JPH0362508A - Manufacture of laminated ceramic electronic part - Google Patents

Abstract

PURPOSE:To obtain a stable laminate even if thinner raw sheets are used by bonding a raw sheet, which comprises electrode ink and ceramic slurry printed on a supporting body by screen printing, to an other raw sheet or electrodes by thermocompression and then peeling only said supporting body for transcription. CONSTITUTION:Electrodes 20a and ceramic slurry 21 are printed on a supporting body 18a by screen printing to form an electrodes-buried ceramic raw sheet 22. A hot board 24 heated with heaters 23 is placed in the side, where raw sheet 22 of the supporter 18a is not formed. A supporting body 18 fixed to a pedestal 17 and a raw ceramic laminate 19 in which electrodes 20 are formed are placed at the side with the raw sheet 22. The raw sheet 22 is bonded to the surface of the laminate 19 by thermocompression with the hot board 24, and only the supporting body 18a is peeled. Thereby the raw sheet 22 is transcribed on to the surface of the laminate 19 and a transcribed electrodes-buried ceramic raw sheet 27 consisting of transcribed electrodes 25 and a transcribed ceramic raw sheet 26 is obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for manufacturing multilayer ceramic electronic components such as multilayer ceramic capacitors that are widely used in electrical products such as video tape recorders and liquid crystal televisions. In addition, it can be widely used in manufacturing multilayer ceramic electronic components such as multilayer ceramic substrates, multilayer varistors, and multilayer piezoelectric elements.

BACKGROUND OF THE INVENTION In recent years, in the field of electronic components, as the density of circuit components has increased, there has been a desire for monolithic ceramic capacitors and the like to be made smaller and have higher performance.

FIG. 10 is a cross-sectional view of a portion of the multilayer ceramic capacitor. In FIG. 10, 1 is a ceramic dielectric layer, 2 is an internal electrode, and 3 is an external electrode. The internal electrodes 2 are each connected to external electrodes 3.

Conventionally, multilayer ceramic capacitors have been manufactured by the following manufacturing method.

First, a predetermined electrode ink is printed on a ceramic green sheet cut into a predetermined size, the electrode ink is dried to form an electrode ink film, and the required number of ceramic green sheets with this electrode ink film formed are printed. The ceramic raw laminate is then cut into a desired shape, fired, and external electrodes are attached to complete the ceramic raw laminate.

However, with this method of directly printing electrode ink on a green ceramic sheet, when printing electrode ink on a green ceramic sheet, the ceramic green sheet may swell or be eroded by the solvent contained in the electrode ink. It was becoming a problem to do so. Furthermore, as the raw ceramic sheet becomes thinner, pinholes are more likely to occur in the raw ceramic sheet itself, resulting in the problem of short-circuiting between internal electrodes.

For this reason, several approaches have been taken in the past to try to solve this problem by embedding an electrode ink film inside the green ceramic sheet.

Such an electrode embedding method is described in Japanese Patent Application Laid-Open No. 56-1
As disclosed in Japanese Patent Publication No. 69314, an electrode ink film is printed on a support, and then a ceramic raw sheet is formed thereon by a casting method. Kosho 60-2920
Apply electrode ink as disclosed in Publication No. 9.

After drying, there is a method of continuously applying a ceramic slurry and peeling it off from the support to obtain an electrode-embedded ceramic green sheet.

However, since the electrode-embedded ceramic raw sheets made by these methods are peeled from the support and laminated, as the thickness of the film becomes thinner, the mechanical strength is extremely reduced, so it can no longer be handled by itself. become unable.

For this reason, it was not possible to reduce the thickness to about 15 microns or less.

Furthermore, as disclosed in JP-A-56-169315, a green ceramic sheet is formed on an undried electrode ink by a casting method or a printing method, and then the green ceramic sheet is transferred together with the electrode ink from a support. A method of forming electrodes on a raw ceramic sheet has been proposed, which is characterized by peeling. However, in this case as well, there is a problem in that the thinner the electrode-embedded ceramic green sheet is, the lower its mechanical strength is. For this reason, especially 15
In the case of a green ceramic sheet with embedded electrodes having a size of about .mu.m or less, there is a problem that the green ceramic sheet with embedded electrodes stretches or breaks when it is peeled off from the support. For this reason, no matter how good the punching accuracy (rate of change in outer diameter dimension of the punched sheet) is for the electrode-embedded ceramic green sheet after it has been peeled off from the support, the thinner the electrode-embedded ceramic green sheet is, the more difficult it is to machine. Due to the reduced physical strength, there was a problem in that the electrode-embedded ceramic green sheet could be partially stretched or broken when the electrode-embedded ceramic green sheet was peeled from the support.

Next, referring to FIG. 11, the manner in which the raw ceramic sheet with embedded electrodes is peeled off from the surface of the support will be described. 11th
In the figure, 4 is an electrode, 5 is a raw ceramic sheet, and the electrode 4 and the raw ceramic sheet 5 form an electrode-embedded raw ceramic sheet 6. Moreover, 7 is a support body, and the electrode-embedded ceramic green sheet 6 is formed on the surface of this support body 7. Further, in FIG. 11, arrows indicate the direction and force for peeling off the electrode-embedded ceramic raw sheet 6. Also, the 11th
In the figure, part A is the part of the raw ceramic sheet 6 with embedded electrodes that has been peeled off from the support 7, part B is the part where the raw ceramic sheet 6 with embedded electrodes is being peeled off from the support 7, and part C is the part where the raw ceramic sheet 6 with embedded electrodes is being peeled off from the support 7. 1 shows a portion where the electrode-embedded ceramic green sheet 6 formed on the support 7 has not been peeled off.

As shown in FIG. 11, when peeling the electrode-embedded ceramic green sheet 6 from the support 7, since the support 7 is stronger, it can only be peeled off from the electrode-embedded ceramic green sheet 6.

For this reason, the electrode-embedded ceramic green sheet 6 is peeled off from the surface of the support 7 in the form shown in FIG. , A and B are directly subjected to peeling force, so the thinner the electrode-embedded ceramic raw sheet is, the greater stress will be generated. As the electrode-embedded ceramic raw sheet becomes thinner, the mechanical strength of the electrode-embedded ceramic raw sheet itself decreases, and as a result, the electrode-embedded ceramic raw sheet becomes more likely to be destroyed. The raw ceramic sheet with embedded electrodes subjected to a large force during such peeling has cracks and local elongation, so even if the punching accuracy after peeling is excellent, the yield is high and reliability is high. It is not possible to manufacture multilayer ceramic electronic components. Furthermore, in order to improve the peelability of the raw ceramic sheet with embedded electrodes from the surface of the support, a peeling treatment can be performed on the surface of the support using silicone resin or the like.

However, if the releasability of the surface of the support is improved, there is a problem that the electrode ink itself is repelled when printing the electrode ink, making it impossible to print accurately.

Furthermore, in the above-mentioned Japanese Patent Application Laid-Open No. 56-169315, the coating amount of electrode ink and the ceramic 5. The relationship between the amount of slurry applied has not been clarified. Next, the relationship between the amount of electrode ink applied and the amount of ceramic slurry applied will be explained using FIG. In Figure 12, 8 and 8a
is electrode ink, 9 is a screen, 10 is a squeegee, 11
and 11a is a ceramic slurry. In FIG. 12, a ceramic slurry 11 is applied by a screen printing method using a screen 9 onto an electrode ink 8 that has been previously formed on a support 7 by a method such as printing. On this occasion,
When the amount of electrode ink 8 applied is larger than the amount of ceramic slurry applied, the upper part of electrode ink 8 is removed by squeegee 1 when applying ceramic slurry 11, as shown in FIG.
0, and as shown in the electrode ink 8a, the coating thickness decreases. Furthermore, at this time, the electrode ink 8 is mixed with the ceramic slurry 11a by the squeegee 10, and is mixed into the finished ceramic raw sheet. For this reason, the reliability of the completed multilayer ceramic electronic component is lowered, such as by lowering the breakdown voltage.

