JPH0354894A - Cooling structure for power source - Google Patents

Abstract

PURPOSE:To improve cooling function and to omit a heat sink by providing metal cold plates having a flat surface in contact with the heat transfer face of a power source component and a refrigerant passage, a refrigerant circulation hole between the plates, and further a refrigerant storage tank. CONSTITUTION:Metal cold plates 4, 6 are brought at flat faces into contact with heat transfer faces of a main switching transistor 2, a rectifying diode B of a high heat source, and refrigerant is circulated through a hose 13 therein. A tank 12 for the refrigerant discharged from the plates is provided on the way of the hose. According to the structure, in order to cool a DC/DC converter power source, a heat sink is omitted to obtain a cooling structure reducing the power source in size.

Description

[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to a cooling fan for a power source used in an electronic computer, and particularly relates to a direct heat transfer type power source that is cooled by flowing a refrigerant such as water. Regarding cooling structure. [Prior Art] Conventionally, the general method for cooling power supplies used in electronic computers has been to perform forced air cooling using a fan provided at the bottom of the power supply. However, as electronic circuits have become more highly integrated in recent years, the amount of power consumed has increased, and as a result, t-sources with large capacity and small size have become necessary. However, with forced air cooling, the heat sink becomes large, making it impossible to achieve a compact design, and if the air volume of the fan is increased, noise regulations cannot be met, so a soundproof structure had to be provided.

For this reason, a 1-ton forced air cooling system was required. Conventionally, this type of cooling structure has D as shown in 3rd [2I].
The C-DC converter module has various electronic elements mounted on one side of the heavy source circuit board l. In this lightning element, the secondary rectifying diode 8 and the main switching transistor 2 are provided with a heat sink 11 made of a material such as aluminum with excellent conductivity. ．． 12 are installed. A fan provided at the bottom of the module blows air to the heat sinks 11 and 12 for forced air cooling.

The larger the capacity of the power supply, the larger the forced air cooling fan with a larger air volume, and the larger the heat sinks 11 and 12 in the DC-DC converter module became. [Problems to be Solved by the Invention] The above-mentioned fS conventional cold 1g structure has the disadvantage that when the capacity of the DC-DC converter module is increased, the secondary rectifier diode 8, which is a high heat source, and the heater 1 of the main switching 1 to transistor 2 are - The sinks 11 and 12 are also large, and there is no hope of downsizing. In addition, the forced air cooling fan installed at the bottom of the DC-DC converter module has to have a large amount of air and a large air velocity, which has the disadvantage of increasing the noise level. Therefore, in order to reduce the noise, the exhaust area of a single casing is equipped with a soundproof WI structure, which has the drawback that the casing becomes larger.

[Means for Solving the Problems] The purpose of the present invention is to solve the above-mentioned problems of the conventional technology, to dramatically improve the cooling function, thereby eliminating the need for a large heat sink, and reducing the overall cost even in a large-capacity DC/DC converter module. It is an object of the present invention to provide a side cooling system for a power source whose size can be reduced.

