JPH036002A - Manufacture of electronic component - Google Patents

Abstract

PURPOSE:To manufacture electronic components at low cost, in large quantities and stably by a method wherein a dip treatment is executed in a state that electronic- component elements are arranged in line, a resin outer-package part is formed collectively and, after that, the resin outer-package part is cut at gap parts and is separated into discrete electronic components provided with single resin outer-package parts. CONSTITUTION:A plurality of electronic-component elements 3 are connected to terminals 5 via lead terminals 4 by keeping a gap interval (l). When the electronic- component elements 3 are piezoelectric resonators, oscillation parts 3a are coated with a wax 6. Then, a gap interval between the terminals 5 is set to (m); the plurality of electronic-component elements 3 are arranged in line and are dip-treated in a resin tank. Then, e.g. central parts of discrete resin outer-package parts 2' of the gap intervals (l), (m) as indicated by broken lines (y) are cut by using a cutter 7 or the like whose plurality of blades 7a have been supported by a cutter-blade support axis 7b; discrete electronic components 1 provided with single resin outer-package parts 2 which have been cut and molded are completed. Thereby, the electronic components provided with the resin outer-package parts whose outer dimensional accuracy is high can be produced at low cost, in large quantities and stably.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an improvement in a method for manufacturing electronic components, and more particularly, to a method for manufacturing electronic components having a resin exterior portion with high external dimensional accuracy in a stable manner (in terms of surface and mass). The present invention relates to a method for manufacturing electronic components that can be produced by

[Prior art]

FIG. 6 shows an electronic component 51 in a completed state manufactured based on a conventional manufacturing method, in which an electronic component element 52 has a resin exterior portion 53 molded to a predetermined external dimension with high dimensional accuracy.
covered by.

Note that fat in this figure is a schematic vertical cross-sectional view of the electronic component 51, and (bl is a front view of the electronic component 51).

Space 53 shown at 01+ in the figure. is provided, for example, when the electronic component element 52 is a piezoelectric resonator.

This space 53 allows the vibrating part 52& of the piezoelectric resonator to maintain a non-contact state with the resin exterior part 53, and does not cause vibration disturbance.

The lead terminal 54 is connected to the electronic component element 52 and supplies power to the electronic component element 52.

Next, steps for manufacturing this electronic component 51 based on a conventional manufacturing method will be explained in order using FIGS. 4 and 5.

FIG. 4 shows one state of the process before dipping treatment, and fat in this figure is where a plurality of electronic component elements 52 are connected to terminals 55 via lead terminals 54 at intervals. is schematically shown. Further, fb) in this figure schematically shows this state viewed from above, and when the electronic component element 52 is, for example, a piezoelectric resonator, the wax 56 is applied to the vibrating part 52a. be done. For example, when the terminals 55 are arranged at intervals M as shown in this figure, and the electronic component elements 52 are dipped in a resin bath (not shown), the above-mentioned intervals M
As a result, heat radiation adheres to the periphery of each electronic component element 52 independently for each electronic component element 52.

Then, baking is performed in that state to harden the adhered resin.

51st fflfa1. (bl is a vertical cross-sectional schematic diagram 3 and a front schematic diagram respectively showing one state when the above processing steps are completed, and the electronic component element 52 is covered with a resin exterior part 53' in a hardened state. At this time wax 56
(Fig. 4 mountain)) is applied as a space 538.

A part of the top surface of this resin exterior part 53' indicated by a dashed line The electronic component 51 having the resin exterior portion 53 molded to the predetermined external dimensions shown in FIG. 6 is completed.

In particular, in the case of an SMP compatible resin type, the above-mentioned external dimensional accuracy is particularly required.

[Problem to be solved by the invention]

In the conventional electronic component manufacturing method described above, when molding the resin sheathing part 53 with a predetermined external dimension that requires high dimensional accuracy, five surfaces of the resin sheathing part 53', including the top surface and the outer surface, are processed. The molding process was complicated.

Therefore, it is not suitable for mass production and is a factor in significantly increasing costs.

Therefore, it is an object of the present invention to provide a method for manufacturing electronic components that enables the stable production of electronic components having resin exterior parts with high external dimensional accuracy at low cost and in large quantities.

[Means to solve the problem]

In order to achieve the above object, the present invention provides a method for manufacturing an electronic component in which a plurality of electronic component elements are subjected to a seven-layer coating process, in which all the parts between the electronic component elements are The electronic component elements are aligned and arranged so that the resin enters the gap and the plurality of electronic component elements are all covered with the resin and are integrated, and the resin exterior portion is integrated by dipping. and cut the i & the resin exterior part at the gap part,
The present invention is configured as a method of manufacturing an electronic component, characterized in that the electronic component is separated into each electronic component having a single resin exterior part.

〔Example〕

Hereinafter, embodiments embodying the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention.

It should be noted that the following examples are examples embodying the present invention, and are not intended to limit the technical scope of the present invention.