For this reason, Japanese Patent Application Laid-Open No. 59-172711 proposes a method of manufacturing a multilayer ceramic capacitor by embedding electrodes formed on a support in a raw ceramic sheet, laminating the sheets together with the support, and firing. However, in order to fire the entire support, it is necessary to use a support that has a very thin film thickness of about 1.5 to 14 microns. Further, the amount of the support to be fired increases in proportion to the number of laminated layers, and delamination (separation between layers) is likely to occur. Therefore, as the number of layers increases, the support needs to be made thinner. Also, such thin supports are difficult to handle.
Mechanical strength is also poor. Furthermore, the occurrence of unevenness due to the thickness of the electrode ink film could not be reduced. For this reason, in addition to the occurrence of delamination, this method also poses a problem in lamination accuracy.

Problems to be Solved by the Invention In the manufacturing method of such a laminated ceramic electronic component, the thinner the electrode-embedded ceramic raw sheet is, the more
It becomes impossible to stably peel off the electrode-embedded ceramic raw sheet. Furthermore, since the electrode-embedded ceramic raw sheet after peeling has low mechanical strength, it cannot withstand lamination work such as positioning with high precision during lamination.

Moreover, even if laminated, cracks, elongation, etc. are likely to occur when the electrode-embedded ceramic green sheet is peeled off from the support. As a result, there has been a problem in that the thinner the ceramic raw sheet is, the more it is not possible to perform lamination with a high yield.

Further, when embedding conventional undried electrode ink into a green ceramic sheet, there was a problem in that the electrode ink was mixed into the green ceramic sheet.

In view of the above-mentioned problems, the present invention has been developed by thermally pressing an electrode-embedded ceramic raw sheet onto another ceramic raw sheet or another electrode 0 without peeling it from the support, and then peeling off only the support. It has a configuration that can transfer embedded ceramic raw sheets, and even when the thickness of the electrode-embedded ceramic raw sheets is as thin as about 15 μm or less, the electrode-embedded ceramic raw sheets can be transferred with high precision and high speed. The purpose is to perform alignment during lamination. Another object of the present invention is to provide a manufacturing method that can prevent the electrode ink from mixing with the green ceramic sheet and reducing its reliability when the electrode ink is embedded in the green ceramic sheet.

Means for Solving the Problems In order to solve the above problems, the method for manufacturing a multilayer ceramic electronic component of the present invention includes printing an electrode ink on a support,
A ceramic slurry is printed on the support containing the electrode ink while the printed electrode ink is undried or semi-dry using a screen that can obtain a coating thickness greater than the screen printing, and then dried. After thermocompression-bonding the electrode-embedded ceramic raw sheet manufactured by the above-mentioned method onto another ceramic raw sheet or another electrode without peeling it from the support, only the support is peeled off, and the electrode-embedded ceramic raw sheet is is configured to be transferred onto the other green ceramic sheet or another electrode.

According to the present invention, with the above-described configuration, the electrode-embedded ceramic raw sheet can be handled together with the support, so that even the electrode-embedded ceramic raw sheet, which is thin and has low mechanical strength, can be easily handled during work. In addition, the positioning during lamination is not done using raw ceramic sheets, but with a mechanical strength of 1
Since a support with excellent dimensional accuracy is used, the lamination accuracy can be improved. In addition, when peeling the support from the ceramic raw sheet with embedded electrodes,
The raw ceramic sheet with embedded electrodes must be firmly transferred onto other raw ceramic sheets or other electrodes, so even if the raw ceramic sheet with embedded electrodes has low mechanical strength, it can be stably supported. This means that the body can be exfoliated.

In addition, in the present invention, by increasing the amount of ceramic slurry applied than the amount of electrode ink, when the ceramic slurry is applied on the undried electrode ink, the electrode ink is The printed shape and thickness of the printed material will not change.

EXAMPLE Hereinafter, a method of manufacturing and a method of laminating a multilayer ceramic capacitor according to an example of the present invention will be described with reference to the drawings.

