JPH0357938U - - Google Patents
Info
- Publication number
- JPH0357938U JPH0357938U JP1989118686U JP11868689U JPH0357938U JP H0357938 U JPH0357938 U JP H0357938U JP 1989118686 U JP1989118686 U JP 1989118686U JP 11868689 U JP11868689 U JP 11868689U JP H0357938 U JPH0357938 U JP H0357938U
- Authority
- JP
- Japan
- Prior art keywords
- support
- pressure
- sensitive adhesive
- coated
- adhesive sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/241—Dispositions, e.g. layouts
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案のラベル、或いはマークの材料
の断面図で、第２図、ラベル、マークの表面を被
覆するカバーフイルムの断面図であり、第３図は
カバーフイルムで被覆した状態のの断面図を示す
。 １……支持体、２……感圧接着剤、３……剥離
材、４……印刷層、５……カバーフイルム、６…
…熱溶融型接着剤。
の断面図で、第２図、ラベル、マークの表面を被
覆するカバーフイルムの断面図であり、第３図は
カバーフイルムで被覆した状態のの断面図を示す
。 １……支持体、２……感圧接着剤、３……剥離
材、４……印刷層、５……カバーフイルム、６…
…熱溶融型接着剤。
Claims (1)
- 支持体上に積層した粘着剤層の表面を剥離材に
て被覆してなる粘着シートの該支持体又は該支持
体上に形成した印刷層の表面に熱溶融型接着剤を
塗布した弗化ビニル系フイルムの熱溶融型接着剤
面を加熱により貼付した構造の耐汚染性粘着シー
ト片。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989118686U JPH0357938U (ja) | 1989-10-09 | 1989-10-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989118686U JPH0357938U (ja) | 1989-10-09 | 1989-10-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0357938U true JPH0357938U (ja) | 1991-06-05 |
Family
ID=31666841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989118686U Pending JPH0357938U (ja) | 1989-10-09 | 1989-10-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0357938U (ja) |
-
1989
- 1989-10-09 JP JP1989118686U patent/JPH0357938U/ja active Pending