JPH0359813U - - Google Patents
Info
- Publication number
- JPH0359813U JPH0359813U JP11968489U JP11968489U JPH0359813U JP H0359813 U JPH0359813 U JP H0359813U JP 11968489 U JP11968489 U JP 11968489U JP 11968489 U JP11968489 U JP 11968489U JP H0359813 U JPH0359813 U JP H0359813U
- Authority
- JP
- Japan
- Prior art keywords
- transfer
- molded product
- mold
- cooling
- placement site
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
図面は本考案の一実施例を示すもので、第１図
は全体の概略縦断側面図、第２図は受取り装置に
成形物を載置した状態を示す側面図、第３図は同
部分斜視図である。
図面中、１……成形物、５……受取り装置（所
定載置部位）、６……位置決め部、１２……上型
（成形型）、１３……下型（成形型）、１５……
移送装置（移送手段）、１７……エアーブローノ
ズル（冷却手段）を示す。
The drawings show one embodiment of the present invention; Fig. 1 is a schematic longitudinal sectional side view of the whole, Fig. 2 is a side view showing a state in which a molded product is placed on a receiving device, and Fig. 3 is a perspective view of the same part. It is a diagram. In the drawings, 1...Molded product, 5...Receiving device (predetermined placement part), 6...Positioning part, 12...Upper mold (molding mold), 13...Lower mold (molding mold), 15...
Transfer device (transfer means), 17... shows an air blow nozzle (cooling means).
Claims (1)
形型と、この成形型から前記成形物を取出して所
定載置部位へ移送しこの載置部位に存する位置決
め部に載置する移送手段と、この移送手段による
前記成形物の移送途中で前記成形物を冷却して硬
化させる冷却手段とを具備してなる成形品取出し
装置。 A mold for forming a molded article by molding a resin, a transfer means for taking out the molded article from the mold, transferring it to a predetermined placement site, and placing it on a positioning part in this placement site, and this transfer A molded product removal device comprising a cooling means for cooling and hardening the molded product during the transfer of the molded product by the means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11968489U JPH0745299Y2 (en) | 1989-10-16 | 1989-10-16 | Molded product take-out device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11968489U JPH0745299Y2 (en) | 1989-10-16 | 1989-10-16 | Molded product take-out device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0359813U true JPH0359813U (en) | 1991-06-12 |
| JPH0745299Y2 JPH0745299Y2 (en) | 1995-10-18 |
Family
ID=31667794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11968489U Expired - Lifetime JPH0745299Y2 (en) | 1989-10-16 | 1989-10-16 | Molded product take-out device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0745299Y2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008018379A1 (en) * | 2006-08-07 | 2008-02-14 | Sumitomo Heavy Industries, Ltd. | Resin sealing apparatus |
| JP2010105326A (en) * | 2008-10-31 | 2010-05-13 | Towa Corp | Method and device for attaching/taking out substrate |
| JP2012044199A (en) * | 2011-10-04 | 2012-03-01 | Sumitomo Heavy Ind Ltd | Resin sealing device |
| JP2019029381A (en) * | 2017-07-25 | 2019-02-21 | 第一精工株式会社 | Substrate deformation prevention mechanism and substrate deformation prevention method |
-
1989
- 1989-10-16 JP JP11968489U patent/JPH0745299Y2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008018379A1 (en) * | 2006-08-07 | 2008-02-14 | Sumitomo Heavy Industries, Ltd. | Resin sealing apparatus |
| JP2010105326A (en) * | 2008-10-31 | 2010-05-13 | Towa Corp | Method and device for attaching/taking out substrate |
| JP2012044199A (en) * | 2011-10-04 | 2012-03-01 | Sumitomo Heavy Ind Ltd | Resin sealing device |
| JP2019029381A (en) * | 2017-07-25 | 2019-02-21 | 第一精工株式会社 | Substrate deformation prevention mechanism and substrate deformation prevention method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0745299Y2 (en) | 1995-10-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |