JPH0361850A - Moisture sensitive element - Google Patents
Moisture sensitive elementInfo
- Publication number
- JPH0361850A JPH0361850A JP1198923A JP19892389A JPH0361850A JP H0361850 A JPH0361850 A JP H0361850A JP 1198923 A JP1198923 A JP 1198923A JP 19892389 A JP19892389 A JP 19892389A JP H0361850 A JPH0361850 A JP H0361850A
- Authority
- JP
- Japan
- Prior art keywords
- moisture
- silver
- compound
- copper
- bacteria
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、空調用や調理用等の湿度制御用に使用される
湿度センナに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a humidity sensor used for humidity control in air conditioning, cooking, and the like.
従来の技術
雰囲気中の湿気に感応して電気抵抗値が変化する感湿抵
抗素子としては、吸湿性高分子樹脂、或は高分子膜など
に炭素などの導電性粒子又は繊維を分散させたもの、又
は親水性高分子膜を用いたもの等がある。Conventional technology A moisture-sensitive resistance element whose electrical resistance value changes in response to humidity in the atmosphere is one in which conductive particles or fibers such as carbon are dispersed in a hygroscopic polymer resin or a polymer film. , or one using a hydrophilic polymer membrane.
発明が解決しようとする課題
しかしながら、前記従来例の構成では高分子化合物が各
種バクテリアによｐ侵され、特性劣化が発生する欠点が
あった。Problems to be Solved by the Invention However, the structure of the conventional example has the drawback that the polymer compound is attacked by various bacteria, resulting in deterioration of characteristics.
本発明は、前記従来の問題点を解決するらのでちゃ、湿
度検知機能を維持し、バクテリアの繁殖を抑制する事を
目的としている。In addition to solving the above-mentioned conventional problems, the present invention aims to maintain the humidity detection function and suppress the proliferation of bacteria.
課題を解決するための手段
本発明は従来の問題点を解決する為に、感湿性高分子化
合物中に、銀、銅からなる化合物を分散させ、あるいは
感湿性高分子膜の大気接触部面に銀、銅からなる化合物
を分散させた多孔質の疎水性高分子樹脂皮膜をコーティ
ングする手段を用いるものである。Means for Solving the Problems In order to solve the conventional problems, the present invention disperses a compound consisting of silver or copper in a moisture-sensitive polymer compound, or disperses it in a moisture-sensitive polymer film on the part of the moisture-sensitive polymer film that comes into contact with the atmosphere. This method uses a method of coating a porous hydrophobic polymer resin film in which a compound consisting of silver and copper is dispersed.
作 用
上記手段により、銀、銅化合物から溶出した銀イオン銅
イオンがバクテリアの繁殖を抑制するものである。Effect: By the above means, the silver and copper ions eluted from the silver and copper compounds suppress the proliferation of bacteria.
実施例
以下本発明の実施例に於ける感湿素子について図面を参
照しながら説明する。EXAMPLE Hereinafter, a moisture sensing element in an example of the present invention will be described with reference to the drawings.
第１図Ａ、Ｂは、本発明の一実施例を示す構造図である
。９６％ア〃ミナ基板１上に対向電極２を形成し、この
上に、銀または銅からなる化合物４を分散させた感湿性
高分子化合物３をコーティングする。FIGS. 1A and 1B are structural diagrams showing one embodiment of the present invention. A counter electrode 2 is formed on a 96% amine substrate 1, and a moisture-sensitive polymer compound 3 in which a compound 4 made of silver or copper is dispersed is coated thereon.
あるいは、対向電極２上に感湿性高分子化合物３をコー
ティングし、その上に銀または銅からなる化合物４を分
散させた多孔質の疎水性高分子化合物５を保護膜として
コーティングする。Alternatively, a moisture-sensitive polymer compound 3 is coated on the counter electrode 2, and a porous hydrophobic polymer compound 5 in which a compound 4 made of silver or copper is dispersed thereon is coated as a protective film.