FIG. 1 is a diagram for explaining a method for producing a raw ceramic sheet with embedded electrodes used in the present invention. In FIG. 1, 12 is a support, 13 and 13a are electrode ink, 14 is a screen, 15 and 15a are ceramic slurry, and 16 is a squeegee. In Figure 1,
The coating amount of electrode ink 13 is ceramic slurry 15
coating amount. Therefore, as shown in FIG. 1, the electrode ink 13 is not scraped off by the squeegee 16 and becomes the electrode 13a embedded in the ceramic slurry 15a.

FIGS. 2 and 3 are diagrams for explaining how electrode-embedded ceramic raw sheets are laminated in the first embodiment of the present invention. 2 and 3, 17 is a stand, 18.18a is a support, 19 is a ceramic green laminate, 20.20a is an electrode, 21 is a ceramic green sheet, 2
2 is a raw ceramic sheet with embedded electrodes;
a and a raw ceramic sheet 21. 23
24 is a heater, 24 is a hot plate, 25 is a transferred electrode, 26 is a transferred ceramic green sheet, 27 is a transferred electrode-embedded ceramic green sheet, and the transferred electrode 2
5 and a transferred ceramic green sheet 26. Further, the arrow indicates the direction in which the heating plate 24 moves.

First, explanation will be given using FIG. 2. First, the hot platen 24 heated by the heater 23 is placed on the side of the support 18a where the electrode-embedded ceramic green sheet 22 is not formed.

On the other hand, a support 18 fixed on the stand 17 is placed on the side of the support 18a on which the electrode-embedded ceramic raw sheet 22 is formed.
And a ceramic raw laminate 19 is placed. At this time, the electrodes 20 are formed on the surface of the raw ceramic laminate 19 by an appropriate method such as transfer or printing. Here, the electrode 20 does not necessarily need to be formed on the surface of the raw ceramic laminate 19. Further, the support body 18 may also be used as necessary. Next, from the state shown in FIG. 2, the electrode-embedded ceramic green sheet 22 formed on the surface of the support body 18a is hot-pressed onto the surface of the ceramic green laminate 19 using the hot platen 24.

Next, explanation will be given using FIG. 3. This FIG. 3 is a diagram after the electrode-embedded ceramic green sheet 22 shown in FIG. 2 has been transferred. That is, as shown in FIG. 3, the electrode embedded ceramic green sheet 22 on the support body 18a is transferred onto the surface of the ceramic green laminate 19 by the heating plate 24, and thereby the transferred electrode 25 and the transferred ceramic green sheet are transferred to the surface of the ceramic green laminate 19. A transferred electrode-embedded ceramic green sheet 27 composed of 26 is formed.

Further, FIGS. 4 and 5 show a modification of the first embodiment, in which a ceramic raw laminate 19 on which an electrode 20 is formed is shown.
The ceramic raw sheet 21a formed on the support 18a is heat-pressed onto the surface of the support 18a to form a transferred ceramic raw sheet 28, and then the electrode-embedded ceramic raw sheet 22 is heat-pressed. Here, it is also possible to laminate multiple layers by repeating the steps shown in FIGS. 2 and 3 and the steps shown in FIGS. 4 and 5.

Next, it will be explained in more detail. First, as the electrode ink for forming the electrode ink film, commercially available electrode ink (
A solvent was added to the Pd paste for multilayer capacitor internal electrodes, and the viscosity and drying speed were adjusted to an appropriate level (hereinafter simply referred to as electrode ink).

Next, we will explain how to make ceramic slurry. First, a thermoplastic resin containing polyvinyl butyral resin is added to a solvent and a plasticizer, and after it is sufficiently dissolved, a ceramic powder mainly consisting of barium titanate with a particle size of about 1 micron is added to this using a three-roll mill. It was dispersed and filtered using a predetermined filter to obtain a ceramic slurry (hereinafter simply referred to as ceramic slurry).

