed at the bottom of the processing crucible 15, and is used to allow the molecular beam source material 14 to fall into the molecular beam source crucible 1 when it is melted. .

また22aは上記処理用るつぼ15を移動する移動棒で
あり、これは内部磁石22bと接続されており、またこ
の内部磁石22bは外部磁石22Cと磁気的に結合され
、外部磁石22cを移動することにより処理用るつぼ1
5を移動するるつぼ挿入装置22が構成されている。
Further, 22a is a moving rod for moving the processing crucible 15, which is connected to an internal magnet 22b, and this internal magnet 22b is magnetically coupled to an external magnet 22C to move the external magnet 22c. Crucible 1 for processing by
A crucible insertion device 22 for moving the crucible 5 is constructed.

次に動作について説明する。Next, the operation will be explained.

まず分子線源材料を高純度化するには、取り出しボート
21を開いて処理用るつぼ15を取り出し、これに分子
線源材料14であるGaを充填し、この処理用るつぼ1
5を再び処理室16中にセットする。そして真空バルブ
20を開いて処理室16を10−’torr台の真空度
まで排気し、排気後昇温ヒータ17bに電流を流して蒸
発源材料Gaが約950°Cになるまで昇温する。約1
時間経過後水素導入バルブ19aを開いて水素ガスを該
処理室16内に導入し、これと同時に真空排気バルブ2
0を閉じる。そして分子線源処理室16の水素ガス圧が
大気圧以上になった時に水素放出バルブ19bを開く。
First, in order to highly purify the molecular beam source material, open the take-out boat 21 and take out the processing crucible 15, fill it with Ga which is the molecular beam source material 14, and then
5 is set in the processing chamber 16 again. Then, the vacuum valve 20 is opened to evacuate the processing chamber 16 to a degree of vacuum on the order of 10-'torr, and after evacuation, current is applied to the temperature increasing heater 17b to raise the temperature of the evaporation source material Ga to about 950°C. Approximately 1
After a period of time has elapsed, the hydrogen introduction valve 19a is opened to introduce hydrogen gas into the processing chamber 16, and at the same time the vacuum exhaust valve 19a is opened.
Close 0. Then, when the hydrogen gas pressure in the molecular beam source processing chamber 16 becomes equal to or higher than atmospheric pressure, the hydrogen release valve 19b is opened.

その後Gaの量に応じた、例えばGa10gに対して2
4時間の熱処理を行なう。
After that, depending on the amount of Ga, for example, 2
Heat treatment is performed for 4 hours.

所定時間経過後昇温ヒータ17bへの通電をやめ蒸発源
材料Gaを冷却して固化させれば、これにより該分子線
源材料14は高純度化されたこととなる。その後水素放
出パルプ19bを閉じ、さらに水素導入パルプ19aを
も閉じ、再び真空排気バルブ20を開いて分子線源処理
室16を1O−9torr台まで排気する。
After a predetermined period of time has elapsed, the supply of electricity to the temperature increasing heater 17b is stopped and the evaporation source material Ga is cooled and solidified, thereby making the molecular beam source material 14 highly purified. Thereafter, the hydrogen-releasing pulp 19b is closed, and the hydrogen-introducing pulp 19a is also closed, and the evacuation valve 20 is opened again to evacuate the molecular beam source processing chamber 16 to a level of 10-9 torr.

次に上記高純度化された分子線源材料14を分子線源る
つぼ1内に充填するには、上記処理室16内を排気後分
子線源移送用ゲートバルブ7bを開き、外部磁石22c
を操作することにより処理用るつぼ15を分子線源るつ
ぼ1内に挿入する。
Next, in order to fill the molecular beam source crucible 1 with the highly purified molecular beam source material 14, the process chamber 16 is evacuated, the molecular beam source transfer gate valve 7b is opened, and the external magnet 22c is opened.
The processing crucible 15 is inserted into the molecular beam source crucible 1 by operating the .

そして加熱用ヒータ18を通電することにより分子線源
るつぼ1内の温度をGaの融点以上に昇温する。すると
液化されたGaは処理用るつぼ15の底部に設けられた
小孔15aから落下し、分子線源るつぼ1内に充填され
る(第2図参照)、充填径外部磁石22cを操作して処
理用るつぼ15を分子線源処理室16にもどし、分子線
源移送用ゲートパルプ7bを閉じると、これにより分子
線源材料の充填は完了したこととなる。
Then, by energizing the heating heater 18, the temperature inside the molecular beam source crucible 1 is raised to a temperature higher than the melting point of Ga. Then, the liquefied Ga falls from the small hole 15a provided at the bottom of the processing crucible 15, and is filled into the molecular beam source crucible 1 (see Fig. 2), and is processed by operating the filling diameter external magnet 22c. When the crucible 15 to be used is returned to the molecular beam source processing chamber 16 and the molecular beam source transfer gate pulp 7b is closed, filling with the molecular beam source material is completed.

