JPH0359979B2 - - Google Patents

Info

Publication number
JPH0359979B2
JPH0359979B2 JP59133565A JP13356584A JPH0359979B2 JP H0359979 B2 JPH0359979 B2 JP H0359979B2 JP 59133565 A JP59133565 A JP 59133565A JP 13356584 A JP13356584 A JP 13356584A JP H0359979 B2 JPH0359979 B2 JP H0359979B2
Authority
JP
Japan
Prior art keywords
wire
plated
drawing die
die
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59133565A
Other languages
Japanese (ja)
Other versions
JPS6112860A (en
Inventor
Shoji Shiga
Akitoshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP13356584A priority Critical patent/JPS6112860A/en
Publication of JPS6112860A publication Critical patent/JPS6112860A/en
Publication of JPH0359979B2 publication Critical patent/JPH0359979B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/14Removing excess of molten coatings; Controlling or regulating the coating thickness
    • C23C2/22Removing excess of molten coatings; Controlling or regulating the coating thickness by rubbing, e.g. using knives, e.g. rubbing solids

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating With Molten Metal (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

〔産業上の利用分野〕 本発明は溶融メツキした線材に過剰に付着した
メツキ金属を絞り取るダイスに関し、特にメツキ
層の偏肉を軽減するものである。 〔従来の技術〕 線材の溶融メツキ法は広く工業化され、電気・
電子機器やその部品のリード線、配線等の製造に
多用されている。この方法は線材をメツキ金属の
溶融浴中に通した後、絞りダイスを通して過剰に
付着したメツキ金属を絞り取り、しかる後空中で
冷却凝固せしめるもので、このようにして造られ
た溶融メツキ線材はそのまま製品とするか、又は
これを伸線加工して所望サイズに仕上げられる。 特にリード線や配線としてのCu線に対するSn
又はSn−Pb合金の溶融メツキは半田付け等の端
末処理に不可欠のものとなつており、例えば線径
0.4〜0.9mmのCu線にはSn又はSn−Pb合金を5μ以
上の厚さに溶融メツキしている。 〔発明が解決しようとする問題点〕 SnやSn−Pb合金は比較的高価な金属であり、
これを節約するため溶融メツキをできるだけ薄く
することが試みられているが、半田付け性を満足
する薄付けメツキを得ることは困難であつた。こ
れは被メツキ線材をメツキ金属の溶融浴中に通し
た後、絞りダイスを通して空中で付着したメツキ
金属を凝固させるため、走行中の線材の振動によ
り、絞りダイスとの接触を起し、第4図に示すよ
うに被メツキ線材1上のメツキ金属層2が大きく
一方向に偏肉し、その結果半田付け性が著しく損
なわれるためである。 〔問題点を解決するための手段〕 本発明はこれに鑑み種々検討の結果、溶融メツ
キ線材のメツキ金属層の偏肉を大巾に軽減するこ
とができる溶融メツキ用絞りダイスを開発したも
のである。 本発明絞りダイスは溶融メツキした線材を通し
て過剰に付着したメツキ金属を絞り取るダイスに
おいて、溶融メツキした線材を通すダイスのベア
リング部内周面に線材ガイド用の凸条を3個以上
軸方向に形成したことを特徴とするものである。 本発明絞りダイスは、溶融メツキした線材を通
す絞りダイスのベアリング部と同形の柱状体の外
周面に、線材ガイド用凸条に対応する凹溝を3固
以上軸方向に形成し、その周囲にセラミツク粉末
とFe、Ni又はこれ等の合金粉末との混合粉を圧
粉成形後又はこれを予備焼結後柱状体を抜き取
り、しかる後焼結する。 即ち本発明絞りダイスは第1図に示すように溶
融メツキした線材を通す絞りダイスのベアリング
部3の内周面に、線材ガイド用の凸条4を3個以
上(図は5個の場合を示す)を軸方向に形成した
ものである。ベアリング部3の断面形状としては
図に示す円形を始め、六角形、八角形のような多
角形とし、凸条4の断面形状を図に示すU字形を
始め、V字形など種々の形状とすることができ
る。またベアリング部3の最小孔径R、即ち各凸
条4の先端と内接する円(図に示す点線の円)の
直径は被メツキ線材の直径と同等以上とし、その
クリアランス、凸条の高さH及び巾lは溶融メツ
キ工程の諸条件、即ちラインスピード、浴の組
成、浴温、被メツキ線材の表面状態、メツキ厚さ
等により経験的に決定する。 本発明絞りダイスは粉末成型法により次のよう
にして造られる。例え第2図に示すように絞りダ
イスのベアリング部と同形の円柱や多角柱(図は
円柱の場合を示す)の外周面5に線材ガイド用の
凸条に相当する凹溝6を軸方向に形成する。尚図
は同一径であるベアリング部のみを示したがアプ
ローチ部を成型するためには、一端を拡大径とし
たラツパ状にするか、また後工程においてアプロ
ーチ部を形成すればよく、以下アプローチ部の説
明は省略する。次に外周面5に凹溝6を軸方向に
形成した円柱又は多角柱の周囲にAl2O3、 ZrO2、WCなどのセラミツク粉末とFe、Ni又は
これ等の合金粉末との混合粉末を圧粉成型して円
柱や多角柱を抜き取るか、又はこれを予備焼結し
た後、円柱や多角柱を抜き取り、しかる後焼結に
より実用上十分な強度に高め、実質的に断面円形
又は多角形のベアリング部に線材ガイド用の軸方
向の凸条を3個以上有する絞りダイスとし、少な
くとも凸条部を研摩仕上げする。 〔作用〕 溶融メツキした線材を本発明絞りダイスに通す
と、被メツキ線材は3個以上の凸条によりカイド
され、走行中の線材は振動することなくダイスの
中心を通過する。このときメツキ金属は溶融状態
にあつて、過剰に付着したメツキ金属は絞り取ら
れ、適量の付着したメツキ金属は凸条により分断
されるも、ダイス通過後表面張力の作用で凝固す
るまでの間に第3図に示すように部分的な流動を
起して被メツキ線材1上でメツキ金属層2の厚さ
を平均化する。従つて本発明絞りダイスを用いる
ことにより、メツキ金属層の厚さを薄くするも、
溶融メツキ線材の耐食性や半田付け性を損なうこ
とがない。またメツキ金属層の厚さにもよるが、
1μ前後において若干の粗さが残る場合があるが、
これが問題になる用途では溶融メツキ後、少なく
とも1回以上、ダイスを通して引抜加工すること
により解消できる。 しかして本発明絞りダイスにおいて、ベアリン
グ部内周面に軸方向の凸条を3個以上形成したの
は、前記の如く溶融メツキした線材をダイス中心
にガイドするためで、3個末満では線材をダイス
中心にガイドすることができない。 〔実施例〕 ZrOzと合金鋼の混合粉末を第2図に示す円柱
の周囲に圧粉成型し、円柱を引抜いた後焼結して
第1図に示すベアリング部の最小孔径R0.485mm、
最大孔径0.500mm、5個の凸条の高さH0.0075mm、
底辺巾l0.0025mmを有する本発明絞りダイスを作
成し、これを用いて直径0.480mmの銅覆鋼線(導
電率30%IACS)にPb50%、Sn50%の半田を溶融
メツキした。 銅覆鋼線を290℃に保持した溶融半田浴中に挿
入し、ターンロールを介して上方に引上げ、浴上
で本発明絞りダイスを通過させた。ラインスピー
ドは250m/minに保持した。 この溶融メツキ線材について断面を検鏡してメ
ツキ金属の偏肉度を調べ、ユクール法でメツキ金
属層の平均厚さを求めた。またこの溶融メツキ線
材を温度80℃、温度95%の恒温恒湿槽内で500時
間保持した後、230℃に保持した共晶半田浴内に
3秒間浸漬して半田濡れ面積を求めた。これ等の
結果を従来の丸孔形絞りダイス(孔径0.500mmと
0.520mm)を用いて同様の溶融メツキを行なつた
ものと比較して第1表に示した。
