JPH0362664U - - Google Patents

Info

Publication number
JPH0362664U
JPH0362664U JP12007189U JP12007189U JPH0362664U JP H0362664 U JPH0362664 U JP H0362664U JP 12007189 U JP12007189 U JP 12007189U JP 12007189 U JP12007189 U JP 12007189U JP H0362664 U JPH0362664 U JP H0362664U
Authority
JP
Japan
Prior art keywords
circuit board
solder
moved
molten solder
movement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12007189U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12007189U priority Critical patent/JPH0362664U/ja
Publication of JPH0362664U publication Critical patent/JPH0362664U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の浸漬半田付装置の実施例を示
す構成図、第2図は従来の技術の浸漬半田付装置
を示す構成図である。 12……半田浴槽、14……ヒータ、15……
ポンプ、16……ノズル、Pc……回路基板。
FIG. 1 is a block diagram showing an embodiment of the immersion soldering apparatus of the present invention, and FIG. 2 is a block diagram showing a conventional immersion soldering apparatus. 12...Solder bathtub, 14...Heater, 15...
Pump, 16... Nozzle, Pc... Circuit board.

Claims (1)

【実用新案登録請求の範囲】 電子部品が装着された回路基板が直線的に移動
し、且つ噴流半田に接触して半田付が行なわれる
浸漬半田付装置にあつて、 前記回路基板を進行方向に直線移動せしめる移
動手段と、 前記回路基板の移動時に溶解半田が接触すべく
前記回路基板の直線移動方向に噴流せしめる溶解
半田噴流手段と、 を具備することを特徴とする浸漬半田付装置。
[Scope of Claim for Utility Model Registration] An immersion soldering device in which a circuit board on which electronic components are mounted moves linearly and contacts jet solder to perform soldering, wherein the circuit board is moved in the direction of movement. An immersion soldering apparatus comprising: a moving means for linearly moving the circuit board; and a molten solder jetting means for causing the molten solder to flow in the direction of the linear movement of the circuit board so that the melted solder comes into contact with the circuit board when the circuit board is moved.
JP12007189U 1989-10-13 1989-10-13 Pending JPH0362664U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12007189U JPH0362664U (en) 1989-10-13 1989-10-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12007189U JPH0362664U (en) 1989-10-13 1989-10-13

Publications (1)

Publication Number Publication Date
JPH0362664U true JPH0362664U (en) 1991-06-19

Family

ID=31668161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12007189U Pending JPH0362664U (en) 1989-10-13 1989-10-13

Country Status (1)

Country Link
JP (1) JPH0362664U (en)

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