JPH0351894U - - Google Patents
Info
- Publication number
- JPH0351894U JPH0351894U JP11453289U JP11453289U JPH0351894U JP H0351894 U JPH0351894 U JP H0351894U JP 11453289 U JP11453289 U JP 11453289U JP 11453289 U JP11453289 U JP 11453289U JP H0351894 U JPH0351894 U JP H0351894U
- Authority
- JP
- Japan
- Prior art keywords
- plate
- edge
- heat
- electrical component
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 1
- 230000005855 radiation Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例の放熱構造の断面図
、第２図は従来の放熱構造の断面図である。
１……ケース、１ａ，１ｂ……リブ、２……プ
レート、３……ネジ、４……板バネ、５……発熱
の大なる電気部品、６……耐熱性の小さな電気部
品、７……断熱板。
FIG. 1 is a sectional view of a heat radiation structure according to an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional heat radiation structure. 1... Case, 1a, 1b... Rib, 2... Plate, 3... Screw, 4... Leaf spring, 5... Electrical component that generates a lot of heat, 6... Small electrical component that is heat resistant, 7... ...Insulation board.
Claims (1)
品が実装してあり、前記プレートの一縁と反対側
の他縁付近に耐熱性の小さな電気部品が実装して
あり、前記プレートの一縁及び他縁がケースに対
向して挿入してあり、前記プレートの一縁がケー
スに固着してあり、前記プレートの他縁が弾性部
材を介して弾性的に係合させてある通信機の放熱
構造において、前記耐熱性の小さな電気部品と前
記プレートとの間に熱伝導性の低い材質からなる
断熱板が介装されていることを特徴とする通信機
の放熱構造。 An electrical component that generates a lot of heat is mounted near one edge of the plate-like plate, and a small heat-resistant electrical component is mounted near the other edge opposite to one edge of the plate. and the other edge of the plate is inserted facing the case, one edge of the plate is fixed to the case, and the other edge of the plate is elastically engaged via an elastic member. A heat dissipation structure for a communication device, characterized in that a heat insulating plate made of a material with low thermal conductivity is interposed between the electric component having low heat resistance and the plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11453289U JPH0351894U (en) | 1989-09-28 | 1989-09-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11453289U JPH0351894U (en) | 1989-09-28 | 1989-09-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0351894U true JPH0351894U (en) | 1991-05-20 |
Family
ID=31662894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11453289U Pending JPH0351894U (en) | 1989-09-28 | 1989-09-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0351894U (en) |
-
1989
- 1989-09-28 JP JP11453289U patent/JPH0351894U/ja active Pending
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