[Industrial Field of Application] The present invention relates to a die for squeezing out plating metal excessively attached to a hot-melt plated wire, and particularly for reducing uneven thickness of the plating layer. [Conventional technology] The melt plating method for wire rods has been widely industrialized and is widely used in electrical and
It is widely used in the manufacture of lead wires, wiring, etc. for electronic devices and their parts. In this method, the wire is passed through a molten bath of plated metal, and then the excess plated metal is squeezed out through a drawing die, and then cooled and solidified in the air.The molten plated wire produced in this way is It can be made into a product as is, or it can be wire-drawn to a desired size. Especially Sn for Cu wire as lead wire or wiring
Alternatively, hot-melt plating of Sn-Pb alloy has become indispensable for terminal processing such as soldering.
The 0.4-0.9 mm Cu wire is melt-plated with Sn or Sn-Pb alloy to a thickness of 5 μm or more. [Problems to be solved by the invention] Sn and Sn-Pb alloys are relatively expensive metals;
In order to save on this, attempts have been made to make the molten plating as thin as possible, but it has been difficult to obtain a thin plating that satisfies solderability. After the wire to be plated is passed through a molten bath of plated metal, the plated metal adhering to the plated metal is solidified in the air through a drawing die, so the vibration of the wire during running causes contact with the drawing die, and the fourth This is because, as shown in the figure, the thickness of the plating metal layer 2 on the wire material 1 to be plated is largely uneven in one direction, and as a result, the solderability is significantly impaired. [Means for Solving the Problems] In view of this, and as a result of various studies, the present invention has developed a drawing die for fusion plating that can greatly reduce the uneven thickness of the plating metal layer of molten plating wire. be. The drawing die of the present invention is a die for squeezing excessively attached plating metal through a melt-plated wire, and three or more protrusions for guiding the wire are formed in the axial direction on the inner peripheral surface of the bearing part of the die through which the melt-plated wire is passed. It is characterized by this. The drawing die of the present invention has a columnar body having the same shape as the bearing part of the drawing die through which the melt-plated wire is passed, and on the outer peripheral surface of the columnar body, grooves corresponding to the protrusions for guiding the wire are formed in the axial direction of three or more grooves. After compacting a mixed powder of ceramic powder and Fe, Ni, or alloy powder thereof, or after preliminary sintering, the columnar bodies are extracted and then sintered. That is, as shown in Fig. 1, the drawing die of the present invention has three or more protrusions 4 for guiding the wire (the figure shows a case of five) on the inner peripheral surface of the bearing part 3 of the drawing die through which the melt-plated wire passes. ) is formed in the axial direction. The cross-sectional shape of the bearing portion 3 may be a circle as shown in the figure, or a polygon such as a hexagon or octagon, and the cross-sectional shape of the protrusion 4 may be various shapes such as the U-shape shown in the figure or the V-shape. be able to. In addition, the minimum hole diameter R of the bearing part 3, that is, the diameter of the circle inscribed with the tip of each protrusion 4 (the circle indicated by the dotted line in the figure) is equal to or larger than the diameter of the wire to be plated, and the clearance, height H of the protrusion, etc. and the width l are empirically determined based on the conditions of the hot-dip plating process, such as line speed, bath composition, bath temperature, surface condition of the wire to be plated, and plating thickness. The drawing die of the present invention is manufactured by the powder molding method as