The present invention provides a cooling structure for a power supply of a DC-DC converter in a multi-converter power supply system in which a groove is formed between a bulk rectifier section of an electronic computer, a DC/DC converter, and a power supply control circuit section. a pair of cold plates made of metal with excellent thermal conductivity, each having a flat surface in contact with the secondary M-flow diode of the module and the contact surface of the main switching transistor, and having a flow path for passing a coolant therein; and a hose for circulating refrigerant through a pair of cold plates.4 In a preferred embodiment of the present invention, a tank for storing refrigerant to be flooded to the cold plates and a hose for circulating the refrigerant from the cold plates are provided. A tank is installed in the middle of each hose to store the discharged refrigerant. [Example] Hereinafter, the cooling structure of the power supply of the present invention will be explained in detail using the drawings. FIGS. 1(a) and 1(b) are a front view and a sectional view taken along line AA of a first embodiment of a cooling structure for a power supply according to the present invention. Screw 7, which is a source of high heat in the DC-DC converter
The main switching transistor 2 mounted on the source circuit board 1 is mounted on the cold plate 4 by one inch with a screw 5 via an insulator 53. DC-D
A cold plate 6 is installed on the heat transfer surface 9 of the secondary rectifier diode 8, which is another high heat source in the C converter.
is attached with screw 10. A hose 13 connects the cold plates 4 and 6 to a tank 11 that branches and supplies refrigerant to them, and the cold plates 4 and 6 and a tank 12 that collects and discharges refrigerant from them. By using the tanks 1 and 12, it is possible to supply well-cooled refrigerant of the same temperature to the main switching transistor 2 and the secondary scavenging diode 8, so that uniform cooling can be achieved. Although it is desirable that the hose 13 be flexible, there are no limitations on the material. The method of connecting the main switching transistor 2 and the secondary rectifier diode 8 is preferably one with low thermal resistance, and is not particularly limited to screw fastening. It is preferable to select fine ceramics, which has a large resistance to heat and maintains high electrical insulation properties even at high temperatures. The cold plates 4 and 6 are made of a metal material such as brass with excellent thermal conductivity, and are provided with a flow path 14 through which a coolant such as water flows. These cold plates 4 and 6 cool the heat transfer surface of the secondary rectifier diode 8 and the heat transfer insulating plate 3 of the main switching transistor 2, respectively.
It has a structure that cools the secondary rectifier diode 8 and the main switching transistor 2. FIGS. 2(a) and 2(b) are a front view and a cross-sectional view taken along the line BB of a second embodiment of the cooling structure for a power supply according to the present invention.

In this embodiment, the tank 1l and tank 12 of the first embodiment are
or omitted. [Effects of the Invention] As explained above, the present invention provides a DC-DC converter module in which the main switching transistor 1, which is a high heat source, and the secondary rectifier diode are connected to the main switching transistor 1, which is a high heat source, and the secondary rectifier diode using a refrigerant such as water via a cold plate. Since it cools by 177 heat transfer, the cooling function can be dramatically improved. This eliminates the need for a large heat sink and allows for large-capacity DC-D
The C converter mosule can be made smaller, and by separating the cold plate and tank, DC-DC
This provides flexibility in the implementation of the converter, and further miniaturization can be achieved. In addition, since the amount of growth excluding the main switching transistor and secondary rectifier 1z in the DC-DC converter module is small, the forced air cooling fan installed at the bottom of the DC-DC converter has the effect of allowing you to select a low-noise fan with a small air volume. be.

[Brief explanation of drawings]

FIGS. 1(a) and 1(b) are a front view and a sectional view taken along line AA of a first embodiment of a cooling structure for a power supply according to the present invention. FIGS. 2(a) and 2(b) are a front view and a sectional view taken along the line BB of a second embodiment of the cooling structure for a power source according to the present invention. FIG. 3 is a plan view of a conventional forced air cooling type DC-DC converter module. 1... Power supply circuit board 2... Main switching transistor 3... Insulating plate 4... Cold plate 5... Screw
6...Cold plate 7...Screw
8... Secondary rectifier diode 9... Heat transfer surface of secondary rectifier diode 1 0... Screw 1 l... Tank 1 2 - Tank 1 3... Hose 1 4... Channel

Claims (2)

[Claims] (1) In a cooling structure for a power supply of a DC-DC converter in a multi-converter power supply system consisting of a bulk rectifier section of an electronic computer, a DC-DC converter, and a power supply control circuit section, a pair of cold plates made of metal with excellent thermal conductivity, each having a plane in contact with the heat transfer surface of the secondary rectifier diode and the main switching transistor, and having a flow path for passing a coolant therein; A cooling structure for a power source, comprising: a hose that circulates a refrigerant through a cold plate; (2) In the power supply cooling structure according to claim 1, a tank for storing refrigerant to be supplied to the cold plate and a tank for storing refrigerant discharged from the cold plate are provided in the middle of the hose, respectively. cooling structure for the power supply.