JPH0353403U - - Google Patents
Info
- Publication number
- JPH0353403U JPH0353403U JP11214689U JP11214689U JPH0353403U JP H0353403 U JPH0353403 U JP H0353403U JP 11214689 U JP11214689 U JP 11214689U JP 11214689 U JP11214689 U JP 11214689U JP H0353403 U JPH0353403 U JP H0353403U
- Authority
- JP
- Japan
- Prior art keywords
- embossed tape
- tape
- embossed
- sprocket
- rows
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Advancing Webs (AREA)
Description
第１図は本考案の実施例１を示す構成図、第２
図は本考案のエンボステープガイドを示す斜視図
、第３図は本考案の実施例１における回転ドラム
を示す断面図、第４図は本考案の実施例２を示す
構成図、第５図は従来のテーピング装置を示す構
成図、第６図はエンボステープを示す斜視図、第
７図は従来のテーピング装置における回転ドラム
を示す断面図である。
１……供給リール、２……エンボステープ、３
……テンシヨンローラ、４……搬送ガイド、５…
…スプロケツトピン、６……引張用回転ドラム、
７……挿入用回転ドラム、８……収納リール、９
……テーピングノズル、１０……半導体素子、１
１……カバーテープリール、１２……カバーテー
プ、１３……ヒータごて、１４……エンボステー
プガイド、１５……スプロケツト孔、１６……溝
、１７……押さえローラ、１８……小型スプロケ
ツトドラム、１９……ポケツト。
Fig. 1 is a configuration diagram showing the first embodiment of the present invention;
Figure 3 is a perspective view showing the embossed tape guide of the present invention, Figure 3 is a sectional view showing the rotating drum in Embodiment 1 of the invention, Figure 4 is a configuration diagram showing Embodiment 2 of the invention, and Figure 5 is FIG. 6 is a perspective view showing an embossed tape, and FIG. 7 is a sectional view showing a rotating drum in the conventional taping device. 1... Supply reel, 2... Embossed tape, 3
...Tension roller, 4...Conveyance guide, 5...
...Sprocket pin, 6...Rotating drum for tension,
7... Rotating drum for insertion, 8... Storage reel, 9
... Taping nozzle, 10 ... Semiconductor element, 1
1... Cover tape reel, 12... Cover tape, 13... Heater iron, 14... Embossed tape guide, 15... Sprocket hole, 16... Groove, 17... Holding roller, 18... Small sprocket Drum, 19...pocket.
Claims (1)
トに投入された半導体素子を覆つてテーピングを
行うテーピング装置において、 前記エンボステープの搬送路に沿つて設置され
、前記ポケツトを受け入れてエンボステープの下
面を支えるエンボステープガイドと、 前記エンボステープの片側に予め開口された一
列のスプロケツト孔列と前記エンボステープガイ
ドの両側に開口された２列のスプロケツト孔列に
一方を共用してそれぞれの列のスプロケツト孔に
順次係合させる２列のスプロケツトピン列を備え
、ピン列の転回送りにより前記エンボステープの
送り方向、ポケツト間のピツチを一定に規制する
とともにエンボステープガイドをエンボステープ
の送り方向に向けて駆動するスプロケツト機構と
を有することを特徴とするテーピング装置。[Claims for Utility Model Registration] A taping device that tapes an embossed tape so as to cover a semiconductor device inserted into a pocket of the tape while conveying the tape, which is installed along a conveyance path of the embossed tape and receives the pocket. an embossed tape guide that supports the lower surface of the embossed tape; one row of sprocket holes opened in advance on one side of the embossed tape and two rows of sprocket holes opened on both sides of the embossed tape guide; It is equipped with two rows of sprocket pins that are sequentially engaged with the sprocket holes of each row, and by rotating and feeding the pin rows, the feeding direction of the embossed tape and the pitch between pockets are regulated to a constant value, and the embossed tape guide is connected to the embossed tape. A taping device characterized by having a sprocket mechanism that is driven in the feeding direction of the taping device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11214689U JPH0353403U (en) | 1989-09-26 | 1989-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11214689U JPH0353403U (en) | 1989-09-26 | 1989-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0353403U true JPH0353403U (en) | 1991-05-23 |
Family
ID=31660597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11214689U Pending JPH0353403U (en) | 1989-09-26 | 1989-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0353403U (en) |
-
1989
- 1989-09-26 JP JP11214689U patent/JPH0353403U/ja active Pending
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