JPH0360089U - - Google Patents
Info
- Publication number
- JPH0360089U JPH0360089U JP1989120651U JP12065189U JPH0360089U JP H0360089 U JPH0360089 U JP H0360089U JP 1989120651 U JP1989120651 U JP 1989120651U JP 12065189 U JP12065189 U JP 12065189U JP H0360089 U JPH0360089 U JP H0360089U
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- thin film
- film pattern
- lead
- magnetic sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 claims 5
- 239000000463 material Substances 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
Landscapes
- Measuring Magnetic Variables (AREA)
Description
第１図は本考案を説明するための断面図、第２
図は本考案を説明するための平面図、第３図は従
来例を説明するための断面図である。
Figure 1 is a sectional view for explaining the present invention, Figure 2 is a sectional view for explaining the present invention.
The figure is a plan view for explaining the present invention, and FIG. 3 is a cross-sectional view for explaining a conventional example.
Claims (1)
の磁気抵抗素子を構成する薄膜パターンと、 前記薄膜パターンと連続的に描画され、前記薄
膜パターンと同一材料から成る第１層と導電性良
好な材料から成る第２層との積層構造から成る導
電パターンと、 前記磁性体基板の裏面側に形成した導出パター
ン、および前記磁性体基板を貫通して前記導電パ
ターンと前記導出パターンとを電気接続するため
のスルーホールと、 前記磁性体基板を内部に封止する筐体と、 前記導出パターンと接続し前記筐体の外部に導
出される外部接続リードとを具備することを特徴
とする磁気センサ。 (2) 前記薄膜パターンはインジウム・アンチモ
ン（Ｉｎ−Ｓｂ）であることを特徴とする請求項
第１項に記載の磁気センサ。 (3) 前記導電パターンの第２層は銅メツキ（Ｃ
ｕ）であることを特徴とする請求項第１項に記載
の磁気センサ。[Claims for Utility Model Registration] (1) A thin film pattern constituting a plurality of magnetoresistive elements formed on the surface of a common magnetic substrate, and a thin film pattern drawn continuously with the thin film pattern and made of the same material as the thin film pattern. a conductive pattern having a laminated structure of a first layer consisting of a material with good conductivity and a second layer consisting of a material with good conductivity; a lead-out pattern formed on the back side of the magnetic substrate; a through hole for electrically connecting the pattern and the lead-out pattern; a casing that seals the magnetic substrate therein; and an external connection lead connected to the lead-out pattern and led out to the outside of the casing. A magnetic sensor comprising: (2) The magnetic sensor according to claim 1, wherein the thin film pattern is made of indium antimony (In-Sb). (3) The second layer of the conductive pattern is copper plating (C
The magnetic sensor according to claim 1, characterized in that it is u).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989120651U JPH0360089U (en) | 1989-10-16 | 1989-10-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989120651U JPH0360089U (en) | 1989-10-16 | 1989-10-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0360089U true JPH0360089U (en) | 1991-06-13 |
Family
ID=31668717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989120651U Pending JPH0360089U (en) | 1989-10-16 | 1989-10-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0360089U (en) |
-
1989
- 1989-10-16 JP JP1989120651U patent/JPH0360089U/ja active Pending
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