JPH0361387U - - Google Patents

Info

Publication number
JPH0361387U
JPH0361387U JP6376189U JP6376189U JPH0361387U JP H0361387 U JPH0361387 U JP H0361387U JP 6376189 U JP6376189 U JP 6376189U JP 6376189 U JP6376189 U JP 6376189U JP H0361387 U JPH0361387 U JP H0361387U
Authority
JP
Japan
Prior art keywords
case body
electronic device
circuit board
heat dissipation
dissipation device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6376189U
Other languages
Japanese (ja)
Other versions
JPH0735434Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989063761U priority Critical patent/JPH0735434Y2/en
Publication of JPH0361387U publication Critical patent/JPH0361387U/ja
Application granted granted Critical
Publication of JPH0735434Y2 publication Critical patent/JPH0735434Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Rectifiers (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例を示す概略断面図、
第２図は従来例を示す概略断面図である。 １０……ＡＣアダプタ、１１……ケース体、１
１ａ……上ケース、１１ｂ……下ケース、１１ｃ
……凹凸部、１２……回路基板、１３……トラン
ス、１４……半導体、１５……ＡＣインレツト、
１６……ＤＣ出力端子、１７……コード、１８…
…絶縁層、１９……伝熱層、２０……平板、２１
……間〓。 FIG. 1 is a schematic sectional view showing an embodiment of the present invention;
FIG. 2 is a schematic sectional view showing a conventional example. 10...AC adapter, 11...Case body, 1
1a... Upper case, 11b... Lower case, 11c
...Uneven portion, 12...Circuit board, 13...Transformer, 14...Semiconductor, 15...AC inlet,
16...DC output terminal, 17...cord, 18...
... Insulating layer, 19 ... Heat transfer layer, 20 ... Flat plate, 21
...Pause.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ケース体と、該ケース体内に配設された発熱回
路部品を有する回路基板とからなる電子機器にお
いて、該ケース体と、該回路基板の少なくとも下
面側との間に、絶縁性および熱伝導性を備えた平
板を配設し、該ケース体の温度上昇を平均化する
構成としたことを特徴とする電子機器の放熱装置
。 In an electronic device consisting of a case body and a circuit board having heat-generating circuit components disposed inside the case body, insulation and thermal conductivity are provided between the case body and at least the lower surface side of the circuit board. 1. A heat dissipation device for an electronic device, characterized in that the heat dissipation device for an electronic device is configured to have a flat plate provided therein to average out a temperature rise of the case body.
JP1989063761U 1989-05-31 1989-05-31 Heat dissipation device for electronic equipment Expired - Lifetime JPH0735434Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989063761U JPH0735434Y2 (en) 1989-05-31 1989-05-31 Heat dissipation device for electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989063761U JPH0735434Y2 (en) 1989-05-31 1989-05-31 Heat dissipation device for electronic equipment

Publications (2)

Publication Number Publication Date
JPH0361387U true JPH0361387U (en) 1991-06-17
JPH0735434Y2 JPH0735434Y2 (en) 1995-08-09

Family

ID=31594097

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989063761U Expired - Lifetime JPH0735434Y2 (en) 1989-05-31 1989-05-31 Heat dissipation device for electronic equipment

Country Status (1)

Country Link
JP (1) JPH0735434Y2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005019791A (en) * 2003-06-27 2005-01-20 Matsushita Electric Ind Co Ltd Power control device
JP2008135668A (en) * 2006-11-29 2008-06-12 Mitsumi Electric Co Ltd Electronic device casing structure and power supply device
JP2014082147A (en) * 2012-10-18 2014-05-08 Koito Mfg Co Ltd Electronic unit
WO2015146257A1 (en) * 2014-03-27 2015-10-01 シャープ株式会社 Heat-radiating mechanism for electronic apparatus and power supply device
JP2018133846A (en) * 2017-02-13 2018-08-23 矢崎総業株式会社 Battery monitoring device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55159598U (en) * 1979-05-02 1980-11-15

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55159598U (en) * 1979-05-02 1980-11-15

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005019791A (en) * 2003-06-27 2005-01-20 Matsushita Electric Ind Co Ltd Power control device
JP2008135668A (en) * 2006-11-29 2008-06-12 Mitsumi Electric Co Ltd Electronic device casing structure and power supply device
JP2014082147A (en) * 2012-10-18 2014-05-08 Koito Mfg Co Ltd Electronic unit
WO2015146257A1 (en) * 2014-03-27 2015-10-01 シャープ株式会社 Heat-radiating mechanism for electronic apparatus and power supply device
JP2018133846A (en) * 2017-02-13 2018-08-23 矢崎総業株式会社 Battery monitoring device
US10424947B2 (en) 2017-02-13 2019-09-24 Yazaki Corporation Battery monitoring device

Also Published As

Publication number Publication date
JPH0735434Y2 (en) 1995-08-09

Similar Documents

Publication Publication Date Title
JPH0361387U (en)
JPS6298451U (en)
JPS6452247U (en)
JPS61158957U (en)
JPS58175641U (en) Semiconductor component mounting equipment
JPH01108943U (en)
JPS6280340U (en)
JPS6232522U (en)
JPS63138883U (en)
JPH0320461U (en)
JPH0367409U (en)
JPS6155393U (en)
JPH0192141U (en)
JPS63149543U (en)
JPS6176998U (en)
JPS6276496U (en)
JPH0334292U (en)
JPS6224501U (en)
JPS5862586U (en) electric heater for cooking
JPS6232517U (en)
JPS62197861U (en)
JPS62168649U (en)
JPS6320499U (en)
JPS6289148U (en)
JPS5857030U (en) Heat conductive insulation sheet