本実施例として銀、銅化合物としては、銀粉。In this example, silver powder is used as the copper compound, and silver powder is used as the copper compound.
銅粉、および硝酸銀、塩化銅を用いた。筐た感湿性高分
子化合物としてポリアクリル酸ソーダ、保護膜としては
炭素粉末を分散させたエポキシ系樹脂を用いた。Copper powder, silver nitrate, and copper chloride were used. Sodium polyacrylate was used as the moisture-sensitive polymer compound in the enclosure, and epoxy resin in which carbon powder was dispersed was used as the protective film.
比較例としては、銀、銅化合物を添加しない試料を上記
材料を用い作製した。As a comparative example, a sample to which no silver or copper compound was added was prepared using the above materials.
バクテリアＷ囲気テスト装置を第２図に示した。Figure 2 shows the Bacteria W ambient test device.
バクテリア培養槽６中に活性汚泥用バクテリア菌溶液７
を入れ、この槽内にｇ湿素子９を設置し、エアー配管８
によシバクチリア菌溶液を湯気する。Bacteria solution 7 for activated sludge in bacteria culture tank 6
, install the g-humidity element 9 in this tank, and connect the air piping 8.
Steam the Bacteria solution.
この様にして行なったバクテリア雰囲気テスト（ｉｓ気
時間９６時間）結果を表１に示す。Table 1 shows the results of the bacterial atmosphere test (96 hours of air time) conducted in this manner.
銀・銅化合物の添加量は、樹脂に対し０．２重量肇を添
加した。The amount of silver/copper compound added was 0.2 weight by weight based on the resin.
表−１をみると、本特許品１〜８に比較し、比較例の抵
抗値変化が著しく悪い事がわかる。悪化原因としては、
バクテリアによる分子鎖の切断による高分子化合物の変
質と思われる。Looking at Table 1, it can be seen that the resistance value change of the comparative example is significantly worse than that of the patented products 1 to 8. The cause of the deterioration is
This is thought to be the deterioration of the polymer compound due to molecular chain scission caused by bacteria.
本実施例としては銀・銅化合物として、銀粉末銅粉末、
硝酸銀、塩化銅を用いたが、キレート化合物等信の化合
物、銀・銅を副成分として含む化合物（例えば銅−亜鉛
化合物、銀−スズ化合物）であっても、銀・副成分を含
有すれば同等の機能を持つ。感湿性高分子化合物として
ポリアクＩＪ／ｌ／酸ソーダを用いたが、ポリスチレン
スルホン酸塩等を用いても同等の効果がある。In this example, as the silver/copper compound, silver powder copper powder,
Although silver nitrate and copper chloride were used, compounds such as chelate compounds, compounds containing silver and copper as subcomponents (e.g. copper-zinc compounds, silver-tin compounds) can also be used if they contain silver or subcomponents. Has equivalent functionality. Although polyac IJ/l/acid soda was used as the moisture-sensitive polymer compound, the same effect can be obtained by using polystyrene sulfonate or the like.
多孔質の疎水性高分子化合物としてエポキシ樹脂を用い
たがスチレンージビニ〃ベンゼンの共重合体等信の樹脂
を用いても同等の機能を有するものであれば同等の効果
がある。Although an epoxy resin is used as the porous hydrophobic polymer compound, a resin such as a styrene-divinybenzene copolymer may also be used as long as it has the same function and has the same effect.
又、本発明の実施例では感湿膜あるいは保護膜に銀・銅
化合物を入れたが、感湿膜及び保護膜の両者に添加した
構造のものであっても同等の効果がある。Further, in the embodiments of the present invention, the silver/copper compound is added to the humidity sensitive film or the protective film, but the same effect can be obtained even if the silver/copper compound is added to both the humidity sensitive film and the protective film.
発明の効果
本発明の感湿素子は、バクテリア抑制力の高いものであ
る。Effects of the Invention The moisture-sensitive element of the present invention has a high ability to inhibit bacteria.