follows. For example, as shown in Fig. 2, grooves 6 corresponding to protrusions for wire guides are formed in the axial direction on the outer peripheral surface 5 of a cylinder or polygonal cylinder (the figure shows the case of a cylinder) that has the same shape as the bearing part of the drawing die. Form. Although the figure shows only the bearing part with the same diameter, in order to mold the approach part, it is sufficient to make one end into a tuppy shape with an enlarged diameter, or to form the approach part in a later process. The explanation of is omitted. Next, a mixed powder of ceramic powder such as Al 2 O 3 , ZrO 2 , WC, etc. and Fe, Ni or alloy powder of these is placed around a cylinder or polygonal column having grooves 6 formed in the axial direction on the outer circumferential surface 5 . After compacting and extracting cylinders or polygonal cylinders, or pre-sintering this, the cylinders or polygonal cylinders are extracted, and then sintered to increase the strength to be practically sufficient, so that it has a substantially circular or polygonal cross section. The drawing die has three or more axial protrusions for guiding the wire on the bearing part, and at least the protrusions are polished and finished. [Function] When a melt-plated wire is passed through the drawing die of the present invention, the wire to be plated is guided by three or more protrusions, and the running wire passes through the center of the die without vibration. At this time, the plated metal is in a molten state, and the excess plated metal is squeezed out, and the appropriate amount of plated metal is separated by the ridges, but after passing through the die, it remains until it solidifies due to the action of surface tension. Then, as shown in FIG. 3, partial flow is generated to equalize the thickness of the plating metal layer 2 on the wire material 1 to be plated. Therefore, although the thickness of the plating metal layer can be reduced by using the drawing die of the present invention,
It does not impair the corrosion resistance or solderability of the melt-plated wire. It also depends on the thickness of the plating metal layer,
Some roughness may remain around 1μ, but
In applications where this is a problem, it can be resolved by drawing it through a die at least once after melt plating. However, in the drawing die of the present invention, three or more axial protrusions are formed on the inner circumferential surface of the bearing part in order to guide the melt-plated wire to the center of the die as described above. Unable to guide to the center of the die. [Example] A mixed powder of ZrOz and alloy steel is compacted around the cylinder shown in Fig. 2, the cylinder is pulled out, and then sintered to form the minimum hole diameter R0.485 mm of the bearing part shown in Fig. 1.
Maximum hole diameter 0.500mm, height of 5 protrusions H0.0075mm,
A drawing die of the present invention having a base width l of 0.0025 mm was prepared, and was used to melt and plate a copper-clad steel wire (conductivity 30% IACS) with a diameter of 0.480 mm with solder containing 50% Pb and 50% Sn. A copper-clad steel wire was inserted into a molten solder bath maintained at 290°C, pulled upward through turn rolls, and passed through a drawing die of the present invention above the bath. The line speed was maintained at 250 m/min. The cross-section of this molten plated wire was examined with a microscope to examine the degree of uneven thickness of the plated metal, and the average thickness of the plated metal layer was determined using the Ucourt method. The molten plated wire was kept in a constant temperature and humidity bath at 80°C and 95% for 500 hours, and then immersed in a eutectic solder bath kept at 230°C for 3 seconds to determine the solder wetting area. These results were compared to the conventional round hole drawing die (with a hole diameter of 0.500 mm).
Table 1 shows a comparison with a similar hot-melt plating using 0.520mm).

