JPH0360145A - Structure of package - Google Patents
Structure of packageInfo
- Publication number
- JPH0360145A JPH0360145A JP19436089A JP19436089A JPH0360145A JP H0360145 A JPH0360145 A JP H0360145A JP 19436089 A JP19436089 A JP 19436089A JP 19436089 A JP19436089 A JP 19436089A JP H0360145 A JPH0360145 A JP H0360145A
- Authority
- JP
- Japan
- Prior art keywords
- package
- terminal
- board
- circuit board
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔概要〕
通信機等の電子機器に使用されるＩＣを搭載した発振器
や増幅回路等をモジュール化したパッケージの構造に関
し、
放熱効率の良いパッケージの構造を提供することを目的
とし、
貫通孔に絶縁体を介して挿通された端子を有する端子板
と、該端子板上に載置されたＩＣ搭載の回路基板と、開
口部の全周にフランジを有するケースとからなり、端子
板の外周に設けられた台座に対して前記フランジを溶接
して前記回路基板を封入してなるパッケージであって、
前記ケースの全周に設けられたフランジの少なくとも一
部が、外側に向いて張り出した段付き状の舌片を有し、
このパッケージが実装回路基板上に実装される場合に、
該舌片が実装回路基板の表面に密着固定されるように構
成される。[Detailed Description of the Invention] [Summary] The present invention relates to a package structure in which an oscillator, amplifier circuit, etc. equipped with an IC used in electronic devices such as communication devices is modularized, and the present invention aims to provide a package structure with high heat dissipation efficiency. It consists of a terminal board with a terminal inserted through a through hole through an insulator, a circuit board with an IC mounted on the terminal board, and a case with a flange around the entire circumference of the opening. , a package in which the circuit board is enclosed by welding the flange to a pedestal provided on the outer periphery of a terminal board,
At least a portion of the flange provided around the entire circumference of the case has a stepped tongue protruding outward;
When this package is mounted on a mounting circuit board,
The tongue piece is configured to be closely fixed to the surface of the mounted circuit board.
本発明は、通信機等の電子機器に使用されるＩＣを搭載
した発振器や増幅回路等をモジュール化したパッケージ
の構造に関する。The present invention relates to the structure of a package in which an oscillator, an amplifier circuit, etc. equipped with an IC used in electronic devices such as communication devices are modularized.
パッケージは、第４図に示すように、金属製のベースか
らなる端子板１上に回路基板２を載置し、前記端子板１
を貫通して穿設された孔にガラス質の絶縁体３を介して
端子４ （ガラス端子と称する）を挿通固定し、端子板
１の下面にアースピン５を溶接固定し、更に、第５図に
示すように、端子板１の上面に回路基板２をカバーする
ケース６を被せ、該ケースの裾部６ａを端子板１に抵抗
溶接して固定して構成されている。As shown in FIG. 4, the package includes a circuit board 2 placed on a terminal board 1 made of a metal base, and a circuit board 2 placed on the terminal board 1.
A terminal 4 (referred to as a glass terminal) is inserted and fixed into the hole drilled through the hole through the glass insulator 3, and a ground pin 5 is welded and fixed to the lower surface of the terminal plate 1. As shown in FIG. 2, a case 6 covering the circuit board 2 is placed on the top surface of the terminal board 1, and the bottom portion 6a of the case is fixed to the terminal board 1 by resistance welding.
このパッケージは、第６図に示すように、絶縁板７を介
してプリント板８に載置され、該プリント板８のスルー
ホールに各端子４，５を挿通した状態で半田付けして実
装される。As shown in FIG. 6, this package is placed on a printed board 8 via an insulating plate 7, and the terminals 4 and 5 are inserted into the through holes of the printed board 8 and soldered. Ru.
ＩＣを内包した電子回路は作動中に発熱するが、これを
放熱しないとパッケージ内に蓄積して温度上昇を招き、
電子回路の正常な動作が損なわれる。Electronic circuits containing ICs generate heat during operation, but if this heat is not radiated, it will accumulate inside the package and cause a rise in temperature.
The normal operation of electronic circuits is impaired.
前述のパッケージの場合、ガラス端子４は熱的にも端子
板１とは絶縁されているので、発熱は専ら細いアースビ
ン５を通じて端子板１に伝達され、次いでプリント板８
に逃げることによって放熱されている。このため、熱抵
抗が大きく放熱効率が悪い欠点があった。In the case of the above-mentioned package, the glass terminal 4 is thermally insulated from the terminal board 1, so the heat generated is transmitted exclusively to the terminal board 1 through the thin earth via 5, and then to the printed board 8.
Heat is dissipated by escaping to. For this reason, it has the drawback of high thermal resistance and poor heat dissipation efficiency.
