JPH035643B2 - - Google Patents

Description

[Detailed description of the invention]

INDUSTRIAL APPLICATION FIELD The present invention relates to a method for producing a thin magnetic film, and in particular to a method that makes it possible to produce a magnetic alloy film with excellent soft magnetic properties at a high sputter rate. Structure of conventional example and its problems Conventionally, a magnetron sputter method as shown in FIG. 1a has been used as a high-speed sputter method. In the figure, 1 is a substrate, 2 is a target, 3 is a magnet, and 4 is a non-magnetic material. Although this method has the advantage of a high sputter rate, when using a thick magnetic target,
It is not effective because the magnetic flux of the magnet does not leak.
In such a case, as shown in FIG. 1b, a narrow groove is formed in the target 2 to leak the magnetic flux of the magnet and improve the sputter rate. However, such methods are extremely cumbersome to carry out and are not effective, especially when the target is poorly processable. and,
Conventionally, permalloy and amorphous magnetic alloys did not have very good soft magnetic properties immediately after sputtering, and required heat treatment to improve their properties. However, it is necessary to provide a resist film that is sensitive to heat, and when using these soft magnetic alloy films in devices, it is difficult to improve the characteristics through heat treatment, so the reality is that the characteristics of the film cannot be fully utilized. It was hot. OBJECTS OF THE INVENTION It is an object of the present invention to provide a method that solves these two problems at once and makes it possible to sputter an alloy film exhibiting excellent soft magnetic properties at high speed. Structure of the Invention The present invention provides a method for producing a magnetic composite thin film using a sputtering device in which a substrate holder and a target face each other.
A magnet is placed so that the pole and south pole face each other with a certain distance apart, and the direction of the magnetic flux is approximately parallel to the in-plane direction of the target and the substrate,
By rotating this magnet during sputtering, it is possible to improve the sputtering rate and at the same time produce a thin film magnetic material having excellent soft magnetic properties. DESCRIPTION OF EMBODIMENTS An embodiment of the method of the present invention will be described with reference to FIG. Figure a is a plan view of the main part of the device, and figure b is a side sectional view. In the figure, 11 is a substrate, 12 is a magnet with N and S poles facing each other, and 13 is a support for the magnet 12, which is driven on a support 15 with a bearing 14 provided below. A mechanism 16 allows for low speed rotation. 17 is the target, 1
8 is a target electrode. As shown in FIG. 1B, the magnetic flux of the magnet 12 exits from the north pole, a portion of which enters the target 17, and a small amount of which enters the magnetic body on the sputtered substrate 11 and heads toward the south pole. At this time, the magnet 2 is rotated by the drive mechanism 6, so a rotating magnetic field is applied to the sputtered magnetic material on the substrate 1, thereby preventing magnetic anisotropy from being induced in the plane of the magnetic material film. It has come to contribute to improving the soft magnetic properties of magnetic materials. on the other hand,
As the magnet 12 rotates, the target 17
In addition to sputtering the surface uniformly, the resulting magnetic flux increases the plasma concentration during discharge, improving the sputter rate. In addition, target 1
If you want to prevent magnetic flux from entering the target 17 and further increase the sputter rate, place a magnet like magnet 3 in Figure 1a at part 18 in b in the figure to magnetically saturate the target 17. It will be more effective if you let it happen. Hereinafter, the effects of the present invention will be illustrated by specific examples. Example 1 After evacuating the inside of the vacuum container to 2×10 ^-7 Torr,
A non-quality alloy having a composition of Co ₈₅ Fe ₂ Nb ₁₃ was prepared on a sufficiently water-cooled glass substrate at an Ar gas pressure of 2×10 ^-2 Torr using a sputtering apparatus as shown in FIG. 2. For comparison, experiments were also conducted in which the magnet 2 was fixed without rotating, and in which the magnet 2 was not used. The film thickness after sputtering for 1 hour and the initial magnetic permeability μi of the alloy film at 100 KHz were measured. The results are summarized in Table 1.

[Table] As shown in the above table, it was found that the method of the present invention significantly improved the sputter rate and obtained high magnetic permeability even immediately after fabrication. On the other hand, when the magnet is fixed, the sputter rate improves, but the film thickness distribution deteriorates to some extent, and the resulting alloy film has an easy axis and a hard axis, and the μi in the easy axis direction is extremely low. It has the disadvantage of becoming. Example 2 A permalloy sputter film was formed in the same manner as in Example 1 on a substrate heated to about 300°C using an Fe-Ni alloy (permalloy) as a target. The results are shown in Table 2.

[Table] When an experiment was conducted using a magnetron type sputtering device as shown in FIG. 1a, which is commonly available on the market, results were obtained that were exactly the same as those without a magnet as shown in the table above. Effects of the Invention As is clear from the above description, the method of the present invention enables high-speed sputtering of magnetic materials, which has been difficult in the past, and is extremely effective in obtaining magnetic films exhibiting excellent soft magnetism without heat treatment. This is an effective method.

[Brief explanation of the drawing]

FIG. 1a is a side view showing the conceptual configuration of a conventional magnetron type sputtering device, FIG. 1b is a side view of the main part, and FIG. A plan view of the main part, and Figure b is a side sectional view thereof. 11...Substrate, 12...Magnet, 13...Support stand, 14...Bearing, 15...Support stand, 16
... Drive mechanism, 17 ... Target, 18 ... Target electrode.

Claims (1)

[Claims] 1. When producing a magnetic alloy film using a sputtering device in which the substrate holder and target face each other,
Magnets with N and S poles facing each other with a certain distance between the substrate holder and the target are placed next to the target and approximately perpendicular to the target surface, and the magnetic field is directed in the in-plane direction of the target at the same time. A method for producing a thin film magnetic material, characterized in that the magnet is rotated during sputtering so that the magnet is substantially parallel to the in-plane direction of the substrate attached to the substrate holder.