JPH0353584A - Laminated printed wiring board provided with full solid-state secondary cell - Google Patents
Laminated printed wiring board provided with full solid-state secondary cellInfo
- Publication number
- JPH0353584A JPH0353584A JP1189427A JP18942789A JPH0353584A JP H0353584 A JPH0353584 A JP H0353584A JP 1189427 A JP1189427 A JP 1189427A JP 18942789 A JP18942789 A JP 18942789A JP H0353584 A JPH0353584 A JP H0353584A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- paste
- laminated
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Secondary Cells (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は全固体二次電池付積層プリント配線板に関し、
特に全固体二次電池を積層具備するプリント配線板に関
する．
〔従来の技術〕
最近のマイクロエレクトロニクス化の進展は著しく、電
池についても小型・薄型・軽量・回路との一体化などが
要求されている．これらの要求に応えるものとして、従
来は小型化リチウム電池をプリント配線板に実装する、
等の方法が考えられている．
〔発明が解決しようとする課題〕
上述した従来の液体電解質使用電池では電解液を含浸・
保持したり、電極間にセパレーターが必要で、小型・薄
型化に限界があった．また液漏れ等信頼性にも問題があ
り、素子・回路との一体化は困難であった．
本発明の目的は、小型薄型化が達戒でき、しがち液漏れ
などがなく、信頼性が優れ、配線板と一体化された全固
体二次電池付積層プリント配線板を提供することにある
。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a laminated printed wiring board with an all-solid-state secondary battery,
In particular, it relates to printed wiring boards equipped with stacked all-solid-state secondary batteries. [Prior Art] Recent advances in microelectronics have been remarkable, and batteries are required to be smaller, thinner, lighter, and more integrated with circuits. In order to meet these demands, conventional methods have been to mount miniaturized lithium batteries on printed wiring boards.
Other methods are being considered. [Problems to be solved by the invention] In the conventional liquid electrolyte-using batteries described above, the electrolyte is impregnated and
This required a separator between the electrodes, which limited the ability to make them smaller and thinner. There were also reliability problems such as liquid leakage, and integration with elements and circuits was difficult. An object of the present invention is to provide a laminated printed wiring board with an all-solid-state secondary battery that can be made smaller and thinner, has no tendency to leak liquid, has excellent reliability, and is integrated with the wiring board. .
本発明の全固体二次電池付プリント配線板は、銅張積層
基板の内部に少なくとも１組の全固体二次電池の層が形
成されていることを特徴として構成される．
〔実施例〕
次に、本発明について図面を参照して説明する．第１図
は本発明の一実施例、及び他の実施例の説明用の模式的
平面図であり、第２図は第１の実施例に関する第１図の
直線Ｘ−Ｙにおける縦断面図である。第１図および第２
図により説明すると、銅張積層板を用いてエッチングに
より銅箔電極２．６を形成し、非スルーホール貫通六を
設け、片面を銅板電極７で閉じその上（大内）に電池負
極材料である銅粉に導電性有機高分子を混合したペース
ト５，固体電解質、例えばＲｂ４Ｃ ｕ １６Ｉ ６．
７５Ｃ Ｉ １３．２５をベースにしたペースト６，正
極材料であるＶｌａ属遷移金属とバナジウムの複合酸化
物をベースにしたペースト３を順次積層し、その上を銅
板電極１でふざぐことにより、１組の全固体電池の層を
有する全固体二次電池付積層プリント配線板を形成する
ことができる。The printed wiring board with an all-solid-state secondary battery of the present invention is characterized in that at least one set of all-solid-state secondary battery layers is formed inside a copper-clad laminate board. [Example] Next, the present invention will be explained with reference to the drawings. FIG. 1 is a schematic plan view for explaining one embodiment of the present invention and other embodiments, and FIG. 2 is a longitudinal sectional view taken along the line X-Y in FIG. 1 regarding the first embodiment. be. Figures 1 and 2
To explain with a diagram, a copper foil electrode 2.6 is formed by etching using a copper-clad laminate, a non-through-hole penetration hole 6 is provided, one side is closed with a copper plate electrode 7, and on top of that (Ouchi) a battery negative electrode material is formed. A paste made by mixing a certain copper powder with a conductive organic polymer 5, a solid electrolyte such as Rb4C u 16I 6.
By sequentially laminating a paste 6 based on 75C I 13.25 and a paste 3 based on a composite oxide of Vla group transition metal and vanadium, which is a positive electrode material, and covering the top with a copper plate electrode 1, A laminated printed wiring board with an all-solid-state secondary battery having a set of all-solid-state battery layers can be formed.
第３図は本発明の他の実施例の縦断面図である。FIG. 3 is a longitudinal sectional view of another embodiment of the invention.
