JPH0361335U - - Google Patents
Info
- Publication number
- JPH0361335U JPH0361335U JP12350089U JP12350089U JPH0361335U JP H0361335 U JPH0361335 U JP H0361335U JP 12350089 U JP12350089 U JP 12350089U JP 12350089 U JP12350089 U JP 12350089U JP H0361335 U JPH0361335 U JP H0361335U
- Authority
- JP
- Japan
- Prior art keywords
- pilot
- sealing device
- hole
- pilot pin
- lower mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第1図は本考案の樹脂封止装置の要部を示す概
略縦断面図、第2図はパイロツトピンをパイロツ
ト孔に嵌め込んだときの要部の概略縦断面図、第
3図は樹脂封止装置の一部切欠概略図、第4図は
サポートブロツクの配置を示すための下型の概略
平面図、第5図は従来の樹脂封止装置の概略図、
第6図は下型の斜視図、第7図はその概略平面図
である。
A……上型、B……下型、1……上型ベース、
2……上型チエイスブロツク、2a……キヤビテ
イ、3……下型ベース、3a……排出孔、4……
下型チエイスブロツク、4a……キヤビテイ、5
……センタブロツク、6……エジエクタピン、6
a……エジエクタプレート、6b……排出孔、7
……パイロツトピン、7a……テーパ部、8……
パイロツト孔、8a……ガイド孔、9……サポー
トブロツク、10……チヤンバ、10a……プラ
グ、11……スプリング、12……移動子、12
a……ピストン部。
Fig. 1 is a schematic longitudinal sectional view showing the main parts of the resin sealing device of the present invention, Fig. 2 is a schematic longitudinal sectional view of the main parts when the pilot pin is fitted into the pilot hole, and Fig. 3 is a schematic longitudinal sectional view of the main parts of the resin sealing device of the present invention. FIG. 4 is a schematic plan view of a lower mold showing the arrangement of support blocks; FIG. 5 is a schematic diagram of a conventional resin sealing device;
FIG. 6 is a perspective view of the lower mold, and FIG. 7 is a schematic plan view thereof. A... Upper mold, B... Lower mold, 1... Upper mold base,
2... Upper die chase block, 2a... Cavity, 3... Lower die base, 3a... Discharge hole, 4...
Lower mold chase block, 4a...Cavity, 5
...Center block, 6...Ejecta pin, 6
a... Ejector plate, 6b... Discharge hole, 7
...Pilot pin, 7a... Taper part, 8...
Pilot hole, 8a... Guide hole, 9... Support block, 10... Chamber, 10a... Plug, 11... Spring, 12... Mover, 12
a...Piston part.
Claims (1)
ロツクを備え、該チエイスブロツクに樹脂封止空
間を造るキヤビテイを形成すると共に上型側にパ
イロツトピン及び下型側に該パイロツトピンが嵌
まり込むパイロツト孔を位置決め用として備えた
樹脂封止装置であつて、前記パイロツト孔に、前
記パイロツトピンの動きに応動して該パイロツト
孔の開口端を開閉可能な移動子を設けたことを特
徴とする半導体装置の樹脂封止装置。 The upper mold and the lower mold each have a base and a chase block, the chase block forms a cavity for creating a resin-sealed space, and a pilot pin is fitted to the upper mold side and a pilot pin is fitted to the lower mold side. 1. A resin sealing device equipped with a hole for positioning, characterized in that the pilot hole is provided with a mover that can open and close the opening end of the pilot hole in response to the movement of the pilot pin. Resin sealing device for equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12350089U JPH0361335U (en) | 1989-10-20 | 1989-10-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12350089U JPH0361335U (en) | 1989-10-20 | 1989-10-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0361335U true JPH0361335U (en) | 1991-06-17 |
Family
ID=31671474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12350089U Pending JPH0361335U (en) | 1989-10-20 | 1989-10-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0361335U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008266848A (en) * | 2007-04-24 | 2008-11-06 | Japcon Enterprise有限会社 | bra |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62212112A (en) * | 1986-03-14 | 1987-09-18 | Matsushita Electric Works Ltd | Apparatus for lead frame loading to molding die assembly in encapsulation of electronic component |
-
1989
- 1989-10-20 JP JP12350089U patent/JPH0361335U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62212112A (en) * | 1986-03-14 | 1987-09-18 | Matsushita Electric Works Ltd | Apparatus for lead frame loading to molding die assembly in encapsulation of electronic component |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008266848A (en) * | 2007-04-24 | 2008-11-06 | Japcon Enterprise有限会社 | bra |