〔発明の効果〕〔Effect of the invention〕

本発明によれば、溶融メツキ線材の偏肉度を軽
減し、メツキ線材の品質を大巾に向上し得るもの
で、メツキ厚さの薄肉化を可能にし、メツキ線材
のコストを低減することができる等、工業上顕著
な効果を奏するものである。
According to the present invention, it is possible to reduce the thickness unevenness of the molten plated wire rod, greatly improve the quality of the plated wire rod, make it possible to reduce the thickness of the plated wire rod, and reduce the cost of the plated wire rod. It has remarkable industrial effects.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明絞りダイスのベアリング部にお
ける孔型の一例を示す説明図、第2図は同絞りダ
イスのベアリング部形成用の円柱の一例を示す斜
視図、第3図は第1図に示す本発明絞りダイス通
過後のメツキ金属の流れを示す説明図、第4図は
従来絞りダイス通過後のメツキ線材の断面図であ
る。 1…被メツキ線材、2…メツキ金属層、3…ベ
アング部、4…凸条、5…ベアリング部に相当す
る円柱、6…凸条に相当する凹溝。
Fig. 1 is an explanatory diagram showing an example of the hole shape in the bearing part of the drawing die of the present invention, Fig. 2 is a perspective view showing an example of a cylinder for forming the bearing part of the drawing die, and Fig. 3 is similar to Fig. 1. FIG. 4 is an explanatory view showing the flow of the plated metal after passing through the drawing die of the present invention, and FIG. 4 is a sectional view of the plated wire after passing through the conventional drawing die. DESCRIPTION OF SYMBOLS 1...Wire material to be plated, 2...Metal layer to be plated, 3...Bearing part, 4...Protruding strip, 5...Cylinder corresponding to the bearing part, 6...Concave groove corresponding to the protruding strip.

Claims (1)

【特許請求の範囲】[Claims] 1 溶融メツキした線材を通して過剰に付着した
メツキ金属を絞り取るダイスにおいて、溶融メツ
キした線材を通すダイスのベアリング部内周面
に、線材ガイド用の凸条を3個以上軸方向に形成
したことを特徴とする溶融メツキ用絞りダイス。
1. A die for squeezing out excessively attached plating metal through a hot-plated wire, characterized in that three or more protrusions for guiding the wire are formed in the axial direction on the inner peripheral surface of the bearing part of the die through which the hot-plated wire is passed. A drawing die for melt plating.
JP13356584A 1984-06-28 1984-06-28 Drawing die for hot dipping and its production Granted JPS6112860A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13356584A JPS6112860A (en) 1984-06-28 1984-06-28 Drawing die for hot dipping and its production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13356584A JPS6112860A (en) 1984-06-28 1984-06-28 Drawing die for hot dipping and its production

Publications (2)

Publication Number Publication Date
JPS6112860A JPS6112860A (en) 1986-01-21
JPH0359979B2 true JPH0359979B2 (en) 1991-09-12

Family

ID=15107771

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13356584A Granted JPS6112860A (en) 1984-06-28 1984-06-28 Drawing die for hot dipping and its production

Country Status (1)

Country Link
JP (1) JPS6112860A (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS571868U (en) * 1980-05-30 1982-01-07

Also Published As

Publication number Publication date
JPS6112860A (en) 1986-01-21

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