JPH0357928U - - Google Patents
Info
- Publication number
- JPH0357928U JPH0357928U JP11898989U JP11898989U JPH0357928U JP H0357928 U JPH0357928 U JP H0357928U JP 11898989 U JP11898989 U JP 11898989U JP 11898989 U JP11898989 U JP 11898989U JP H0357928 U JPH0357928 U JP H0357928U
- Authority
- JP
- Japan
- Prior art keywords
- molten metal
- magnetic field
- atomizer
- atomizes
- permanent magnet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims 7
- 239000002923 metal particle Substances 0.000 claims 4
- 238000000151 deposition Methods 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 3
- 230000008021 deposition Effects 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- 238000005242 forging Methods 0.000 description 1
Landscapes
- Other Surface Treatments For Metallic Materials (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Description
第１図は本願第１の装置の一実施例を示す全体
説明図である。第２図は本願第２の装置の実施例
を示す全体説明図である。第３図および第４図は
本願第３の装置の一実施例を示すもので、第３図
は全体説明図、第４図はアトマイザーを部分的に
示す説明図である。第５図ａないしｃはそれぞれ
サブストレートとして回転ドラムを用いた実施例
を示す説明図である。第６図はデポジツトの加工
を鍛造機で行う場合の実施例を示す説明図である
。第７図ａ，ｂはアトマイザーの下方にスリツト
ノズルを配した実施例を示す説明図である。
図において、１はタンデイツシユ、２はタンデ
イツシユノズル、３はアトマイザー、４はサブス
トレート、５は磁場印加装置、１４は回転ローラ
である。
FIG. 1 is an overall explanatory diagram showing an embodiment of the first apparatus of the present application. FIG. 2 is an overall explanatory diagram showing an embodiment of the second apparatus of the present application. FIGS. 3 and 4 show an embodiment of the third device of the present application, with FIG. 3 being an overall explanatory view and FIG. 4 being an explanatory view partially showing an atomizer. FIGS. 5a to 5c are explanatory diagrams each showing an embodiment using a rotating drum as a substrate. FIG. 6 is an explanatory diagram showing an embodiment in which the deposit is processed by a forging machine. FIGS. 7a and 7b are explanatory diagrams showing an embodiment in which a slit nozzle is arranged below an atomizer. In the figure, 1 is a tundish, 2 is a tundish nozzle, 3 is an atomizer, 4 is a substrate, 5 is a magnetic field applying device, and 14 is a rotating roller.
Claims (1)
ツトを吹き付けることにより溶融金属を霧化させ
るアトマイザーと、霧化による金属粒子を受け板
状に堆積させるための回転式のサブストレートと
、金属粒子の堆積により形成されたデポジツトに
磁場を印加するための磁場印加装置とからなる異
方性永久磁石板の製造装置。 (2) １対の回転ロールを有し、該回転ロール間
にノズルから溶融金属流を流下させることにより
溶融金属を霧化させるアトマイザーと、霧化によ
る金属粒子を受け板状に堆積させるための回転式
のサブストレートと、金属粒子の堆積により形成
されたデポジツトに磁場を印加するための磁場印
加装置とからなる異方性永久磁石板の製造装置。 (3) ノズルから流下する溶融金属流に超音波を
集束させることにより溶融金属を霧化させるアト
マイザーと、霧化による金属粒子を受け板状に堆
積させるための回転式のサブストレートと、金属
粒子の堆積により形成されたデポジツトに磁場を
印加するための磁場印加装置とからなる異方性永
久磁石板の製造装置。[Scope of Claim for Utility Model Registration] (1) An atomizer that atomizes molten metal by spraying a gas jet onto the molten metal flow flowing down from a nozzle, and a rotary type atomizer that atomizes the molten metal and deposits them in a plate shape. An anisotropic permanent magnet plate manufacturing device comprising a substrate and a magnetic field applying device for applying a magnetic field to a deposit formed by depositing metal particles. (2) an atomizer that has a pair of rotating rolls and atomizes the molten metal by flowing a molten metal flow from a nozzle between the rotating rolls; An anisotropic permanent magnet plate manufacturing device comprising a rotating substrate and a magnetic field applying device for applying a magnetic field to a deposit formed by depositing metal particles. (3) An atomizer that atomizes the molten metal by focusing ultrasonic waves on the molten metal flow flowing down from the nozzle, a rotating substrate that receives the atomized metal particles and deposits them in a plate shape, and the metal particles. An anisotropic permanent magnet plate manufacturing apparatus comprising: a magnetic field applying device for applying a magnetic field to a deposit formed by the deposition of the anisotropic permanent magnet plate;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11898989U JPH0357928U (en) | 1989-10-11 | 1989-10-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11898989U JPH0357928U (en) | 1989-10-11 | 1989-10-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0357928U true JPH0357928U (en) | 1991-06-05 |
Family
ID=31667127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11898989U Pending JPH0357928U (en) | 1989-10-11 | 1989-10-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0357928U (en) |
-
1989
- 1989-10-11 JP JP11898989U patent/JPH0357928U/ja active Pending
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