このように本実施例では、密閉された処理室工6におい
て分子線源材料を予め高純度化し、これを大気に触れる
ことなく分子線源るつぼ1内に供給するようにしたので
、以下の効果がある。
In this way, in this example, the molecular beam source material is highly purified in advance in the sealed processing chamber 6 and is supplied into the molecular beam source crucible 1 without coming into contact with the atmosphere, so that the following effects can be achieved. There is.

(I)ベルジャ12内に大気が導入されることはなく、
従って該ベルジャ12内の構成部材が汚染されるのを防
止でき、エピタキシャル膜の結晶性。
(I) No atmosphere is introduced into Belljar 12,
Therefore, the components inside the bell jar 12 can be prevented from being contaminated, and the crystallinity of the epitaxial film can be improved.

再現性に悪影響を及ぼすことはない。There is no negative effect on reproducibility.

(n)結晶成長の再開までに必要な準備工程を大幅に削
減でき、生産能率を向上できる。
(n) The preparation steps required before restarting crystal growth can be significantly reduced, and production efficiency can be improved.

(III)分子線源材料が大気汚染されることはなく、
またベルジャ12内で熱処理する必要もなく、従って汚
染物質がベルジャ12内に持ち込まれたり、不純物ガス
が該ベルジャ12内に放出されたりすることはないので
、エピタキシャル膜の結晶性の低下1表面欠陥の発生を
防止できる。
(III) The molecular beam source material is not contaminated with the atmosphere,
Furthermore, there is no need for heat treatment within the bell jar 12, and therefore, contaminants are not brought into the bell jar 12 and impurity gases are not released into the bell jar 12. can be prevented from occurring.

なお、上記実施例では■族元素を例にとって説明したが
、本発明は上記■族元素に限らずすべての元素を使用で
き、■族以外の分子線源材料は分子線源るつぼ1内で溶
融することなく固体のまま充填されることとなる。
Although the above embodiments have been explained by taking Group (2) elements as an example, the present invention is not limited to the Group (2) elements, but all elements can be used. It will be filled as a solid without any oxidation.

また、上記実施例では水素雰囲気中で熱処理したが、水
素処理を必要としない分子線源材料、例えばAs、P等
においては、分子線源処理室16で真空加熱により高純
度化すればよく、またその処理温度は分子線源材料の酸
化物を蒸発できる温度に設定すればよい。
Further, in the above embodiment, heat treatment was performed in a hydrogen atmosphere, but molecular beam source materials that do not require hydrogen treatment, such as As and P, may be highly purified by vacuum heating in the molecular beam source processing chamber 16. Further, the processing temperature may be set to a temperature at which the oxide of the molecular beam source material can be evaporated.

また、予め高純度化された分子線源材料を分子線源処理
室16中の処理用るつぼ15に充填する場合には、分子
線源充填後、分子線源処理室16を所定の真空度に排気
後、熱処理することなく直ちに分子線源るつぼ1に導入
してもよい。
In addition, when filling the processing crucible 15 in the molecular beam source processing chamber 16 with highly purified molecular beam source material in advance, the molecular beam source processing chamber 16 is brought to a predetermined degree of vacuum after filling the molecular beam source. After evacuation, it may be introduced into the molecular beam source crucible 1 immediately without heat treatment.

さらにまた、本発明の考え方は分子線エピタキシに限ら
ず、真空蒸着、電子ビーム蒸着、スパッタリング蒸着等
における蒸着源高純度化にも適用できるものである。
Furthermore, the concept of the present invention is applicable not only to molecular beam epitaxy but also to high purity vapor deposition sources in vacuum evaporation, electron beam evaporation, sputtering evaporation, and the like.

