JPH0352152U - - Google Patents
Info
- Publication number
- JPH0352152U JPH0352152U JP11395389U JP11395389U JPH0352152U JP H0352152 U JPH0352152 U JP H0352152U JP 11395389 U JP11395389 U JP 11395389U JP 11395389 U JP11395389 U JP 11395389U JP H0352152 U JPH0352152 U JP H0352152U
- Authority
- JP
- Japan
- Prior art keywords
- region
- heat dissipating
- dissipating member
- thermal head
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electronic Switches (AREA)
Description
第1図は本考案の第一の実施例のサーマルヘツ
ド11の一部断面を示す斜視図、第2図は第1図
の切断面線−から見た断面図、第3図はサー
マルヘツド11の平面図、第4図は第3図の切断
面線−から見た断面図、第5図は粘着テープ
44の断面図、第6図は本考案の第2の実施例の
サーマルヘツド11aの断面図、第7図は本考案
の第3の実施例のサーマルヘツド11bの断面図
、第8図は典型的な従来例のサーマルヘツド1a
の断面図、第9図は第2の従来例のサーマルヘツ
ド1aの断面図、第10図は第3の従来例のサー
マルヘツド1bの断面図である。
11,11a,11b……サーマルヘツド、1
2……耐熱性基板、17……発熱素子、22……
放熱板、23……第1領域、24……放熱コンパ
ウンド、25……第2領域、26,27……長溝
、28,29,39,42……粘着剤、41……
支持部、43……支持突部。
1 is a perspective view showing a partial cross section of a thermal head 11 according to a first embodiment of the present invention, FIG. 2 is a sectional view taken along the cutting plane line - in FIG. 1, and FIG. 4 is a sectional view taken from the cutting plane line - in FIG. 3, FIG. 5 is a sectional view of the adhesive tape 44, and FIG. 7 is a sectional view of a thermal head 11b according to a third embodiment of the present invention, and FIG. 8 is a sectional view of a typical conventional thermal head 1a.
9 is a sectional view of a second conventional thermal head 1a, and FIG. 10 is a sectional view of a third conventional thermal head 1b. 11, 11a, 11b...Thermal head, 1
2...Heat-resistant substrate, 17...Heating element, 22...
Heat dissipation plate, 23...first region, 24...heat dissipation compound, 25...second region, 26, 27...long groove, 28, 29, 39, 42...adhesive, 41...
Support part, 43...Support protrusion.
Claims (1)
基板と、該耐熱性基板には上記発熱素子が設置さ
れた裏面を含む第1領域ならびに該第1領域以外
の領域である第2領域を有し、かつ該第2領域と
の間に溝部が形成された放熱部材から成るサーマ
ルヘツドであつて、 第1領域と放熱部材との間に熱伝導性に優れた
放熱コンパウンドもしくはゴム弾性を有する放熱
用接着剤を介在せしめ、かつ第2領域と放熱部材
との間に粘着剤を介在せしめたことを特徴とする
サーマルヘツド。[Claims for Utility Model Registration] A heat-resistant substrate on which a plurality of heating elements are arranged on one principal surface, a first region of the heat-resistant substrate including a back surface on which the heating elements are installed, and the first region. A thermal head comprising a heat dissipating member having a second region other than the heat dissipating member and having a groove formed between the second region and the heat dissipating member. A thermal head characterized in that a heat dissipating adhesive having excellent heat dissipating compound or rubber elasticity is interposed, and an adhesive is interposed between the second region and the heat dissipating member.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989113953U JP2523268Y2 (en) | 1989-09-27 | 1989-09-27 | Thermal head |
| US07/589,392 US5285216A (en) | 1989-09-27 | 1990-09-26 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989113953U JP2523268Y2 (en) | 1989-09-27 | 1989-09-27 | Thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0352152U true JPH0352152U (en) | 1991-05-21 |
| JP2523268Y2 JP2523268Y2 (en) | 1997-01-22 |
Family
ID=31662345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989113953U Expired - Lifetime JP2523268Y2 (en) | 1989-09-27 | 1989-09-27 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2523268Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08243513A (en) * | 1995-03-15 | 1996-09-24 | Nec Kyushu Ltd | Electronic parts washer and method thereof |
-
1989
- 1989-09-27 JP JP1989113953U patent/JP2523268Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08243513A (en) * | 1995-03-15 | 1996-09-24 | Nec Kyushu Ltd | Electronic parts washer and method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2523268Y2 (en) | 1997-01-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0352152U (en) | ||
| JPH0471255U (en) | ||
| JPH0422243U (en) | ||
| JPH0611794Y2 (en) | Thermal print head | |
| JPH0422245U (en) | ||
| JPS6441145U (en) | ||
| JPS60194533U (en) | thermal head | |
| JPH0539891Y2 (en) | ||
| JPS5959343U (en) | thermal head | |
| JPH0458348U (en) | ||
| JPS61188839U (en) | ||
| JPS61121756U (en) | ||
| JPH022815U (en) | ||
| JPS6092845U (en) | Heatsink for semiconductors | |
| JPS605840U (en) | thermal printing head | |
| JPH0299647U (en) | ||
| JPS59146138U (en) | thermal printing head | |
| JPS587088U (en) | radiator | |
| JPS5999742U (en) | Heat sink structure for thermal recording head | |
| JPS63106645U (en) | ||
| JPH0164445U (en) | ||
| JPH02142036U (en) | ||
| JPS6212956U (en) | ||
| JPS61121384U (en) | ||
| JPH01127841U (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |