JPH0357463U - - Google Patents
Info
- Publication number
- JPH0357463U JPH0357463U JP9557590U JP9557590U JPH0357463U JP H0357463 U JPH0357463 U JP H0357463U JP 9557590 U JP9557590 U JP 9557590U JP 9557590 U JP9557590 U JP 9557590U JP H0357463 U JPH0357463 U JP H0357463U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- molds
- mounting plate
- water
- passageway
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims 1
Landscapes
- Molds, Cores, And Manufacturing Methods Thereof (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
第１図および第２図は従来の金型温度調節装置
のそれぞれ概略説明図、第３図は本考案に係る金
型温度調節装置の一実施例を示す要部断面図であ
る。
４６……固定ダイプレート、５０……給水通路
、５４……排水通路、５６……移動金型、５８…
…固定金型、６２……波形通水路、６４，６６…
…シール部材、６８……ノツクアウトピン、７０
……プランジヤ、７２……移動ダイプレート、８
２……移動金型、９２……波形通水路、９６……
金型取付板、９８……給水通路、１００……排水
通路。
FIGS. 1 and 2 are schematic explanatory views of a conventional mold temperature control device, and FIG. 3 is a sectional view of essential parts showing an embodiment of the mold temperature control device according to the present invention. 46...Fixed die plate, 50...Water supply passage, 54...Drainage passage, 56...Moving mold, 58...
...Fixed mold, 62...Corrugated water passage, 64, 66...
... Seal member, 68 ... Knockout pin, 70
... Plunger, 72 ... Moving die plate, 8
2...Moving mold, 92...Corrugated passageway, 96...
Mold mounting plate, 98...water supply passage, 100...drainage passage.
Claims (1)
ぞれ着脱自在に装着される一対の金型内部にそれ
ぞれ通水路を設け、これらの金型を前記各ダイプ
レートに装着することにより金型温度調節のたの
通水回路を構成してなる金型温度調節装置におい
て、 移動ダイプレートの一側面に金型取付板を設け
ると共にこの金型取付板に給水通路と排水通路と
をそれぞれ設け、該移動ダイプレートに一方の金
型を装着するに際し前記金型取付板の各通水路開
口端部と金型の通水路開口端部とをシール部材を
介して突き合わせて密着することを特徴とする金
型温度調節装置。[Scope of Claim for Utility Model Registration] A passageway is provided inside each of a pair of molds that are removably attached to a pair of die plates constituting a mold clamping device, and these molds are attached to each of the die plates. In a mold temperature control device that constitutes a water passage circuit for controlling mold temperature, a mold mounting plate is provided on one side of the movable die plate, and a water supply passage and a drainage passage are provided on this mold mounting plate. and when mounting one of the molds on the movable die plate, the opening end of each water passageway of the mold mounting plate and the opening end of the water passageway of the mold are brought into close contact with each other through a sealing member. A mold temperature control device featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990095575U JPH0527248Y2 (en) | 1990-09-13 | 1990-09-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990095575U JPH0527248Y2 (en) | 1990-09-13 | 1990-09-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0357463U true JPH0357463U (en) | 1991-06-03 |
| JPH0527248Y2 JPH0527248Y2 (en) | 1993-07-12 |
Family
ID=31644833
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990095575U Expired - Lifetime JPH0527248Y2 (en) | 1990-09-13 | 1990-09-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0527248Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5953908U (en) * | 1982-10-01 | 1984-04-09 | 東芝機械株式会社 | Mold temperature control device |
-
1990
- 1990-09-13 JP JP1990095575U patent/JPH0527248Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5953908U (en) * | 1982-10-01 | 1984-04-09 | 東芝機械株式会社 | Mold temperature control device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0527248Y2 (en) | 1993-07-12 |
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