Next, how to make a raw ceramic sheet with embedded electrodes will be explained. First, as a support, a polyethylene terephthalate film was used, which had been subjected to a weak release treatment that allowed accurate printing of a commercially available electrode ink having a film thickness of 75 microns. Next, the electrode ink was continuously printed on this with a predetermined electrode pattern at regular intervals using a screen printing method (equivalent to stainless steel #400 mesh). Here, the shape of the electrode is 3.5×1.0
A millimeter one was used. After printing the electrode ink, and before the electrode ink dried, a ceramic slurry was applied using a screen printing method (equivalent to #320 stainless steel mesh) so as to completely cover the entire surface of the printed electrode ink. . Next, by drying the electrode ink and ceramic slurry using a hot air dryer,
A green ceramic sheet with embedded electrodes was formed on a support. Here, when we measured the film thickness of only the ceramic raw sheet of the completed electrode-embedded ceramic raw sheet using a micrometer, we found that the thickness of the ceramic raw sheet was 1
It was 6 microns.

Next, a method for manufacturing a multilayer ceramic capacitor using this electrode-embedded ceramic green sheet 22 will be described. First, a raw ceramic laminate 19 having a thickness of 200 microns and on which no electrodes were formed was fixed together with the support 18 on the stand 17 shown in FIG. 2. On top of this, as many electrode-embedded green ceramic sheets 22 as required were transferred as shown in FIGS. 2 and 3. Here, the transfer is performed at a temperature of 80°C and a pressure of 15°C.
Support 18 under conditions of kilograms per square centimeter
The heating plate 24 was used to transfer the electrode-embedded raw ceramic sheet 22 from the side a, and the support 18a was peeled off.

Thereafter, this process was repeated so that the electrodes were alternately shifted as shown in FIG. 10, so that there were 101 layers of electrodes. Finally, to prevent warping during firing and to increase mechanical strength, a raw ceramic sheet with no electrodes was transferred to a thickness of 200 microns. The thus obtained laminate was cut into chips of 2.4 x 1.6 mm, and then fired at 1300° C. for 1 hour (hereinafter referred to as the invention product).

Next, as an example of the conventional construction method, the electrode-embedded ceramic green sheet formed on the support is peeled off from the support, and the peeled electrode-embedded ceramic green sheet is divided into two 200 μm thick ceramic green sheets. between the sheets,
The electrodes were stacked in 101 layers and pressed to form a laminate, which was cut into chips of 2.4 x 1.6 millimeters and fired at 1300° C. for 1 hour (hereinafter referred to as conventional product ①).

Table 1 shows the comparison results between the invented product and the conventional product.

(Margin below) <Table 1> In Table 1, in the case of the invented product, since it can be handled with the support, compared to the conventional product, it has improved handling (1) dimensional accuracy, (9) lamination accuracy, (9) mechanical strength, and lamination accuracy. were both excellent. Furthermore, regarding the lamination speed, the conventional product was superior to the invented product (which laminated one layer at a time) because it could laminate a predetermined number of layers at once.

However, with conventional products, as the electrode-embedded ceramic raw sheet becomes thinner, the handling properties deteriorate rapidly, and when the electrode-embedded ceramic raw sheet is peeled from the support surface, the electrode-embedded ceramic raw sheet may tear or stretch. Therefore, it was almost impossible to obtain a raw ceramic sheet with embedded electrodes that could be used for lamination. Additionally, the raw ceramic sheet with embedded electrodes that could barely be peeled off was so thin that it was almost impossible to handle it, and it also spread unevenly. I couldn't get it. For this reason, in conventional products, most of the raw ceramic sheets with embedded electrodes were defective during the peeling process, and very few of them were able to proceed to the firing process.

Next, a green ceramic sheet with embedded electrodes was manufactured by varying the amount of electrode ink and ceramic slurry applied. The results are shown in Table 2 below. In addition, the second
In the table, a stainless steel screen (# is the mesh number of the screen) was used for printing the electrode ink and ceramic slurry. In addition, in Table 2, the result refers to whether or not the electrode ink was scraped off with a squeegee and mixed into the ceramic slurry and ceramic raw sheet when electrode ink and ceramic slurry were printed with the mesh number of the screen used. The results of the investigation are shown (◯: no contamination, △: some contamination, ×: large amount of contamination).

Table 2 As shown in Table 2, when comparing the mesh numbers of the screens used for electrode ink and those for ceramic slurry, the screen for electrode ink is superior to that for ceramic slurry. It can be seen that using a screen with a higher mesh number (lower coating amount) reduces the amount of electrode ink mixed into the ceramic slurry.

Moreover, FIGS. 6(A) to 6(C) are diagrams for explaining how a ceramic slurry is applied onto undried electrode ink and then dried to form an electrode-embedded ceramic raw sheet. In FIGS. 6(A) to (C), 12
a is a support, 13b is an electrode ink, 15b is a ceramic slurry, 20b and 20c are electrodes, 21b and 21
c is a raw ceramic sheet. Furthermore, Fig. 6(A)
Figure (B) and Figure (C) are for explaining the state of ceramic slurry applied to undried electrode ink; It is formed by drying a slurry of electrode ink and ceramic.

Here, the difference between Fig. 6 (B) and (C) is that when the volume shrinkage due to drying of the electrode ink is smaller than the volume shrinkage due to drying of the ceramic slurry (case B), and when it is larger (
This is for explaining the case of C). In other words, when the volume change due to drying is larger for the ceramic slurry, the part where the electrode is present becomes convex, as shown in (B), and when the volumetric shrinkage of the ceramic slurry is smaller, as shown in (C)
), the part where the electrode is located may become concave.

In such a case, it is also possible to stack them as shown in FIGS. 7 and 8. FIGS. 7 and 8 are diagrams for explaining how to stack electrode-embedded ceramic green sheets having uneven surfaces.

7 and 8, 17a is a stand, 18b and 1
8c is a support body, 19a is a ceramic raw laminate, 20b and 20c are electrodes, 21a is a ceramic raw sheet, 22a
is a raw ceramic sheet with embedded electrodes, 23a is a heater,
24a is a heating plate, 25a is a transferred electrode, 26a is a transferred ceramic green sheet, and 27 is a transferred electrode-embedded ceramic green sheet. By doing as shown in Fig. 7 and Fig. 8, even when using a raw ceramic sheet with embedded electrodes having an uneven surface as shown in Fig. 6 (B) or (C), it is possible to combine the unevenness. , lamination work can be performed while making the surface of the ceramic raw laminate flat.

Next, FIG. 9 is a diagram for explaining a method of transferring an electrode-embedded ceramic raw sheet using a heat roller in a second embodiment of the present invention. In FIG. 9, 28 is a heat roller whose temperature is set to a constant temperature by a heater 23b. And electrode-embedded ceramic raw sheet 2
2b passes between the ceramic green laminate 19b and the heat roller 28, the electrode-embedded ceramic green sheet 27b is transferred to the surface of the ceramic green laminate 19b, becoming a transferred electrode-embedded ceramic green sheet 27b.

According to this method, the electrode-embedded ceramic green sheet can be transferred continuously, and the lamination speed of the electrode-embedded ceramic green sheet can be further increased.

In particular, in the present invention, it is not necessary that all electrode-embedded ceramic green sheets be completely flattened. In other words, as shown in Figs. 7 and 8, even if the part of the surface of the electrode-embedded ceramic raw sheet where the electrode is embedded is not completely flattened and some unevenness remains, the part where the electrode is embedded will be concave. By laminating it in combination with the electrode-embedded ceramic raw sheet, the total laminate can absorb the thickness of the electrode.

In addition, in the present invention, in addition to the number of meshes, the screen used for electrode printing and the screen used for printing ceramic slurry, the type, material, and structure of the screen (knitted, plated, etc.) It was also effective to change the

In the present invention, in addition to heat, light, electron beams, microwaves, X-rays, etc. may be used for the transfer. Furthermore, by changing the type of resin used, the type and amount of plasticizer added, it is possible to improve storage stability, lower the transfer temperature (room temperature), and increase the speed of lamination.