本発明は、このような従来技術の問題点を解消し、放熱
効率の良いパッケージの構造を提供することを目的とす
る。It is an object of the present invention to solve the problems of the prior art and provide a package structure with high heat dissipation efficiency.
この目的は、貫通孔に絶縁体を介して挿通された端子を
有する端子板と、該端子板上に載置されたＩＣ搭載の回
路基板と、開口部の全周にフランジを有するケースとか
らなり、端子板の外周に設けられた台座に対して前記フ
ランジを溶接して前記回路基板を封入してなるパッケー
ジであって、前記ケースの全周に設けられたフランジの
少なくとも一部が、外側に向いて張り出した段付き状の
舌片を有し、このパッケージが実装回路基板上に実装さ
れる場合に、該舌片が実装回路基板の表面に密着固定さ
れるように構成されたパッケージの構造によって達成さ
れる。This purpose consists of a terminal board having a terminal inserted through a through hole through an insulator, a circuit board mounted with an IC mounted on the terminal board, and a case having a flange around the entire circumference of the opening. The package is formed by welding the flange to a pedestal provided on the outer periphery of the terminal board and enclosing the circuit board, wherein at least a part of the flange provided around the entire periphery of the case is A package having a stepped tongue protruding toward the surface, and configured such that when the package is mounted on the mounted circuit board, the tongue is tightly fixed to the surface of the mounted circuit board. Achieved through structure.
ＩＣからの発熱は、端子板との溶接部を通じてケースに
伝わり、次いで充分な接触面積を有するケースの段付き
状の舌片を通じてプリント板に伝わり、ここから外気中
に効率的に放熱される。Heat generated from the IC is transmitted to the case through the welded portion with the terminal board, and then to the printed board through the stepped tongue of the case that has a sufficient contact area, from which the heat is efficiently radiated into the outside air.
以下、図面に示す好適実施例に基づいて、本発明を更に
詳細に説明する。Hereinafter, the present invention will be explained in more detail based on preferred embodiments shown in the drawings.
第１図は、本発明の一実施例にかかるパッケージを構成
する端子板１０とケース１１とを示す斜視図である。長
方形の平面形状をなす端子板１０には貫通孔に絶縁体１
２を介して、複数の端子１３が両側領域に挿通・固定さ
れて配列されている。FIG. 1 is a perspective view showing a terminal board 10 and a case 11 that constitute a package according to an embodiment of the present invention. The terminal board 10 has a rectangular planar shape, and an insulator 1 is provided in the through hole.
2, a plurality of terminals 13 are inserted and fixed in both side areas and arranged.
そしてその中央には、ＩＣを搭載した回路基板１４が固
定され、公知の手段で端子１３と結線されている。A circuit board 14 on which an IC is mounted is fixed in the center and connected to a terminal 13 by a known means.
端子板１０の周縁部は一段低くなった台座１０ａを形成
している。一方、ケース１１は、開口部の外周に前記台
座１０ａに対応して外側に水平に折れ曲がったフランジ
ｌｌａを有し、更に、そのフランジｌｌａの一部（この
例では左右両側領域）には、段付きの舌片１５が張り出
している。ケース１１はそのフランジｌｌａを端子板１
０の台座１０ａ上に載せ、抵抗溶接やレーザ溶接によっ
て台座１０ａに接合固定される。なお、この舌片１５は
、７ランジｌｌａの全周に設けてもよい。The peripheral edge of the terminal plate 10 forms a lower pedestal 10a. On the other hand, the case 11 has a flange lla bent horizontally outward in correspondence with the pedestal 10a on the outer periphery of the opening. A tongue piece 15 with a tag is protruding. Case 11 connects its flange lla to terminal plate 1
0 on the pedestal 10a, and is joined and fixed to the pedestal 10a by resistance welding or laser welding. In addition, this tongue piece 15 may be provided all around the 7 langes lla.
この結果、第２図に示すように、ケース１１の舌片１５
が両側に張り出した状態のパッケージが得られる。As a result, as shown in FIG.
The result is a package with bulges on both sides.
このパッケージをプリント板１６に実装するには、第３
図に示すように、前記舌片１５に対応して予め実装回路
基板、例えばプリント板上に印刷されている銅箔１７の
上に舌片１５を載せ、スルーホール１８に端子１３を挿
通して位置決めする。To mount this package on the printed board 16, the third
As shown in the figure, the tongue piece 15 is placed on a copper foil 17 printed in advance on a mounting circuit board, for example, a printed board, corresponding to the tongue piece 15, and the terminal 13 is inserted into the through hole 18. Position.
そして、接合個所に半田付けを施して電気的接触を完全
にすると共に、位置を固定する。この場合、端子板１０
の裏面とプリント板１６表面との間には、所定の空間り
が形成されて両者間の絶縁が完全になるように舌片１５
の高さが決められている。The joints are then soldered to complete electrical contact and to fix the position. In this case, the terminal board 10
A predetermined space is formed between the back surface of the printed board 16 and the front surface of the printed board 16, so that the tongue piece 15 is installed so that the insulation between the two is complete.
