JPH0361386U - - Google Patents

Info

Publication number
JPH0361386U
JPH0361386U JP12090689U JP12090689U JPH0361386U JP H0361386 U JPH0361386 U JP H0361386U JP 12090689 U JP12090689 U JP 12090689U JP 12090689 U JP12090689 U JP 12090689U JP H0361386 U JPH0361386 U JP H0361386U
Authority
JP
Japan
Prior art keywords
component
board
cool
leads
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12090689U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12090689U priority Critical patent/JPH0361386U/ja
Publication of JPH0361386U publication Critical patent/JPH0361386U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Details Of Resistors (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、本考案のフイン構造図であり、第２
図は、本考案の実施例を示す図であり、第３図は
、本考案の利用分野を説明する図である。 図において、１……フイン、２……リード挿入
孔、５……基板、７……部品、８……リード、を
それぞれ示す。 FIG. 1 is a diagram of the fin structure of the present invention, and the second
The figure is a diagram showing an embodiment of the present invention, and FIG. 3 is a diagram illustrating the field of application of the present invention. In the figure, 1...fin, 2...lead insertion hole, 5...board, 7...component, and 8...lead are shown, respectively.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板５に実装される部品７のリード８にフイン
を挿入して、当該部品７の冷却を行うことを特徴
とする放熱構造。 A heat dissipation structure characterized by inserting fins into leads 8 of a component 7 mounted on a board 5 to cool the component 7.
JP12090689U 1989-10-18 1989-10-18 Pending JPH0361386U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12090689U JPH0361386U (en) 1989-10-18 1989-10-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12090689U JPH0361386U (en) 1989-10-18 1989-10-18

Publications (1)

Publication Number Publication Date
JPH0361386U true JPH0361386U (en) 1991-06-17

Family

ID=31668956

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12090689U Pending JPH0361386U (en) 1989-10-18 1989-10-18

Country Status (1)

Country Link
JP (1) JPH0361386U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002223859A (en) * 2001-01-31 2002-08-13 Ebisuya Kogyo Kk Folding table
JP2009017970A (en) * 2007-07-10 2009-01-29 Okamura Corp Foldable table

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002223859A (en) * 2001-01-31 2002-08-13 Ebisuya Kogyo Kk Folding table
JP2009017970A (en) * 2007-07-10 2009-01-29 Okamura Corp Foldable table

Similar Documents

Publication Publication Date Title
JPH0361386U (en)
JPH0381640U (en)
JPS6018550U (en) Heat dissipation structure
JPS6095793U (en) speaker system
JPS6355443U (en)
JPS58116235U (en) Heat dissipation device for electronic components
JPS59117195U (en) equipment case
JPS6018552U (en) Cooling fins for semiconductor devices
JPS60154138U (en) thermal head
JPS5811287U (en) Printed board mounting device
JPS6298292U (en)
JPS5834744U (en) Power diode mounting structure
JPS59107157U (en) GaAs semiconductor device
JPS63106192U (en)
JPS5874345U (en) heat sink fins
JPH0265347U (en)
JPH0350958U (en)
JPS59134770U (en) radiator
JPS6039232U (en) High frequency high power multilayer capacitor
JPS60185344U (en) semiconductor equipment
JPH02106707U (en)
JPS60151140U (en) Grooved heat sink
JPH029443U (en)
JPS58175649U (en) Wind barrel structure of semiconductor rectifier
JPH02138438U (en)