JPH0362831A - Surface-processing of polymer molded article with laser - Google Patents
Surface-processing of polymer molded article with laserInfo
- Publication number
- JPH0362831A JPH0362831A JP1199642A JP19964289A JPH0362831A JP H0362831 A JPH0362831 A JP H0362831A JP 1199642 A JP1199642 A JP 1199642A JP 19964289 A JP19964289 A JP 19964289A JP H0362831 A JPH0362831 A JP H0362831A
- Authority
- JP
- Japan
- Prior art keywords
- laser
- molded article
- processing
- irradiated
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920000642 polymer Polymers 0.000 title claims abstract description 28
- 239000007788 liquid Substances 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims description 13
- 238000003672 processing method Methods 0.000 claims description 6
- 125000003118 aryl group Chemical group 0.000 abstract description 13
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 abstract description 12
- 239000000843 powder Substances 0.000 abstract description 11
- 230000001678 irradiating effect Effects 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 abstract description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 abstract description 2
- 238000010186 staining Methods 0.000 abstract 1
- 238000005530 etching Methods 0.000 description 6
- 230000000877 morphologic effect Effects 0.000 description 5
- 239000012535 impurity Substances 0.000 description 4
- -1 krypton ion Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920006393 polyether sulfone Polymers 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920006290 polyethylene naphthalate film Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- CPBQJMYROZQQJC-UHFFFAOYSA-N helium neon Chemical compound [He].[Ne] CPBQJMYROZQQJC-UHFFFAOYSA-N 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006557 surface reaction Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/16—Surface shaping of articles, e.g. embossing; Apparatus therefor by wave energy or particle radiation, e.g. infrared heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0838—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using laser
Landscapes
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Laser Beam Processing (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Lasers (AREA)
Abstract
Description
【発明の詳細な説明】
（技術分野）
本発明は、紫外レーザーを用いる高分子成形物の表面加
工方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a method of surface processing a polymer molded article using an ultraviolet laser.
（従来技術及びその問題点）
Ｓ、ラザレらは（Ｓ、Ｌａｚａｒｅ、Ｒ，５ｒｊｎｉｖ
ａｓａｎ、Ｊ、Ｐｈｙｓ。(Prior art and its problems) S. Lazare et al.
asan, J., Phys.
Ｃｈｅｍ、、Ｖｏｌ、９０．２１２４（１９８６））、
高分子フィルムの表面を、エキシマ−レーザーなどの高
強度紫外レーザーで照射すると、その照射部位は照射直
後に容易に改質され、現像工程等の後処理を行なうこと
なく、直接的に形態学的な凹凸が形成されることを報告
している。このように、紫外レーザーを用いた高分子表
面の加工法は、精度良く、高速で行なうことができ、ま
た、レーザーの照射条件を制御することで、照射高分子
表面の構造特性や機能性を向上させることができるとい
う特徴があり、多彩な表面反応を制御良く行うことが可
能な手法である。しかしながら、高分子の化学構造の中
に芳香環を有する場合では、一般に加工時に微粉末を発
生しやすく、特に、長波長のレーザーを用いた場合に顕
著となる。大気中で加工を行なった時、この微粉末の一
部は、樹脂表面に戻り非照射部分に堆積し、さらに、真
空中では、窓や真空容器の内壁に付着し、加工効率が低
下するという欠点がある。この欠点を解消するために、
Ｇ、コーレンらは（Ｇ、Ｋｏｒｅｎ ａｎｄ Ｊ、Ｊ、
Ｄｏｎｅｌｏｎ、Ａｐｐｌ、Ｐｈｙｓ、、Ｖｏｉ。Chem, Vol. 90.2124 (1986)),
When the surface of a polymer film is irradiated with a high-intensity ultraviolet laser such as an excimer laser, the irradiated area is easily modified immediately after irradiation, and the morphological properties are directly It has been reported that unevenness is formed. In this way, polymer surface processing methods using ultraviolet lasers can be performed with high precision and high speed, and by controlling the laser irradiation conditions, it is possible to improve the structural characteristics and functionality of the irradiated polymer surface. It is a method that allows a variety of surface reactions to be carried out in a well-controlled manner. However, when a polymer has an aromatic ring in its chemical structure, fine powder is generally likely to be generated during processing, especially when a long wavelength laser is used. When processing is performed in the atmosphere, some of this fine powder returns to the resin surface and accumulates on non-irradiated areas, and in a vacuum, it adheres to windows and the inner walls of the vacuum container, reducing processing efficiency. There are drawbacks. In order to eliminate this drawback,
G, Koren and J,
Donelon, Appl, Phys, Voi.
Ｂ４５，４５（＋９８８））、ポリイミドに対し、Ｘｅ
Ｃｌエキシマレーザ−を照射後、炭酸ガスレーザーを照
射する、二段照射法によって発生した微粉末を除去して
いる。また、Ｒ，Ｊ、フォンガッ１−フェル１〜らは（
Ｒ。B45,45(+988)), polyimide, Xe
The fine powder generated is removed by a two-stage irradiation method in which irradiation is performed with a Cl excimer laser and then a carbon dioxide laser is irradiated. In addition, R, J, Fonggat1-Fel1~ et al.
R.
Ｊ、ｖｏｎＧｕｔｆｅｌｄ ａｎｄ Ｒ，５ｒｉｎｊｖ
ａｓａｎ、ＡｐｐｌＰｈｙｓ、、Ｖｏｌ。J, von Gutfeld and R, 5rinjv.
asan, ApplPhys,, Vol.
５］ 、１５（１９８７））、レーザー照射部の周囲に
電極を設け、微粉末を収集している。しかし、これらの
方法は、工程が複雑になるという欠点がある。5], 15 (1987)), an electrode is provided around the laser irradiation part to collect the fine powder. However, these methods have the disadvantage that the steps are complicated.
（発明の課題）
本発明は、紫外レーザーを用いて高分子成形物の表面加
工を行う場合に発生する微粉末に起因する不都合な問題
を解決することをその課題とする。(Problem of the Invention) An object of the present invention is to solve the inconvenient problem caused by fine powder generated when performing surface processing of a polymer molded article using an ultraviolet laser.
（課題を解決するための手段）
本発明者らは、前記課題を解決すべく鋭意研究を重ねた
結果、本発明を完成するに至った。(Means for Solving the Problems) The present inventors have conducted extensive research to solve the above problems, and as a result, have completed the present invention.
すなわち、本発明によれば、紫外レーザーをａ′６分子
成形物に照射する表面加工法において、該高分子成形物
の少なくとも照射表面部の液体を存在させることを特徴
とする高分子成形物の表面加工方法が提供される。That is, according to the present invention, in a surface processing method of irradiating an a'6 molecule molded product with an ultraviolet laser, a liquid is present at least on the irradiated surface of the polymer molded product. A surface processing method is provided.
Ｓ、ラザレらは上記の報文において、この紫外レーザー
による高分子表面のエツチングは、その表面状態を観察
するのに迅速で簡便な方法であると一
している。しかし、彼らは、そのエツチングについて気
相雰囲気又は真空下での検討しか行なっておらず、本発
明における如き照射面に液体を存在させる湿式照射につ
いては全く検討されていない。In the above-mentioned paper, S. and Lazare et al. agree that etching the surface of a polymer with an ultraviolet laser is a quick and simple method for observing the surface condition. However, they have only studied etching in a gas phase atmosphere or under vacuum, and have not studied wet irradiation in which a liquid is present on the irradiated surface as in the present invention.
本発明の方法は、紫外レーザーを高分子成形物の表面に
照射するに際し、高分子成形物の少なくとも紫外レーザ
ー照射部に、液体を存在させる。In the method of the present invention, when the surface of the polymer molded article is irradiated with an ultraviolet laser, a liquid is made to exist at least in the ultraviolet laser irradiated part of the polymer molded article.
液体としては、照射レーザー波長での吸光係数が微小な
、かつ、高分子を溶かさないものが好ましく、例えば、
水の他、ヘキサン、アルコール、フロン等の有機溶媒が
好適である。高分子成形物の表面部に液体を存在させる
方法としては、成形物を液体中に浸漬する方法、成形物
の表面に液体を噴射したり、流通させる方法等がある。The liquid is preferably one that has a minute extinction coefficient at the wavelength of the irradiated laser and does not dissolve polymers; for example,
In addition to water, organic solvents such as hexane, alcohol, and chlorofluorocarbons are suitable. Methods for causing liquid to be present on the surface of a polymer molded article include a method of immersing the molded article in a liquid, a method of spraying or flowing a liquid onto the surface of the molded article, and the like.
本発明は、高分子成形物の改質したい表面部位に相当す
るマスク（金属板製パターンなど）を通過させたレーザ
ービームを照射することで、希望する照射部分のみに加
工を施すことができる。この場合、エキシマレーザ−の
ビームは、ヘリウムネオンレーザ−、アルゴン及びクリ
プトンイオンレーザ−１Ｎｄ＋：ＹＡＧレーザー等の他
のレーザーのビームと比較して、ビーム形状が太きいた
めに、このビームを走査させて改質すべき部位を照射す
ることで、大面積化にも容易に対応できる。特に、本発
明は、紫外レーザーによる非熱的な光化学分解反応を用
いる加工法であるため、照射部位以外の周辺には熱的損
傷を何ら生しない。しかも、レーザーにより切削された
断片は、周囲には何ら付着しない。また、成形物の表面
に形成する模様の形状、大きさ、及び除去されるフィル
ムの量（すなわち切削される深さ）は、照射するレーザ
ーの波長、フルエンス、パルス数により制御できる。In the present invention, by irradiating a laser beam that has passed through a mask (such as a pattern made of a metal plate) corresponding to the surface area of a polymer molded article that is desired to be modified, it is possible to process only the desired irradiated area. In this case, the excimer laser beam has a thicker beam shape than other laser beams such as helium neon laser, argon and krypton ion laser, and 1Nd+:YAG laser, so this beam is scanned. By irradiating the area to be modified, it is possible to easily accommodate larger areas. In particular, since the present invention is a processing method that uses a non-thermal photochemical decomposition reaction using an ultraviolet laser, no thermal damage is caused in the vicinity other than the irradiated area. Moreover, the fragments cut by the laser do not adhere to the surrounding area. Further, the shape and size of the pattern formed on the surface of the molded article, and the amount of film removed (ie, the depth to be cut) can be controlled by the wavelength, fluence, and number of pulses of the irradiated laser.
こうして、レーザー照射部分の成形物表面」―に、物理
的、化学的に安定な加工を行なうことができる。In this way, it is possible to perform physically and chemically stable processing on the surface of the molded product in the laser irradiated area.
本発明におけるレーザーとしては、波長４００ｎｍ以下
の紫外レーザーが適しており、特に好適には、ＸｅＦ（
３５］ｎｍ）、ＸｅＣ］、 （３０８ｎｍ）、ＫｒＦ
（２４８ｎｍ）、ＡｒＦ（１９３ｎｍ）あるいはＦ２（
１５７ｎｍ）エキシマレーザ−である。As the laser in the present invention, an ultraviolet laser with a wavelength of 400 nm or less is suitable, and XeF (
35]nm), XeC], (308nm), KrF
(248nm), ArF (193nm) or F2(
157 nm) excimer laser.
また、Ｎｄ”：ＹＡＧ、色素レーザー、Ｋｒイオンレー
ザ、Ａｒイオンレーザ−あるいは銅蒸気レーザーの基本
発振波長光を非線形光学素子などにより、紫外光領域の
レーザーに変換したものも有効である。Also effective are Nd":YAG, dye lasers, Kr ion lasers, Ar ion lasers, or copper vapor lasers in which the fundamental oscillation wavelength light is converted to a laser in the ultraviolet region using a nonlinear optical element or the like.
レーザーのフルエンスとしては、素材により具なるが、
約０．１ｍＪ／ｃｉ／パルス以上の高輝度レーザーが望
ましい。The fluence of the laser depends on the material, but
A high-intensity laser of approximately 0.1 mJ/ci/pulse or higher is desirable.
本発明において被加工物として用いる高分子成形物は、
各種の形状及び構造を有することができ、少なくともそ
の加工表面部が高分子から構成されたものであればよい
。この場合、高分子としては、各種のものが用いられ、
その種類は特に制約されず、また結晶性、非結晶性のい
ずれのものでもよい。高分子としては、例えば、ポリエ
チレン、ポリプロピレン、エチレン／プロピレン共重合
体等のポリオレフィン系樹脂、ポリスチレン系樹脂、ポ
リ塩化ビニル、ポリエステル、ポリアミド、ポリカーボ
ネト、ポリアセタール樹脂、エポキシ樹脂、フェノール
樹脂等の各種の可塑性又は熱硬化性のものであることが
できるし、また、光硬化性のものであってもよい。本発
明は、特に芳香族系屓請子、例えば、芳香族ポリフェニ
レンサルファイド、芳香族ポリエーテルエーテルケ１〜
ン、芳香族ポリエーテルイミド、芳香族ポリエーテルス
ルホン、芳香族ポリイミド、芳香族ポリエステル、芳香
族エポキシ樹脂等の縮合物又は共縮重合物あるいはそれ
らの混合物を好ましいものとして挙げることができる。The polymer molded product used as the workpiece in the present invention is
It can have various shapes and structures as long as at least its processed surface portion is made of polymer. In this case, various polymers are used,
The type thereof is not particularly limited, and it may be either crystalline or non-crystalline. Examples of polymers include polyolefin resins such as polyethylene, polypropylene, and ethylene/propylene copolymers, polystyrene resins, polyvinyl chloride, polyesters, polyamides, polycarbonates, polyacetal resins, epoxy resins, and phenolic resins. It can be plastic or thermosetting, or it can be photocurable. The present invention particularly relates to aromatic base materials, such as aromatic polyphenylene sulfide, aromatic polyether ether compounds, etc.
Preferable examples include condensates or cocondensates of aromatic polyesters, aromatic polyetherimides, aromatic polyethersulfones, aromatic polyimides, aromatic polyesters, aromatic epoxy resins, and mixtures thereof.
本発明の高分子成形物としては、フィル１１、シート、
棒体、繊維の他、各種構造物が挙げられる。The polymer molded products of the present invention include fill 11, sheet,
Examples include rods, fibers, and various other structures.
また、高分子成形物は、ガラス繊維や炭素繊維等の各種
繊維や、充填剤で強化された樹脂成形物であることがで
き、また、高分子と他の素材との複合体であることがで
きる。In addition, the polymer molded product can be a resin molded product reinforced with various fibers such as glass fiber or carbon fiber, or a filler, or it can be a composite of a polymer and other materials. can.
（発明の効果）
本発明によりる紫外レーザーを用いる高分子成形物の加
工法によれば、表面部からの高分子の削除による微細凹
部を成形物表面に形成することができる。この加工法に
よれば、表面に多数の微細凹凸を形成されることができ
、このような表面は化学的に活性な改質表面として作用
する。本発明の方法では、その成形物の照射面に液体を
存在させたことから、紫外レーザー加工に際して発生す
る微粉末は液体に抽捉され、成形物表面や加工装置表面
に付着するのが防止される。(Effects of the Invention) According to the method of processing a polymer molded article using an ultraviolet laser according to the present invention, fine recesses can be formed on the surface of the molded article by removing the polymer from the surface portion. According to this processing method, a large number of fine irregularities can be formed on the surface, and such a surface acts as a chemically active modified surface. In the method of the present invention, since the liquid is present on the irradiated surface of the molded product, the fine powder generated during ultraviolet laser processing is extracted by the liquid and is prevented from adhering to the surface of the molded product or processing equipment. Ru.
（実施例） 以下、本発明を実施例により、さらに詳細に説明する。(Example) Hereinafter, the present invention will be explained in more detail with reference to Examples.
実施例１
純水中において、ポリエチレンナフタレートフィルムの
平滑な面に、Ｘ ｅ Ｃｌエキシマーシーザーをエネル
ギー密度１ Ｊ ／ ａ＃て３０シヨツト照射させた。Example 1 In pure water, the smooth surface of a polyethylene naphthalate film was irradiated with 30 shots of X e Cl excimer Caesar at an energy density of 1 J/a#.
良好なエツチング特性が得られ、照射部の周囲には微粉
残渣等の不純物は完全に除去されていた。さらに、延伸
フィルムを用いた場合には。Good etching characteristics were obtained, and impurities such as fine powder residues around the irradiated area were completely removed. Furthermore, when a stretched film is used.
照射面に形態学的な凹凸が生成していた。Morphological irregularities were generated on the irradiated surface.
実施例２
ヘキサン中において、ポリエチレンナフタレートフィル
ムの平滑な面に、ＸｅＣｌエキシマ−レーザーをエネル
ギー密度１，１７−で３０シヨツト照射させた。良好な
エツチング特性が得られ、照射部の周囲には微粉末残渣
等の不純物は完全に除去されていた。さらに、延伸フィ
ルムを用いた場合には、照射面に形態学的な凹凸が生成
していた。Example 2 In hexane, the smooth surface of a polyethylene naphthalate film was irradiated with a XeCl excimer laser for 30 shots at an energy density of 1,17-. Good etching characteristics were obtained, and impurities such as fine powder residues around the irradiated area were completely removed. Furthermore, when a stretched film was used, morphological irregularities were generated on the irradiated surface.
実施例３
純水中において、芳香族ポリエーテルスルホンフィルム
の平滑な面に、 ＸｅＣｌエキシマ−レーザーをエネル
ギー密度ＩＪ／ｃｄで３０シヨツト照射させた。Example 3 In pure water, the smooth surface of an aromatic polyethersulfone film was irradiated with a XeCl excimer laser for 30 shots at an energy density of IJ/cd.
良好なエツチング特性が得られ、照射部の周囲には微粉
末残渣等の不純物は完全に除去された。また、照射面に
形態学的な凹凸が生成していた。Good etching characteristics were obtained, and impurities such as fine powder residue around the irradiated area were completely removed. Additionally, morphological irregularities were generated on the irradiated surface.
実施例４
ヘキサン中において、芳香族ポリエーテルスルホンフィ
ルムの平滑な面に、ＸｅＣｌエキシマ−レーザーをエネ
ルギー密度ＩＪ／ｒｎ？で３０シヨっト照射させた。良
好なエツチング特性が得られ、照射部の周囲には微粉末
残渣等の不純物は完全に除去された。また、照射面に形
態学的な凹凸が生成していた。Example 4 A XeCl excimer laser was applied to the smooth surface of an aromatic polyether sulfone film in hexane at an energy density of IJ/rn? I fired 30 shots. Good etching characteristics were obtained, and impurities such as fine powder residue around the irradiated area were completely removed. Additionally, morphological irregularities were generated on the irradiated surface.
Claims (1)
法において、該高分子成形物の少なくとも照射表面部の
液体を存在させることを特徴とする高分子成形物の表面
加工方法。（２）該高分子成形物を液体中に浸漬し、こ
れに紫外レーザーを照射する請求項１の方法。(1) A surface processing method for a polymer molded article in which a polymer molded article is irradiated with an ultraviolet laser, characterized in that a liquid is present at least on the irradiated surface of the polymer molded article. (2) The method according to claim 1, wherein the polymer molded article is immersed in a liquid and irradiated with an ultraviolet laser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1199642A JPH0811772B2 (en) | 1989-08-01 | 1989-08-01 | Surface processing method of polymer moldings using laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1199642A JPH0811772B2 (en) | 1989-08-01 | 1989-08-01 | Surface processing method of polymer moldings using laser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0362831A true JPH0362831A (en) | 1991-03-18 |
| JPH0811772B2 JPH0811772B2 (en) | 1996-02-07 |
Family
ID=16411246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1199642A Expired - Lifetime JPH0811772B2 (en) | 1989-08-01 | 1989-08-01 | Surface processing method of polymer moldings using laser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0811772B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06228343A (en) * | 1993-02-08 | 1994-08-16 | Hamamatsu Photonics Kk | Method and device for surface modification of fluororesin |
| WO1996022323A1 (en) * | 1995-01-18 | 1996-07-25 | Kurashiki Boseki Kabushiki Kaisha | Tubular film having treated internal surface and apparatus and method for treating the internal surface |
| EP0644227A4 (en) * | 1993-03-23 | 1997-12-29 | Univ Tokai | Solid surface modifying method and apparatus. |
| JP2003332215A (en) * | 2002-05-14 | 2003-11-21 | Toshiba Corp | Processing method, semiconductor device manufacturing method, and processing apparatus |
| US7288466B2 (en) | 2002-05-14 | 2007-10-30 | Kabushiki Kaisha Toshiba | Processing method, manufacturing method of semiconductor device, and processing apparatus |
| US8017795B2 (en) | 2005-04-21 | 2011-09-13 | Ndsu Research Foundation | Radiation curable polymer films having improved laser ablation properties and radiation curable sensitizers therefor |
| CN110871566A (en) * | 2018-08-31 | 2020-03-10 | 空中客车防卫和太空有限责任公司 | Method for the surface nanostructuring of carbon fibers in fiber composite plastics based on sulfur and aromatic hydrocarbons |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6046893A (en) * | 1983-08-25 | 1985-03-13 | Seiko Epson Corp | Laser working device |
-
1989
- 1989-08-01 JP JP1199642A patent/JPH0811772B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6046893A (en) * | 1983-08-25 | 1985-03-13 | Seiko Epson Corp | Laser working device |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06228343A (en) * | 1993-02-08 | 1994-08-16 | Hamamatsu Photonics Kk | Method and device for surface modification of fluororesin |
| EP0644227A4 (en) * | 1993-03-23 | 1997-12-29 | Univ Tokai | Solid surface modifying method and apparatus. |
| WO1996022323A1 (en) * | 1995-01-18 | 1996-07-25 | Kurashiki Boseki Kabushiki Kaisha | Tubular film having treated internal surface and apparatus and method for treating the internal surface |
| US5665444A (en) * | 1995-01-18 | 1997-09-09 | Kurashiki Boseki Kabushiki Kaisha | Tube-shaped film having its inner peripheral surface treated, method for treating inner peripheral surface of tube-shaped film and apparatus therefor |
| CN1100817C (en) * | 1995-01-18 | 2003-02-05 | 仓敷纺绩株式会社 | Tubular film with inner peripheral surface treated and apparatus and method for treating the same |
| JP2003332215A (en) * | 2002-05-14 | 2003-11-21 | Toshiba Corp | Processing method, semiconductor device manufacturing method, and processing apparatus |
| US7288466B2 (en) | 2002-05-14 | 2007-10-30 | Kabushiki Kaisha Toshiba | Processing method, manufacturing method of semiconductor device, and processing apparatus |
| US7727853B2 (en) | 2002-05-14 | 2010-06-01 | Kabushiki Kaisha Toshiba | Processing method, manufacturing method of semiconductor device, and processing apparatus |
| US8017795B2 (en) | 2005-04-21 | 2011-09-13 | Ndsu Research Foundation | Radiation curable polymer films having improved laser ablation properties and radiation curable sensitizers therefor |
| CN110871566A (en) * | 2018-08-31 | 2020-03-10 | 空中客车防卫和太空有限责任公司 | Method for the surface nanostructuring of carbon fibers in fiber composite plastics based on sulfur and aromatic hydrocarbons |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0811772B2 (en) | 1996-02-07 |
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