JPH0361325U - - Google Patents
Info
- Publication number
- JPH0361325U JPH0361325U JP12306289U JP12306289U JPH0361325U JP H0361325 U JPH0361325 U JP H0361325U JP 12306289 U JP12306289 U JP 12306289U JP 12306289 U JP12306289 U JP 12306289U JP H0361325 U JPH0361325 U JP H0361325U
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- type solid
- terminal
- resin
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000007787 solid Substances 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- 239000007784 solid electrolyte Substances 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
- 239000012467 final product Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図ないし第４図はこの考案によるチツプ型
固体電解コンデンサの一実施例に関するもので、
第１図はその正面図、第２図は同実施例の樹脂外
装体成形時の断面図、第３図はリード端子折曲げ
前の状態を示した斜視図、第４図は最終製品形態
の斜視図、第５図は変形実施例に係るリード端子
折曲げ前の状態を示した第３図と同様な斜視図、
第６図は同変形実施例の最終製品形態を示した第
４図と同様な斜視図、第７図は従来例を示した断
面図である。
図中、１０……チツプ型固体電解コンデンサ、
１１……コンデンサ素子、１２，１３……リード
端子、１２ａ〜１２ｄ；１３ａ〜１３ｄ……端子
片、１４……樹脂外装体、１５……十文字部、１
６……段部、１７ａ〜１７ｅ……端子収納溝であ
る。
Figures 1 to 4 show an example of a chip-type solid electrolytic capacitor according to this invention.
Figure 1 is a front view of the same, Figure 2 is a cross-sectional view of the same example during molding of the resin sheath, Figure 3 is a perspective view of the lead terminal before bending, and Figure 4 is the final product form. A perspective view, FIG. 5 is a perspective view similar to FIG. 3 showing the state before bending the lead terminal according to the modified embodiment,
FIG. 6 is a perspective view similar to FIG. 4 showing the final product form of the modified embodiment, and FIG. 7 is a sectional view showing a conventional example. In the figure, 10... Chip type solid electrolytic capacitor,
11... Capacitor element, 12, 13... Lead terminal, 12a to 12d; 13a to 13d... Terminal piece, 14... Resin exterior body, 15... Cross portion, 1
6... Step portion, 17a to 17e... Terminal storage groove.
Claims (1)
らなるコンデンサ素子を有し、同コンデンサ素子
の陽極リードおよび陰極面にそれぞれ陽極リード
端子と陰極リード端子を取付け、上記コンデンサ
素子のまわりに樹脂モールドよりなる六面体形状
の樹脂外装体を形成するとともに、上記陽極リー
ド端子と陰極リード端子を上記樹脂外装体の表面
に沿つて所定方向に折り曲げてなるチツプ型固体
電解コンデンサにおいて、 上記陽極リード端子および陰極リード端子を上
記樹脂外装体の側面以外の任意の一面の所定部位
から引出すようにするとともに、その引出される
部分を十文字状に形成し、同各リード端子を上記
側面に沿つて折り曲げ、かつ、十文字状に形成さ
れた各端子片を残された三面に沿つてさらに折り
曲げてなることを特徴とするチツプ型固体電解コ
ンデンサ。 (2) 上記樹脂外装体の両端に上記リード端子の
板厚にほぼ等しい凹状段部を形成してなる請求項
１に記載のチツプ型固体電解コンデンサ。 (3) 上記樹脂外装体の側面およびそれに連なる
四面に上記リード端子の板厚にほぼ等しい深さを
有する端子収納溝を形成してなる請求項１に記載
のチツプ型固体電解コンデンサ。[Scope of Claim for Utility Model Registration] (1) A capacitor element made of a sintered body of valve metal powder such as tantalum, and an anode lead terminal and a cathode lead terminal are attached to the anode lead and cathode surface of the capacitor element, respectively. , a chip-type solid electrolyte, which is formed by forming a hexahedral resin exterior made of resin mold around the capacitor element, and bending the anode lead terminal and the cathode lead terminal in a predetermined direction along the surface of the resin exterior. In the capacitor, the anode lead terminal and the cathode lead terminal are drawn out from a predetermined part on any one surface other than the side surface of the resin sheath, and the drawn out part is formed in a cross shape, and each of the lead terminals is A chip-type solid electrolytic capacitor characterized in that it is bent along the above-mentioned side surfaces, and each terminal piece formed in a criss-cross shape is further bent along the remaining three sides. (2) The chip type solid electrolytic capacitor according to claim 1, wherein concave stepped portions approximately equal to the plate thickness of the lead terminal are formed at both ends of the resin exterior body. (3) The chip type solid electrolytic capacitor according to claim 1, wherein a terminal storage groove having a depth approximately equal to the plate thickness of the lead terminal is formed on a side surface of the resin exterior body and four surfaces connected thereto.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12306289U JPH0361325U (en) | 1989-10-20 | 1989-10-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12306289U JPH0361325U (en) | 1989-10-20 | 1989-10-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0361325U true JPH0361325U (en) | 1991-06-17 |
Family
ID=31671055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12306289U Pending JPH0361325U (en) | 1989-10-20 | 1989-10-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0361325U (en) |
-
1989
- 1989-10-20 JP JP12306289U patent/JPH0361325U/ja active Pending
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