Furthermore, the manufacturing method of the present invention can be applied not only to the multilayer ceramic capacitors described in the above embodiments but also to other multilayer ceramic electronic components such as multilayer ceramic substrates and multilayer varistors.

Effects of the Invention As described above, the present invention involves screen printing an electrode ink on a support, and applying a ceramic slurry onto the support containing the electrode ink while the electrode ink is undried or semi-dry. After printing using a screen that can obtain a coating thickness greater than that of screen printing, the electrode-embedded ceramic raw sheet produced by drying is printed on another ceramic raw sheet or other electrode without peeling from the support. Even if the electrode-embedded ceramic raw sheet becomes thinner by peeling off only the support after thermocompression bonding and transferring the electrode-embedded ceramic raw sheet onto the other ceramic raw sheet or another electrode, This allows stable lamination of electrode-embedded ceramic raw sheets. In addition, since the raw ceramic sheet with embedded electrodes itself can be handled simultaneously with the support, it can be handled without reducing its mechanical strength, and can be laminated with high precision, making it possible to manufacture laminated ceramic electronic components with high yield. I can do it.

[Brief explanation of drawings]

FIG. 1 is a diagram for explaining the method for manufacturing a raw ceramic sheet with embedded electrodes used in the present invention, and FIGS. 2 and 3 show how the raw ceramic sheets with embedded electrodes are laminated in the first embodiment of the present invention. Figures 4 and 5 are diagrams for explaining a modification of the first embodiment, and Figures 6 (A) to (C) are diagrams showing ceramic coatings on undried electrode ink. This figure is for explaining how slurry is applied and then dried to form a green ceramic sheet with embedded electrodes. Figures 7 and 8 illustrate how green ceramic sheets with embedded electrodes with uneven surfaces are laminated. FIG. 9 is a diagram for explaining the method of transferring an electrode-embedded ceramic raw sheet using a heat roller in the second embodiment of the present invention, and FIG. 10 is a diagram for explaining a part of a multilayer ceramic capacitor. A diagram showing a cross section, Figure 11 is a diagram illustrating how a green ceramic sheet with embedded electrodes is peeled from the surface of a support in a conventional example, and Figure 12 is a diagram showing the amount of electrode ink applied and the amount of ceramic slurry applied. FIG. 12... Support, 13.13a... Electrode ink, 14... Screen, 15, 15a
... Ceramic slurry 16 ...
Squeegee, 17, 17a. 17b...stand, 18, 18a, 18b, 1
8c...Support, 19, 19a, 19b...
...Ceramic raw laminate, 20, 20a, 20b, 2
0c, -=... Electrode, 21, 21a... Ceramic raw sheet), 22° 22a... Electrode embedded ceramic raw sheet, 23° 23 a, 23 b=
・-・Heater, 24. 24 a, -... Hot plate, 25, 25a, 25b... Transferred electrode,
26.26a, 26b...Transferred ceramic green sheet, 27.27a, 27b...Transferred electrode ceramic green sheet, 28...Heat roller. 12--Screen Is, tsLL-u 14-Screen Is, 15tt-"Ceramic slurry 16-
Sun-V t7-f8. /8 mountain - "Support Ceramic Main Sorting Figure Figure 6 Figure Figure Figure Figure 10 J Figure 1 Figure 1 Figure 12//aL

Claims (1)

[Claims] Screen print electrode ink on a support, and apply a ceramic slurry onto the support containing the electrode ink while the printed electrode ink is undried or semi-dry.
The electrode-embedded ceramic raw sheet produced by printing using a screen that can obtain a coating thickness greater than the screen printing thickness and drying is then printed on another ceramic raw sheet or other electrode without peeling from the support. 1. A method for manufacturing a multilayer ceramic electronic component, characterized in that after thermocompression bonding, only the support is peeled off, and the electrode-embedded ceramic raw sheet is transferred onto the other ceramic raw sheet or another electrode.