第１の実施例と同様に正極材料ペースト３までを積層し
た後、更にもう一組負極ペースト５、固体電解質ペース
ト４、正極ペースト３を積層し、その上を銅板電極１で
ふさぐことにより２組の全固体二次電池の積層されたプ
リント配線板を形或する。この実施例では電池を２組直
列に接続することにより第１の実施例の際の２倍の起電
力を得られる利点がある。更に各ペーストを薄く積層す
ることにより高い必要な起電力を得ることが可能である
。After laminating up to the positive electrode material paste 3 in the same manner as in the first embodiment, another set of negative electrode paste 5, solid electrolyte paste 4, and positive electrode paste 3 is laminated, and the top is covered with the copper plate electrode 1 to form two sets. A laminated printed wiring board of an all-solid-state secondary battery is formed. This embodiment has the advantage that twice the electromotive force as in the first embodiment can be obtained by connecting two sets of batteries in series. Furthermore, by laminating each paste thinly, it is possible to obtain a high required electromotive force.
以上説明したように、本発明はプリント配線板内部に全
固体二次電池を積層一体化することにより、メモリーバ
ックアップ（記憶保持〉電源に代表される電池の機器内
収容、素子・回路との一体化に伴う信頼性の向上、機器
の軽薄短小化等の要求に応え得るものとして効果がある
。As explained above, the present invention integrates an all-solid-state secondary battery in a stacked manner inside a printed wiring board, thereby making it possible to house batteries in devices such as memory backup (memory retention) power supplies, and integrate them with elements and circuits. It is effective in meeting the demands for improved reliability and miniaturization of equipment as the technology advances.
第１図は本発明の一実施例、及び他の実施例の説明用の
模式的平面図、第２図は第１の実施例に関する第１図の
Ｘ−Ｙ線断面図、第３図は第２の実施例に関する第１図
のＸ−Ｙ線断面図である。
１・・・正極側銅板電極、２・・・正極側銅箔電極部、
３・・・正極材料ペースト（ （ＷＶ２） ２０，，等
）、４・・・固体電解質ペースト（Ｒｂ４ Ｃｕｓ６Ｉ
６フｓＣ ｔ１１３．２５等）、５・・・負極材料量ペ
ースト（Ｃｕ〉、６・・・負極側銅箔電極部、７・・・
負極側銅板電極、８・・・ガラスエボキシ板．′FIG. 1 is a schematic plan view for explaining one embodiment of the present invention and other embodiments, FIG. 2 is a sectional view taken along the line X-Y of FIG. 1 regarding the first embodiment, and FIG. FIG. 2 is a sectional view taken along the line X-Y in FIG. 1 regarding the second embodiment. 1... Positive electrode side copper plate electrode, 2... Positive electrode side copper foil electrode part,
3... Positive electrode material paste ((WV2) 20,, etc.), 4... Solid electrolyte paste (Rb4 Cus6I
6 FsC t113.25 etc.), 5... Negative electrode material amount paste (Cu>, 6... Negative electrode side copper foil electrode part, 7...
Negative side copper plate electrode, 8... glass epoxy plate. ′
Claims (1)
の層が形成されていることを特徴とする全固体二次電池
付積層プリント配線板。A laminated printed wiring board with an all-solid-state secondary battery, characterized in that at least one set of all-solid-state secondary battery layers is formed inside a copper-clad laminated board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1189427A JPH0353584A (en) | 1989-07-21 | 1989-07-21 | Laminated printed wiring board provided with full solid-state secondary cell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1189427A JPH0353584A (en) | 1989-07-21 | 1989-07-21 | Laminated printed wiring board provided with full solid-state secondary cell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0353584A true JPH0353584A (en) | 1991-03-07 |
Family
ID=16241069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1189427A Pending JPH0353584A (en) | 1989-07-21 | 1989-07-21 | Laminated printed wiring board provided with full solid-state secondary cell |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0353584A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63260116A (en) * | 1987-04-17 | 1988-10-27 | Toshiba Corp | Magnetic shield of magnetic resonance imaging apparatus |
| WO1992019090A1 (en) * | 1991-04-16 | 1992-10-29 | Dowty Electronic Components Ltd. | Electrical power supply |
| JP2006288489A (en) * | 2005-04-06 | 2006-10-26 | Sammy Networks Co Ltd | Network game system |
-
1989
- 1989-07-21 JP JP1189427A patent/JPH0353584A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63260116A (en) * | 1987-04-17 | 1988-10-27 | Toshiba Corp | Magnetic shield of magnetic resonance imaging apparatus |
| WO1992019090A1 (en) * | 1991-04-16 | 1992-10-29 | Dowty Electronic Components Ltd. | Electrical power supply |
| GB2255450A (en) * | 1991-04-16 | 1992-11-04 | Dowty Electronic Components | Electrical power supply |
| JP2006288489A (en) * | 2005-04-06 | 2006-10-26 | Sammy Networks Co Ltd | Network game system |
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