第１図Ａ、Ｂは本発明の一実施例を説明する感湿素子の
構造図、第２図はバクテリア雰囲気テスト装置の構造図
である。
１・・・・・・９６％６％アルミナ、２・・・・・・対
向電極、３・・・・・・感湿性高分子化合物、４・・・
・・・銀又は銅からなる化合物、５・・・・・・多孔質
の疎水性高分子化合物、６・・・・・・バクテリア培養
槽、７・・・・・・活性汚泥用バクテリア菌溶液、８・
・・・・・湯気用エアー配管、９・・・・・・感湿素子
。FIGS. 1A and 1B are structural diagrams of a moisture sensing element illustrating an embodiment of the present invention, and FIG. 2 is a structural diagram of a bacterial atmosphere test device. 1...96%6% alumina, 2...Counter electrode, 3...Moisture-sensitive polymer compound, 4...
... Compound consisting of silver or copper, 5 ... Porous hydrophobic polymer compound, 6 ... Bacteria culture tank, 7 ... Bacteria solution for activated sludge. , 8・
... Air piping for steam, 9 ... Moisture sensing element.
Claims (4)
おいて、感湿材中に銀、銅の１種又は両者からなる化合
物を分散させた事を特徴とする感湿素子。(1) A humidity sensor using an organic polymer compound as a moisture-sensitive material, characterized in that a compound consisting of one or both of silver and copper is dispersed in the moisture-sensitive material.
る事を特徴とする特許請求の範囲第１項記載の感湿素子
。(2) The moisture-sensitive element according to claim 1, wherein the organic polymer compound is sodium polyacrylate.
は繊維を分散させたものである事を特徴とする特許請求
の範囲第１項記載の感湿素子。(3) The moisture-sensitive element according to claim 1, wherein the organic polymer compound is a polymer film in which conductive particles or fibers are dispersed.
おいて、感湿膜上に銀、銅の、種又は両者からなる化合
物を分散させた多孔質の疎水性高分子樹脂皮膜をコーテ
ィングする事を特徴とする感湿素子。(4) In a humidity sensor using an organic polymer compound as a moisture-sensitive material, coating the moisture-sensitive film with a porous hydrophobic polymer resin film in which silver, copper, seeds, or a compound consisting of both are dispersed. A moisture-sensitive element characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1198923A JP2830127B2 (en) | 1989-07-31 | 1989-07-31 | Moisture sensitive element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1198923A JP2830127B2 (en) | 1989-07-31 | 1989-07-31 | Moisture sensitive element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0361850A true JPH0361850A (en) | 1991-03-18 |
| JP2830127B2 JP2830127B2 (en) | 1998-12-02 |
Family
ID=16399210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1198923A Expired - Fee Related JP2830127B2 (en) | 1989-07-31 | 1989-07-31 | Moisture sensitive element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2830127B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013161559A1 (en) * | 2012-04-24 | 2013-10-31 | 株式会社村田製作所 | Humidity sensor element and method of fabricating same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52151889A (en) * | 1976-06-10 | 1977-12-16 | Matsushita Electric Ind Co Ltd | Moisture sensing resistance element |
| JPS6066143A (en) * | 1983-09-21 | 1985-04-16 | Taiyo Yuden Co Ltd | Moisture-sensitive resistor |
-
1989
- 1989-07-31 JP JP1198923A patent/JP2830127B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52151889A (en) * | 1976-06-10 | 1977-12-16 | Matsushita Electric Ind Co Ltd | Moisture sensing resistance element |
| JPS6066143A (en) * | 1983-09-21 | 1985-04-16 | Taiyo Yuden Co Ltd | Moisture-sensitive resistor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013161559A1 (en) * | 2012-04-24 | 2013-10-31 | 株式会社村田製作所 | Humidity sensor element and method of fabricating same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2830127B2 (en) | 1998-12-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |