JPH0363578B2 - - Google Patents
Info
- Publication number
- JPH0363578B2 JPH0363578B2 JP8278982A JP8278982A JPH0363578B2 JP H0363578 B2 JPH0363578 B2 JP H0363578B2 JP 8278982 A JP8278982 A JP 8278982A JP 8278982 A JP8278982 A JP 8278982A JP H0363578 B2 JPH0363578 B2 JP H0363578B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- particle size
- sintered body
- polyamide
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 35
- 239000011347 resin Substances 0.000 claims description 35
- 239000002245 particle Substances 0.000 claims description 25
- 239000004962 Polyamide-imide Substances 0.000 claims description 21
- 229920002312 polyamide-imide Polymers 0.000 claims description 21
- 239000000843 powder Substances 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000005245 sintering Methods 0.000 claims description 10
- 238000000354 decomposition reaction Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 2
- 239000000654 additive Substances 0.000 description 9
- 238000002156 mixing Methods 0.000 description 7
- 239000000126 substance Substances 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 125000003118 aryl group Chemical group 0.000 description 4
- 238000011049 filling Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 150000004984 aromatic diamines Chemical class 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011362 coarse particle Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004963 Torlon Substances 0.000 description 1
- 229920003997 Torlon® Polymers 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000003831 antifriction material Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Landscapes
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
Description
本発明はポリアミドイミド樹脂を含有する多孔
質焼結体に関する。
プラスチツクからなる多孔質物質としては、古
くは海綿構造のスポンジが知られている。しか
し、これらは耐薬品性が弱く耐熱性も低い。
また、一般に柔らかいものが多く、機械的強度
の高いものはつくりにくい。
このような欠点を補なうものとしてプラスチツ
ク焼結体が知られており、すでにポリエチレン、
ポリアミド樹脂等を原料とする多孔質物質が量産
され、各種の用途に用いられている。
しかしながら、従来のプラスチツク焼結体にお
いては、耐熱性が高々100℃前後であり、その機
械的強度もエンジニアリングプラスチツクとして
使用するには不充分であつた。
また、近年、耐熱性の高い多孔質として、ポリ
イミド樹脂の多孔体が、提案されたが、機械的強
度は未だ不充分な場合が多い。
したがつて、高い耐熱性、高度な耐薬品性およ
び高い機械的強度をあわせもつ焼結体は未だ開発
されていないのが現状である。
本発明者等は、これらの現状に鑑み、鋭意検討
を重ねた結果、ポリアミドイミド樹脂の微細粉末
を、該樹脂の軟化温度以上分解温度以下の温度で
加熱焼結させることによつて得られる多孔質焼結
体が、優れた耐薬品性、高い耐熱性、および高い
機械的強度等の各種特性をあわせもつことを知見
し本発明に到つた。
すなわち本発明の要旨は、ゴールターカウンタ
ーで測定して粒径4〜100μのものが98%以上で
あり、且つこの部分のコールターカウンターによ
る粒度分布に基づいて計算されるD1(長さ平均粒
径)およびD4(重量平均粒径)が、
D1≦20μ、D4/D1≦3
なる条件を満足する粒径および粒度分布のポリア
ミドイミド樹脂の微細粉末を該樹脂の軟化温度以
上分解温度以下の温度で加熱焼結させることによ
つて得られる多孔質焼結体に存する。
以下本発明をさらに詳細に説明する。
本発明で用いるポリアミドイミド樹脂は公知で
あり、市販もされている。この樹脂は主鎖のくり
返し単位中にアミド結合とイミド結合との両者を
含んでいる。もちろん、アミド結合とイミド結合
とを有するくり返し単位以外に他のくり返し単
位、例えばアミド結合だけのくり返し単位やイミ
ド結合だけのくり返し単位を少量含んでいてもよ
い。しかし樹脂の90(wt%)以上、特に95(wt%)
以上はアミド結合とイミド結合との両者を含むく
り返し単位が占めるものが好ましい。
好ましくは、下記式
(式中Arは少なくとも1つのベンゼン環を含む
3価の芳香族基、Rは2価の芳香族基または脂肪
族基を示す)で表わされる繰返し単位を主要構造
単位として有するポリアミドイミド樹脂が使用さ
れる。たとえばトリメリツト酸と4,4′−ジアミ
ノジフエニルエーテルのような芳香族ジアミンの
反応によつて得られるものは次の化学構造式で示
される。
(式中Ar′は少なくとも1つのベンゼン環を含む
2価の芳香族基を示し、nは5〜200の数を示す)
このようなポリアミドイミド樹脂は、芳香核と
イミド結合の組合せを持つために、優れた熱安定
性を示し、またおそらくアミド結合に起因すると
考えられる柔軟性のために優れた強靭さを示し、
さらに優れた耐薬品性をあわせもつ。
本発明では、ポリアミドイミド樹脂を加熱焼結
するにあたり、コールターカウンターで測定して
粒径4〜100μのものが98%以上であり、且つこ
の部分がコールターカウンターによる粒度分布に
基づいて計算されるD1(長さ平均粒径)およびD4
(重量平均粒径)が
D1≦20μ、D4/D1≦3
なる条件を満足する粒径および粒度分布の微細粒
子を使用する。
なお、微細粒子を得る方法は、例えば機械粉砕
または粉砕と分級の組合せ等任意である。こうし
た微細粒子を加熱焼結すると、粗大な粒子を含む
樹脂や粒度分布の広い樹脂を焼結した場合に比
べ、機械的強度が著しく高い多孔質焼結体が得ら
れ、また空隙の大きさも均一で微小となる。本発
明で使用する樹脂は、好ましくは、4〜100μの
部分の粒度分布から計算される粒径(D1)が15μ
以下のものである。また、4〜100μの部分の
D4/D1は2.5以下、特に2以下であるのが好まし
い。
このポリアミドイミド樹脂には、必要に応じ各
種添加剤を適宜配合することができる。
例えば、ポリアミドイミド樹脂に二硫化モリプ
デン、グラフアイト、弗素樹脂等の固体減摩剤
(Solid lubricant)を配合して焼成した多孔質焼
結体は、摩擦係数が少さく、且つ耐摩耗性が極め
て秀れている。もちろん、添加剤としては減摩剤
以外の物質、例えば炭酸カルシウム等を用いるこ
ともできる。
ポリアミドイミド樹脂は、該焼結温度で重合反
応を起こし、高分子量化することが知られてい
る。
従つて、加熱焼結時に、他の熱可塑性樹脂の様
に単に融着するだけではなく、異る粉末粒子間
で、化学反応による結合を生じる。故に、きわめ
てすぐれた焼結体製造用原料であり、添加剤を配
合した場合でも高い機械的強度を持つ焼結体を作
ることが出来る。
これらの添加剤は、粗大粒子を含まず、かつ平
均粒径がマトリツクスを構成するポリアミドイミ
ド樹脂よりも小さいものが好ましい。添加剤の配
合割合は、ポリアミドイミド樹脂との混合物全体
に対し、0.005〜50重量%である。好ましい範囲
は5〜35重量%である。
配合割合がこれより極端に少ないと、無機物の
混合する意味がなく、逆に極端に多すぎると成形
品の強度は逆に低下してしまう。
従来のポリアミドイミド樹脂の成形法(例えば
射出成形や押出成形)では、該樹脂の溶融粘度が
高いために、高濃度に添加剤を配合することは不
可能であつたが、本発明ではそれが可能である。
添加剤として好ましいのは弗素樹脂である。
ふつ素樹脂としては、通常知られているもので
よく、例えば、ポリテトラフルオルエチレン、ポ
リクロルトリフルオルエチレン、ポリふつ化ビニ
ル、ポリふつ化ビニリデン、ヘキサフルオルプロ
ピレン−テトラフルオルエチレン共重合体、クロ
ルトリフルオルエチレン−ふつ化ビニリデン共重
合体等が用いられる。
ふつ素樹脂の配合割合は、主に焼結体に要求さ
れる摩擦係数に依存し、ふつ素樹脂の配合割合が
多くなるほど摩擦係数の低い焼結体が得られる。
ふつ素樹脂の配合により、摺動部品として有用
な低い摩擦係数を有する多孔質焼結体が得られ
る。
本発明においては、ポリアミドイミド樹脂の微
細粉末またはこれに前述の如き添加剤を配合した
混合物を該樹脂の軟化温度以上分解温度以下の温
度で加熱焼結させて多孔質焼結体が得られる。
加熱焼結方法は、特に限定されず、例えば、原
料に微細粉末を圧縮成形した後、該樹脂の軟化温
度以上分解温度以下の温度で、空気中で一定時間
加熱する方法等通常使用される方法が採られる。
ポリアミドイミド樹脂の加熱焼結温度は、270
〜400℃程度であつて、さらに加熱焼結時間は、
30分〜3時間程度である。
本発明で得られる多孔質焼結体における樹脂の
充填率(容量%)は、90数容量%〜50容量%程度
である。
樹脂の充填率(容量%)が、これより極端に多
いと、多孔質体としての本来の意味がなくなり、
逆に少なすぎると強度が低下し、実用上不都合と
なる。
このような多孔質焼結体は、フイルター、ある
いは油含浸して摺動部品として用いる場合等にき
わめて有用である。
次に、本発明を実施例により更に具体的に説明
するが、本発明はその要旨をこえない限り以下の
実施例に拘束されるものではない。
実施例1〜3および比較例1〜3
トリメツト酸無水物と芳香族ジアミンより合成
されたポリアミドイミド樹脂の一種であるトーロ
ン(商標、米国アモコ社製)の微細粉末を、常温
の大気中で、4000Kg/cm2の圧力により、直径40
mm、厚さ3mmの円盤に圧縮成形した。加圧時間は
3分間である。この成形品を空気中で290℃の温
度で1時間加熱して焼結体とした。この焼結体か
ら、幅5mm、厚さ3mm、長さ20mmの長方形の試験
片を切り出した。この試験片について、スパン間
12mm、クロスへツドスピード1mm/mmで常法によ
り2点支持法による曲げ試験(使用機:東洋ボー
ルドウイン社製テンシロンUTH−L)を行な
い、曲げ強度(Kg/cm2)および曲げ歪み(%)を
20℃で測定した。また、試験片の密度を測定して
試験片の樹脂の充填率(容量%)を算出した。結
果を第1表に示す。
The present invention relates to a porous sintered body containing a polyamideimide resin. Sponges with a spongy structure have long been known as porous materials made of plastic. However, these have poor chemical resistance and low heat resistance. Additionally, they are generally soft and difficult to make with high mechanical strength. Plastic sintered bodies are known as something that compensates for these drawbacks, and they have already been used in polyethylene,
Porous materials made from polyamide resins and the like are being mass-produced and used for various purposes. However, conventional sintered plastic bodies have a heat resistance of around 100° C. at most, and their mechanical strength is also insufficient for use as engineering plastics. Further, in recent years, porous bodies of polyimide resin have been proposed as porous bodies with high heat resistance, but their mechanical strength is still insufficient in many cases. Therefore, at present, a sintered body that has high heat resistance, high chemical resistance, and high mechanical strength has not yet been developed. In view of these current circumstances, the inventors of the present invention have conducted intensive studies, and as a result, the present inventors have discovered a porous material obtained by heating and sintering fine powder of polyamide-imide resin at a temperature above the softening temperature and below the decomposition temperature of the resin. The inventors have discovered that quality sintered bodies have various properties such as excellent chemical resistance, high heat resistance, and high mechanical strength, and have thus arrived at the present invention. In other words, the gist of the present invention is that 98% or more of the particles have a particle size of 4 to 100 μm as measured by a Coulter counter, and D 1 (length average particle size) calculated based on the particle size distribution of this part by the Coulter counter Decompose fine powder of polyamide-imide resin whose particle size and particle size distribution satisfy the following conditions: D 1 ≦20μ, D 4 /D 1 ≦3 (diameter) and D 4 (weight average particle diameter) above the softening temperature of the resin. It consists in a porous sintered body obtained by heating and sintering at a temperature below that temperature. The present invention will be explained in more detail below. The polyamideimide resin used in the present invention is well known and commercially available. This resin contains both amide bonds and imide bonds in the repeating units of the main chain. Of course, in addition to the repeating unit having an amide bond and an imide bond, a small amount of other repeating units such as a repeating unit having only an amide bond or a repeating unit having only an imide bond may be included. But more than 90 (wt%) of resin, especially 95 (wt%)
The above units are preferably occupied by repeating units containing both amide bonds and imide bonds. Preferably, the following formula (In the formula, Ar is a trivalent aromatic group containing at least one benzene ring, and R is a divalent aromatic group or aliphatic group.) A polyamide-imide resin having a repeating unit as a main structural unit is used. be done. For example, the product obtained by the reaction of trimellitic acid and an aromatic diamine such as 4,4'-diaminodiphenyl ether is shown by the following chemical structural formula. (In the formula, Ar' represents a divalent aromatic group containing at least one benzene ring, and n represents a number from 5 to 200.) Because such polyamide-imide resin has a combination of an aromatic nucleus and an imide bond, It exhibits excellent thermal stability and also exhibits excellent toughness due to flexibility, probably due to the amide bond,
It also has excellent chemical resistance. In the present invention, when heating and sintering the polyamide-imide resin, 98% or more of the particles have a particle size of 4 to 100μ as measured by a Coulter counter, and this portion is calculated based on the particle size distribution by the Coulter counter. 1 (length average grain size) and D 4
Fine particles with a particle size and particle size distribution that satisfy the following conditions (weight average particle size): D 1 ≦20 μ, D 4 /D 1 ≦3 are used. Note that the method for obtaining fine particles is arbitrary, such as mechanical pulverization or a combination of pulverization and classification. When these fine particles are heated and sintered, a porous sintered body with significantly higher mechanical strength is obtained than when resin containing coarse particles or resin with a wide particle size distribution is sintered, and the pore size is also uniform. becomes minute. The resin used in the present invention preferably has a particle size (D 1 ) of 15μ calculated from the particle size distribution in the 4 to 100μ portion.
These are as follows. Also, the part of 4 to 100μ
D 4 /D 1 is preferably 2.5 or less, particularly 2 or less. Various additives can be appropriately blended into this polyamide-imide resin as necessary. For example, a porous sintered body made by combining polyamide-imide resin with a solid lubricant such as molybdenum disulfide, graphite, or fluororesin has a low coefficient of friction and extremely wear resistance. Excellent. Of course, substances other than antifriction agents, such as calcium carbonate, can also be used as additives. It is known that polyamide-imide resin undergoes a polymerization reaction at the sintering temperature to increase its molecular weight. Therefore, during heating and sintering, the powder particles do not simply fuse together like other thermoplastic resins, but bonding occurs between different powder particles through a chemical reaction. Therefore, it is an extremely excellent raw material for producing sintered bodies, and even when additives are added, sintered bodies with high mechanical strength can be produced. These additives preferably do not contain coarse particles and have an average particle size smaller than the polyamideimide resin constituting the matrix. The blending ratio of the additive is 0.005 to 50% by weight based on the entire mixture with the polyamide-imide resin. The preferred range is 5-35% by weight. If the blending ratio is extremely lower than this, there is no point in mixing the inorganic material, and on the other hand, if the blending ratio is too high, the strength of the molded product will decrease. With conventional polyamide-imide resin molding methods (e.g. injection molding and extrusion molding), it has been impossible to incorporate additives at high concentrations due to the high melt viscosity of the resin, but this has been achieved with the present invention. It is possible. A preferred additive is a fluororesin. As the fluororesin, commonly known ones may be used, such as polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, hexafluoropropylene-tetrafluoroethylene copolymer, etc. Copolymer, chlorotrifluoroethylene-vinylidene fluoride copolymer, etc. are used. The blending ratio of the fluororesin mainly depends on the friction coefficient required of the sintered body, and the higher the blending ratio of the fluororesin, the lower the friction coefficient of the sintered body can be obtained. By blending the fluororesin, a porous sintered body having a low coefficient of friction useful as a sliding part can be obtained. In the present invention, a porous sintered body is obtained by heating and sintering a fine powder of polyamide-imide resin or a mixture of the fine powder and the above-mentioned