JPH0355577U

JPH0355577U -

Info

Publication number: JPH0355577U
Application number: JP11597389U
Authority: JP
Priority date: 1989-10-02
Filing date: 1989-10-02
Publication date: 1991-05-29

Description

[Brief explanation of drawings]

第１図は本考案の実施例を示す平面図、第２図
は同正面図、第３図は同側面図、第４図は第２図
の−線に沿つた断面図、第５図は第２図の
−線図に沿つた断面図、第６図は収納ケースに
収納されたＳＯＪ型のＩＣパツケージの断面図、
第７図は本考案の実施例の使用状態を示す図、第
８図はソケツトに装着されたＩＣパツケージの斜
視図、及び第９図はソケツトに装着されたＩＣパ
ツケージの断面図である。１……ＩＣパツケージ本体、２……Ｊ型リード
端子、３……ソケツト、５……プリント基板、７
……下レールガイド、８……支持体、１１……間
隙、１２……上レールガイド、１３……空間、３
１……収納ケース。 Fig. 1 is a plan view showing an embodiment of the present invention, Fig. 2 is a front view thereof, Fig. 3 is a side view thereof, Fig. 4 is a sectional view taken along the - line of Fig. 2, and Fig. 5 is a A sectional view taken along the - line diagram in Fig. 2, and Fig. 6 a sectional view of an SOJ type IC package housed in a storage case.
FIG. 7 is a diagram showing the usage state of the embodiment of the present invention, FIG. 8 is a perspective view of the IC package installed in the socket, and FIG. 9 is a sectional view of the IC package installed in the socket. 1...IC package body, 2...J type lead terminal, 3...Socket, 5...Printed circuit board, 7
...Lower rail guide, 8...Support, 11...Gap, 12...Upper rail guide, 13...Space, 3
1...Storage case.

Claims

[Scope of utility model registration request]

An IC package extraction device for extracting an SOJ type IC package mounted in the socket, the device comprising a support body, provided at one end of the support body, and connecting the bottom of the groove of the socket and the A wedge-shaped lower rail guide to be inserted into the gap formed between the bottom surface of the IC package cage and the upper surface of the lower rail guide, and
I characterized by comprising an upper rail guide having a lower surface that defines a space through which the C package passes and guides the IC package passing through.
C package extraction device.