JPH0356136U - - Google Patents

Info

Publication number
JPH0356136U
JPH0356136U JP1989115968U JP11596889U JPH0356136U JP H0356136 U JPH0356136 U JP H0356136U JP 1989115968 U JP1989115968 U JP 1989115968U JP 11596889 U JP11596889 U JP 11596889U JP H0356136 U JPH0356136 U JP H0356136U
Authority
JP
Japan
Prior art keywords
mating terminal
bump electrodes
pressure contact
bump
external connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989115968U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989115968U priority Critical patent/JPH0356136U/ja
Publication of JPH0356136U publication Critical patent/JPH0356136U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01251—Changing the shapes of bumps
    • H10W72/01255—Changing the shapes of bumps by using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例によるデバイス、第
２図は本考案の他の実施例によるデバイス、第３
図は第１図に示す金バンプの形成方法の説明図、
第４図は第２図に示す金バンプの形成方法の説明
図、第５図は第１図に示すデバイスの実装状態の
模式図、第６図は転写バンプ電極を設けた従来の
デバイス、第７図は第６図に示すデバイスの実装
方法の説明図、である。 図中において、３……外部接続端子、６……相
手端子、１１，１５……デバイス、１２，１６…
…バンプ電極、１４，１９……バンプ電極の圧接
面、を示す。

Claims (1)

  1. 【実用新案登録請求の範囲】 複数の外部接続端子３のそれぞれには、圧する
    ことで相手端子６と電気的に接続されるバンプ電
    極１２，１６を設け、 少なくとも該相手端子６に圧接される該バンプ
    電極１２，１６の圧接面１４，１９が、該相手端
    子６と対向する複数個に分割して形成されたこと
    を特徴とする圧接用バンプ電極を設けたデバイス
    。
JP1989115968U 1989-10-02 1989-10-02 Pending JPH0356136U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989115968U JPH0356136U (ja) 1989-10-02 1989-10-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989115968U JPH0356136U (ja) 1989-10-02 1989-10-02

Publications (1)

Publication Number Publication Date
JPH0356136U true JPH0356136U (ja) 1991-05-30

Family

ID=31664277

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989115968U Pending JPH0356136U (ja) 1989-10-02 1989-10-02

Country Status (1)

Country Link
JP (1) JPH0356136U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004127974A (ja) * 2002-09-30 2004-04-22 Oki Electric Ind Co Ltd Ｃｏｆテープキャリア、半導体素子、半導体装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5494872A (en) * 1978-01-11 1979-07-26 Cho Lsi Gijutsu Kenkyu Kumiai Semiconductor device
JPS58175849A (ja) * 1982-04-08 1983-10-15 Agency Of Ind Science & Technol 半導体装置
JPS63289844A (ja) * 1987-05-21 1988-11-28 Fuji Electric Co Ltd 半導体装置のバンプ電極

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5494872A (en) * 1978-01-11 1979-07-26 Cho Lsi Gijutsu Kenkyu Kumiai Semiconductor device
JPS58175849A (ja) * 1982-04-08 1983-10-15 Agency Of Ind Science & Technol 半導体装置
JPS63289844A (ja) * 1987-05-21 1988-11-28 Fuji Electric Co Ltd 半導体装置のバンプ電極

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004127974A (ja) * 2002-09-30 2004-04-22 Oki Electric Ind Co Ltd Ｃｏｆテープキャリア、半導体素子、半導体装置

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