The height of is determined.
この結果、作動中にＩＣから発生した熱は、端子板１０
に伝わり、次いで台座１０ａとフランジ１１ａとの接触
を通じてケース１１に伝わり、更に舌片１５と銅箔１７
との接触を通じてプリント板１６に放熱され、パッケー
ジ内部に蓄積されることがなくなる。As a result, the heat generated from the IC during operation is transferred to the terminal board 10.
It is then transmitted to the case 11 through contact between the pedestal 10a and the flange 11a, and further transmitted to the tongue piece 15 and the copper foil 17.
The heat is radiated to the printed circuit board 16 through contact with the package, preventing it from being accumulated inside the package.
このように、パッケージから発生した熱は効率良くプリ
ント板１６に伝達されて、外気中に放散されるので、Ｉ
Ｃの温度上昇が避けられ常に正常な作動が保証される。In this way, the heat generated from the package is efficiently transferred to the printed board 16 and dissipated into the outside air.
C temperature rise is avoided and normal operation is always guaranteed.
又、ケースの舌片を通じてパッケージの接地が完全に行
われるので、シール効果が向上する。Furthermore, since the package is completely grounded through the tongue of the case, the sealing effect is improved.
第１図は、本発明のパッケージの端子板とケースとを示
す分解斜視図、
第２図は、同じく組立斜視図、
第３図は、本発明のパッケージのプリント板上への実装
状態を示す断面図、
第４図は、従来のパッケージの端子板の斜視図、第５図
は、同じく側断面図、
第６図は、従来のパッケージのプリント板上への実装状
態を示す側断面図である。
１０・・・端子板、
１０ａ・・・台座、
１１・・・ケース、
１１ａ・・・フランジ、
１２・・・絶縁体、
１３・・・端子、
１４・・・回路基板、
１５・・・舌片、
１６・・・プリント板、
１７・・・銅箔。FIG. 1 is an exploded perspective view showing the terminal board and case of the package of the present invention, FIG. 2 is an assembled perspective view, and FIG. 3 is a diagram showing the package of the present invention mounted on a printed board. 4 is a perspective view of the terminal board of a conventional package, FIG. 5 is a side sectional view, and FIG. 6 is a side sectional view showing the conventional package mounted on a printed circuit board. be. DESCRIPTION OF SYMBOLS 10... Terminal board, 10a... Pedestal, 11... Case, 11a... Flange, 12... Insulator, 13... Terminal, 14... Circuit board, 15... Tongue Piece, 16...Printed board, 17...Copper foil.
Claims (1)
１３）を有する端子板（１０）と、該端子板（１０）上
に載置されたＩＣ搭載の回路基板（１４）と、開口部の
全周にフランジ（１１ａ）を有するケース（１１）とか
らなり、端子板（１０）の外周に設けられた台座（１０
ａ）に対して前記フランジ（１１ａ）を溶接して前記回
路基板（１４）を封入してなるパッケージであって、前
記ケース（１１）の全周に設けられたフランジ（１１ａ
）の少なくとも一部が、外側に向いて張り出した段付き
状の舌片（１５）を有し、このパッケージが実装回路基
板（１６）上に実装される場合に、該舌片（１５）が実
装回路基板（１６）の表面に密着固定されるように構成
されたパッケージの構造。1. Terminal inserted into the through hole via the insulator (12) (
13), a circuit board (14) mounted with an IC placed on the terminal board (10), and a case (11) having a flange (11a) around the entire circumference of the opening. pedestal (10) provided on the outer periphery of the terminal board (10).
a), the flange (11a) is welded to the circuit board (14), and the flange (11a) is provided around the entire circumference of the case (11).
) has a stepped tongue (15) projecting outward, and when this package is mounted on a mounted circuit board (16), the tongue (15) A structure of a package configured to be closely fixed to the surface of a mounted circuit board (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19436089A JPH0360145A (en) | 1989-07-28 | 1989-07-28 | Structure of package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19436089A JPH0360145A (en) | 1989-07-28 | 1989-07-28 | Structure of package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0360145A true JPH0360145A (en) | 1991-03-15 |
Family
ID=16323285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19436089A Pending JPH0360145A (en) | 1989-07-28 | 1989-07-28 | Structure of package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0360145A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6142841A (en) * | 1984-08-02 | 1986-03-01 | Matsushita Electronics Corp | Color picture tube |
-
1989
- 1989-07-28 JP JP19436089A patent/JPH0360145A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6142841A (en) * | 1984-08-02 | 1986-03-01 | Matsushita Electronics Corp | Color picture tube |
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