JPH0351142Y2 - - Google Patents

Info

Publication number
JPH0351142Y2
JPH0351142Y2 JP10190885U JP10190885U JPH0351142Y2 JP H0351142 Y2 JPH0351142 Y2 JP H0351142Y2 JP 10190885 U JP10190885 U JP 10190885U JP 10190885 U JP10190885 U JP 10190885U JP H0351142 Y2 JPH0351142 Y2 JP H0351142Y2
Authority
JP
Japan
Prior art keywords
polymer films
optical sensor
bonding
horn
polymer film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10190885U
Other languages
Japanese (ja)
Other versions
JPS6210656U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10190885U priority Critical patent/JPH0351142Y2/ja
Publication of JPS6210656U publication Critical patent/JPS6210656U/ja
Application granted granted Critical
Publication of JPH0351142Y2 publication Critical patent/JPH0351142Y2/ja
Expired legal-status Critical Current

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  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Description

【考案の詳細な説明】 [産業上の利用分野] 本考案は、シート状になつているビニール、ポ
リエチレン、ナイロン等の高分子フイルムを重ね
て溶着するときに用いる高分子フイルムの接合検
査装置に関するもので、とりわけシールド工法の
不透水膜被覆工法にとつて有用なものである。
[Detailed description of the invention] [Field of industrial application] The present invention relates to a polymer film bonding inspection device used when stacking and welding sheet-like polymer films such as vinyl, polyethylene, and nylon. This is especially useful for the impermeable membrane coating method of the shield method.

[従来の技術] 製袋、梱包等においては、高分子フイルムを重
ねて超音波により溶着することが行なわれてい
る。
[Prior Art] In bag making, packaging, etc., polymer films are stacked and welded using ultrasonic waves.

このような高分子フイルムの溶着では、高分子
フイルムの材質や厚さが決ると、高分子フイルム
はそれに応じた一定速度で送りながら超音波で溶
着するようになつており、従来の装置において
は、高分子フイルムの接合状態を検査する装置は
開発されていなかつた。
In this type of welding of polymer films, once the material and thickness of the polymer film is determined, the polymer film is welded using ultrasonic waves while being fed at a constant speed according to the material and thickness. However, no equipment for inspecting the bonding state of polymer films had been developed.

[考案が解決しようとする問題点] 高分子フイルムの材質や厚さに応じた一定の速
度で高分子フイルムを送りながら溶着していて
も、種々の要因で高分子フイルム溶着状態に変化
が生ずることがある。このため高分子フイルムに
は溶けて穴があいたり、十分に溶着されなかつた
り、接合の目的が達せられないことがあつた。
[Problems that the invention aims to solve] Even if the polymer film is fed and welded at a constant speed depending on the material and thickness of the polymer film, changes occur in the welded state of the polymer film due to various factors. Sometimes. As a result, the polymer film sometimes melts and has holes, is not sufficiently welded, and the purpose of joining cannot be achieved.

本考案は、高分子フイルムが適正に接合された
かどうかを検査しようとするものである。
The present invention attempts to inspect whether polymer films have been properly bonded.

[問題点を解決するための手段] 本考案の高分子フイルムの接合検査装置は、超
音波等により高分子フイルムを溶着接合させる装
置において、溶着接合部の上、下流の少なくとも
下流位置に光センサーを配置し、且つ下流の光セ
ンサーからの信号と接合前の信号とを比較する比
較装置を備えた構成としている。
[Means for Solving the Problems] The polymer film bonding inspection device of the present invention is an apparatus for welding and bonding polymer films using ultrasonic waves, etc., and includes an optical sensor at least at a downstream position above and downstream of the weld bond. and a comparison device that compares the signal from the downstream optical sensor with the signal before bonding.

[作用] 従つて、下流の光センサーからの信号と接合前
の信号とが比較装置で比較され、光の透過率の差
によつて接合状態が検査される。
[Operation] Therefore, the signal from the downstream optical sensor and the signal before bonding are compared by the comparator, and the bonding state is inspected based on the difference in light transmittance.

[実施例] 以下、本考案の一実施例を図面に基づいて説明
する。
[Example] Hereinafter, an example of the present invention will be described based on the drawings.

図において、1は超音波発生器であつて、この
超音波発生器1で発生した超音波は、超音波振動
子箱3内に収められている図示しない超音波振動
子を経て、ホーン4に伝えられるようになつてい
る。尚2はホーン4のバランスウエイトである。
In the figure, 1 is an ultrasonic generator, and the ultrasonic waves generated by this ultrasonic generator 1 are transmitted to a horn 4 through an ultrasonic transducer (not shown) housed in an ultrasonic transducer box 3. It is becoming possible to convey the message. Note that 2 is a balance weight of the horn 4.

5,6は高分子フイルムであつて、繰出しロー
ラ7を経てホーン4の下を通り、送りローラ8に
よつて図の左方に送られるようになつている。ホ
ーン4はスプリング9によつて下方へ押圧されて
おり、下方に設けられている受台10との間で高
分子フイルム5,6を押し付け、高分子フイルム
5,6を超音波によつて溶着するようになつてい
る。
Reference numerals 5 and 6 are polymer films, which pass through a feed roller 7, under a horn 4, and are fed to the left in the figure by a feed roller 8. The horn 4 is pressed downward by a spring 9, and the polymer films 5 and 6 are pressed against a pedestal 10 provided below, and the polymer films 5 and 6 are welded together by ultrasonic waves. I'm starting to do that.