〔発明の効果〕〔Effect of the invention〕

以上のように、この発明に係る分子線エピタキシ装置に
よれば、高純度化された分子線源材料を大気にさらすこ
となく充填する分子線源処理装置を設けたので、成長室
内を大気にさらすことのないエピタキシャル成長が可能
となり、エピタキシャル成長の再現性、量産性を向上で
き、かつ高品質で表面欠陥の少ないエピタキシャル膜を
製造することができる効果がある。
As described above, according to the molecular beam epitaxy apparatus according to the present invention, since the molecular beam source processing apparatus is provided that fills highly purified molecular beam source material without exposing it to the atmosphere, the inside of the growth chamber is exposed to the atmosphere. This has the effect of making it possible to perform epitaxial growth without any problems, improving the reproducibility of epitaxial growth and mass productivity, and producing a high-quality epitaxial film with few surface defects.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明の一実施例による分子線エピタキシ装
置の断面図、第2図はその分子線源材料の分子線源るつ
ぼへの充填状態を示す図、第3図は従来の分子線エピタ
キシ装置の断面図である。 1・・・分子線源るつぼ、2・・・基板、7b・・・ゲ
ート弁(開閉M)、12・・・ベルジャ(反応室)、1
4・・・分子線源材料、15・・・処理用るつぼ、15
a・・・小孔、16・・・分子線源処理室(密閉容器)
、17・・・加熱装置、19・・・雰囲気ガス供給装置
、22・・・るつぼ挿入装置、30・・・分子線源供給
装置。
FIG. 1 is a sectional view of a molecular beam epitaxy apparatus according to an embodiment of the present invention, FIG. 2 is a diagram showing the filling state of the molecular beam source material into a molecular beam source crucible, and FIG. 3 is a diagram showing a conventional molecular beam epitaxy apparatus. FIG. 2 is a cross-sectional view of the device. DESCRIPTION OF SYMBOLS 1... Molecular beam source crucible, 2... Substrate, 7b... Gate valve (open/close M), 12... Belljar (reaction chamber), 1
4... Molecular beam source material, 15... Processing crucible, 15
a...Small hole, 16...Molecular beam source processing chamber (closed container)
, 17... Heating device, 19... Atmospheric gas supply device, 22... Crucible insertion device, 30... Molecular beam source supply device.

Claims (1)

【特許請求の範囲】[Claims] (1)反応室内で分子線源るつぼからの分子線物質を基
板上に結晶成長させる分子線エピタキシ装置において、 上記基板を上記反応室へ搬送するためのボートと、 上記反応室とゲート弁を介して接続された密閉容器、 該密閉容器内に配設され、上記分子線源材料を収容し溶
解して分子線源るつぼ内に落下させる必要のある分子線
源材料に対する小孔をその底部に有する処理用るつぼ、 上記密閉容器内に水素ガスを供給する雰囲気ガス供給装
置、 上記密閉容器内に設けられ上記処理用るつぼを加熱する
加熱装置、 上記ゲート弁を開けて上記処理用るつぼを上記分子線源
るつぼ内に挿入するるつぼ挿入装置からなり、 分子線源材料および上記反応室内を大気にさらすことな
く上記分子線源るつぼ内に供給する分子線源供給装置と
を備えたことを特徴とする分子線エピタキシ装置。
(1) In a molecular beam epitaxy device in which a molecular beam substance from a molecular beam source crucible is grown as a crystal on a substrate in a reaction chamber, a boat is provided for transporting the substrate to the reaction chamber, and a boat is connected to the reaction chamber via a gate valve. a closed container arranged in the closed container and having a small hole at its bottom for the molecular beam source material that needs to be accommodated, melted, and dropped into the molecular beam source crucible; a processing crucible; an atmospheric gas supply device for supplying hydrogen gas into the sealed container; a heating device provided in the sealed container to heat the processing crucible; opening the gate valve to transfer the processing crucible to the molecular beam; A molecule comprising a crucible insertion device inserted into a source crucible, and a molecular beam source supply device that supplies molecular beam source material and the molecular beam source into the molecular beam source crucible without exposing the inside of the reaction chamber to the atmosphere. Line epitaxy equipment.
JP2064599A 1990-03-15 1990-03-15 Device for molecular-beam epitaxy Granted JPH0350131A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2064599A JPH0350131A (en) 1990-03-15 1990-03-15 Device for molecular-beam epitaxy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2064599A JPH0350131A (en) 1990-03-15 1990-03-15 Device for molecular-beam epitaxy

Publications (2)

Publication Number Publication Date
JPH0350131A true JPH0350131A (en) 1991-03-04
JPH0525835B2 JPH0525835B2 (en) 1993-04-14

Family

ID=13262881

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2064599A Granted JPH0350131A (en) 1990-03-15 1990-03-15 Device for molecular-beam epitaxy

Country Status (1)

Country Link
JP (1) JPH0350131A (en)

Also Published As

Publication number Publication date
JPH0525835B2 (en) 1993-04-14

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