Fig. 1 fal, Q)l is a schematic diagram showing a state before the step of dipping in the method for manufacturing an electronic component according to an embodiment of the present invention, and Fig. 2 +a+, Cbl is a schematic diagram showing a state before the step of dipping in the method for manufacturing an electronic component according to an embodiment of the present invention. FIG. 3 is a schematic diagram showing a state before the cutting process, and FIG. 3 is a perspective view showing a completed state of the electronic component in the method of manufacturing the electronic component.

An example of the process for manufacturing the electronic component 1 shown in FIG. 3 will be explained in order using FIGS. 1 and 2.

FIG. 1 shows the state of the process before the dip treatment, and fal in this figure indicates that the electronic component element 3 is multi-valently connected to the terminal 5 via the lead terminal 4 at a gap distance l. Shown schematically.

In addition, in this figure), this state is schematically shown as viewed from above, and when the electronic component element 3 is, for example, a piezoelectric resonator, its vibrating portion 3. Wax 6 is applied to the area.

As shown in this figure, for example, after arranging the terminals 5 with a gap of m, the plurality of electronic component elements 30
The portion is dipped in a resin bath (not shown). The above-mentioned gap interval β1m is set to such an extent that when the dip treatment is performed, the resin enters all the gaps between the electronic component elements 3 and the entire plurality of electronic component elements 3 are covered as one by the surface tension of the resin. Set.

For example, the gap distance i is 3 mm, and the gap distance m is 2°51
Set it like m.

Here, when compared with the conventional figure 4, the gap M is narrowed, and the gap spacing is 1. The only difference is that it is assumed to be m.

Then, a dip treatment as described above is performed, and then a baking treatment is performed to harden the resin.

FIG. 2(a) and Cbl are a schematic vertical cross-sectional view and a schematic plan view showing one state when the above processing steps are completed, respectively, and the resin exterior is coated around the electronic component element 3 by the above-mentioned dip processing step. The part 2' is integrally formed, and the same+N resin exterior part 2' is shown to be in a hardened state in the subsequent baking process. It should be noted that, at this time, the area where the wax 6 (mountain in Figure 1) was applied becomes a space, as in the conventional case.

A part of the top surface of the incense resin exterior part 2' indicated by the dashed line X is cut or scraped off. Furthermore, for example, a cutter 7 or the like in which a plurality of blades 71 as shown in FIG. Exterior part 2
For example, the center portion of the electronic component 1 is cut, and each electronic component 1 having a single cut-molded resin exterior portion 2 as shown in FIG. 3 is completed.

Therefore, since a large amount of electronic components 1 can be obtained at a time, the electronic components 1 can be produced at a lower cost than in the past.

In addition, the accuracy of the outer dimensions of the resin sheathing part 2 is as follows:
Stability can be achieved simply by controlling the accuracy so that the intervals between 1's are almost the same.

For example, it is easy to achieve an accuracy of ±0.1 am.

Furthermore, the external force applied to the resin sheath 2' when canting is well distributed, and "cracks" do not occur. Therefore, the yield is also improved.

〔Effect of the invention〕

According to the present invention, in the electronic component manufacturing method in which a plurality of electronic component elements are subjected to dip exterior processing, when the plurality of electronic component elements are dipped, the resin enters all the gaps between the electronic component elements and the plurality of electronic component elements are immersed. The above-mentioned electronic component elements are aligned and arranged with gaps such that the entire electronic component element is covered with resin and integrated, and a resin exterior portion is integrally formed by dipping treatment, and the resin exterior portion is formed integrally with the resin exterior. There is provided a method of manufacturing an electronic component, characterized in that the electronic component is cut at the gap and separated into electronic components each having a single resin exterior part.

Therefore, electronic components having resin exterior parts with high external dimensional accuracy can be stably produced at low cost and in large quantities.

Further, since this electronic component shape has a flat surface, it can also be used as a flat type electronic component.

[Brief explanation of drawings]

FIG. 1 (al, (1)) is a schematic diagram showing a state before the dip treatment step in the method of manufacturing an electronic component according to an embodiment of the present invention, and FIG. FIG. 3 is a schematic diagram showing a state before the cutting process in the method for manufacturing a component; FIG. 3 is a perspective view showing a completed state of the electronic component in the method for manufacturing the electronic component; FIG.
5 is a schematic diagram showing a state before the step of dipping treatment in a conventional method for manufacturing electronic components, FIG. FIG. 6 (al(b)) is a schematic diagram of a completed electronic component manufactured based on a conventional electronic component manufacturing method. [Explanation of symbols] 1...Electronic component 2.2'...・Resin exterior part 3...Electronic component element l1m...Gap interval

Claims (1)

[Claims] 1. In an electronic component manufacturing method in which a plurality of electronic component elements are subjected to dip exterior processing, when the plurality of electronic component elements are dipped, resin enters all the gaps between the electronic component elements and the entire plurality of electronic component elements are coated. The above-mentioned electronic component elements are aligned and arranged so that the gaps are such that they are covered with the resin and are integrated, and then dip treatment is performed to integrally form the resin exterior part. A method of manufacturing an electronic component, characterized in that the electronic component is cut into parts and separated into each electronic component having a single resin exterior part.