JPH0352119U - - Google Patents
Info
- Publication number
- JPH0352119U JPH0352119U JP11486089U JP11486089U JPH0352119U JP H0352119 U JPH0352119 U JP H0352119U JP 11486089 U JP11486089 U JP 11486089U JP 11486089 U JP11486089 U JP 11486089U JP H0352119 U JPH0352119 U JP H0352119U
- Authority
- JP
- Japan
- Prior art keywords
- resin molding
- molding device
- pot
- plunger
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 4
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案の実施例を示す側断面図並びに
要部拡大側断面図、第２図は本考案の前提となる
樹脂モールド装置の側断面図。
１，３……金型、２……ポツト、４……キヤビ
テイ、５……プランジヤー、５ａ……凹部、６…
…樹脂。
FIG. 1 is a side sectional view and an enlarged side sectional view of essential parts showing an embodiment of the present invention, and FIG. 2 is a side sectional view of a resin molding device that is the premise of the present invention. 1, 3... Mold, 2... Pot, 4... Cavity, 5... Plunger, 5a... Recess, 6...
…resin.
Claims (1)
の連通するキヤビテイを形成した上・下一対の金
型と、上記ポツトに嵌合するプランジヤーを有す
る樹脂モールド装置において、上記プランジヤー
周面に摩耗限界を識別する凹部を形成したことを
特徴とする樹脂モールド装置。 In a resin molding device, the resin molding device has a pair of upper and lower molds in which a pot passes through one mold and a cavity is formed on the abutting surface with which the pot communicates, and a plunger that fits into the pot. A resin molding device characterized in that a concave portion is formed to identify a wear limit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11486089U JPH0739615Y2 (en) | 1989-09-29 | 1989-09-29 | Resin molding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11486089U JPH0739615Y2 (en) | 1989-09-29 | 1989-09-29 | Resin molding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0352119U true JPH0352119U (en) | 1991-05-21 |
| JPH0739615Y2 JPH0739615Y2 (en) | 1995-09-13 |
Family
ID=31663208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11486089U Expired - Lifetime JPH0739615Y2 (en) | 1989-09-29 | 1989-09-29 | Resin molding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0739615Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005263657A (en) * | 2004-03-17 | 2005-09-29 | Tokuhon Corp | Double-sided release film for patch |
-
1989
- 1989-09-29 JP JP11486089U patent/JPH0739615Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005263657A (en) * | 2004-03-17 | 2005-09-29 | Tokuhon Corp | Double-sided release film for patch |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0739615Y2 (en) | 1995-09-13 |