斯かる接合装置において、溶着接合部、即ちホ
ーン4及び受台10の部分の上、下流位置に、高
分子フイルム5,6を挟むよう投光器11と受光
器12とから成る光センサー13a,13bを配
置し、且つ該光センサー13a,13bからの信
号を比較する比較増幅器14を設ける。
In such a joining device, optical sensors 13a and 13b, each consisting of a light emitter 11 and a light receiver 12, are installed at a position above and downstream of the welded joint, that is, the horn 4 and the pedestal 10, so as to sandwich the polymer films 5 and 6. A comparator amplifier 14 is provided which is arranged and compares the signals from the optical sensors 13a, 13b.

今、繰出しローラ7,7に繰出された高分子フ
イルム5,6は送りローラ8,8によつて図の左
方へ送られながらホーン4によつて接合される。
この際、ホーン4の上、下流位置で光センサー1
3a,13bにて光を透過し、夫々の透過率を比
較増幅器14で比較する。接合前後の高分子フイ
ルム5,6には光の透過率に差が生じるので、即
ち溶着後の高分子フイルム5,6は透明度が増す
ので、透過率の差が一定以上になれば溶着された
ことが判り、一定以下ならば溶着不良だと言うこ
とが判る。溶着不良が発生したら、ホーン4の押
付け力を調整したり、超音波振動の印加量を調整
したりする制御を行う。
Now, the polymer films 5 and 6 fed out by the feeding rollers 7 and 7 are joined by the horn 4 while being sent to the left in the figure by the feeding rollers 8 and 8.
At this time, the optical sensor 1 is located above and downstream of the horn 4.
3a and 13b transmit light, and the transmittance of each is compared by a comparison amplifier 14. Since there is a difference in light transmittance between the polymer films 5 and 6 before and after bonding, that is, the transparency of the polymer films 5 and 6 increases after welding, so if the difference in transmittance exceeds a certain level, it is determined that the polymer films 5 and 6 have been welded. It can be seen that if it is below a certain level, there is poor welding. If a welding failure occurs, control is performed to adjust the pressing force of the horn 4 and the amount of ultrasonic vibration applied.

尚、前記実施例では溶着接合部の上、下流に光
センサー13a,13bを配置したが、接合前の
透過率データを予め比較増幅器14やマイコン等
に記録しておけば、上流の光センサー13aを省
略することができる。更に透過率の差をより明確
にするために、高分子フイルム5,6の接合面を
梨地にしたり、色をコーテイングしておいてもよ
い。
In the above embodiment, the optical sensors 13a and 13b were arranged above and downstream of the welded joint, but if the transmittance data before joining is recorded in advance in the comparator amplifier 14, microcomputer, etc., the upstream optical sensor 13a, can be omitted. Furthermore, in order to make the difference in transmittance more clear, the bonding surfaces of the polymer films 5 and 6 may be made matte or coated with a color.

[考案の効果] 以上説明したように、本考案の高分子フイルム
の接合検査装置は、接合前後の光の透過率の差に
よつて簡単且つ確実に高分子フイルムの接合状態
を検出することができる、と言う優れた効果を奏
し得る。
[Effects of the invention] As explained above, the polymer film bonding inspection device of the present invention can easily and reliably detect the bonding state of polymer films based on the difference in light transmittance before and after bonding. It can produce excellent effects.

【図面の簡単な説明】[Brief explanation of the drawing]

図は本考案の一実施例の側面図である。 1は超音波発生器、4はホーン、5,6は高分
子フイルム、13a,13bは光センサー、14
は比較増幅器を示す。
The figure is a side view of one embodiment of the present invention. 1 is an ultrasonic generator, 4 is a horn, 5 and 6 are polymer films, 13a and 13b are optical sensors, 14
indicates a comparison amplifier.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 超音波等により高分子フイルムを溶着接合する
接合装置において、溶着接合部の下流位置に光セ
ンサーを配置し、且つ該光センサーからの信号と
接合前の信号とを比較する比較装置を備えたこと
を特徴とする高分子フイルムの接合検査装置。
A joining device that welds and joins polymer films using ultrasonic waves, etc., which has an optical sensor located downstream of the welded joint, and is equipped with a comparison device that compares the signal from the optical sensor with the signal before joining. A polymer film bonding inspection device featuring:
JP10190885U 1985-07-04 1985-07-04 Expired JPH0351142Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10190885U JPH0351142Y2 (en) 1985-07-04 1985-07-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10190885U JPH0351142Y2 (en) 1985-07-04 1985-07-04

Publications (2)

Publication Number Publication Date
JPS6210656U JPS6210656U (en) 1987-01-22
JPH0351142Y2 true JPH0351142Y2 (en) 1991-10-31

Family

ID=30973069

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10190885U Expired JPH0351142Y2 (en) 1985-07-04 1985-07-04

Country Status (1)

Country Link
JP (1) JPH0351142Y2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5836032B2 (en) * 2011-09-22 2015-12-24 ユニ・チャーム株式会社 Inspection device and method for compressing part of laminate of absorbent article
JP2020117268A (en) * 2019-01-23 2020-08-06 株式会社ダイゾー Lid and pressurized product using the same

Also Published As

Publication number Publication date
JPS6210656U (en) 1987-01-22

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