additives at a temperature above the softening temperature and below the decomposition temperature of the resin. The heating sintering method is not particularly limited, and for example, a commonly used method such as a method of compressing fine powder as a raw material and then heating it in air for a certain period of time at a temperature above the softening temperature and below the decomposition temperature of the resin. is taken. The heating sintering temperature of polyamide-imide resin is 270
~400℃, and the heating sintering time is
It takes about 30 minutes to 3 hours. The resin filling rate (volume %) in the porous sintered body obtained by the present invention is about 90-50 volume %. If the resin filling rate (volume %) is extremely higher than this, the original meaning as a porous body is lost,
On the other hand, if it is too small, the strength will decrease and this will be a practical disadvantage. Such a porous sintered body is extremely useful when used as a filter or a sliding part after being impregnated with oil. Next, the present invention will be explained in more detail with reference to Examples, but the present invention is not restricted to the following Examples unless the gist thereof is exceeded. Examples 1 to 3 and Comparative Examples 1 to 3 Fine powder of Torlon (trademark, manufactured by Amoco, USA), which is a type of polyamideimide resin synthesized from trimethic acid anhydride and aromatic diamine, was heated in the air at room temperature. Due to the pressure of 4000Kg/ cm2 , the diameter is 40
mm, and compression molded into a disk with a thickness of 3 mm. The pressurization time was 3 minutes. This molded product was heated in air at a temperature of 290° C. for 1 hour to obtain a sintered body. A rectangular test piece with a width of 5 mm, a thickness of 3 mm, and a length of 20 mm was cut from this sintered body. For this specimen, between spans
12mm, a cross head speed of 1mm/mm, and a two-point support bending test (machine used: Toyo Baldwin Co., Ltd. Tensilon UTH-L) was performed using the conventional method to determine bending strength (Kg/cm 2 ) and bending strain (%). )of
Measured at 20°C. In addition, the density of the test piece was measured to calculate the resin filling rate (volume %) of the test piece. The results are shown in Table 1.
【表】
実施例 4
実施例1で用いたポリアミドイミド樹脂の微粉
末を、常温の大気中で3180Kg/cm2の圧力により直
径20mm、厚さ3mmの円盤に圧縮成形した。加圧時
間は5分間である。この成形品を空気中300℃の
温度で2時間加熱して焼結体とした。
この焼結体から幅5mm、長さ2mm、厚さ3mmの
長方形の試験片を切り出した。このものの曲げ強
度は2200Kg/cm2、曲げ歪みは19.0%、充填率は
89.3容量%であつた。
実施例 5〜11
実施例1で用いたポリアミドイミド樹脂の微粉
末と添加剤との混合物を用い、実施例4と同一の
条件で焼結体を製造した。このものの試験結果を
第2表に示す。[Table] Example 4 The fine powder of the polyamide-imide resin used in Example 1 was compression molded into a disk having a diameter of 20 mm and a thickness of 3 mm under a pressure of 3180 Kg/cm 2 in the atmosphere at room temperature. The pressurization time is 5 minutes. This molded product was heated in air at a temperature of 300° C. for 2 hours to obtain a sintered body. A rectangular test piece with a width of 5 mm, a length of 2 mm, and a thickness of 3 mm was cut from this sintered body. The bending strength of this product is 2200Kg/cm 2 , the bending strain is 19.0%, and the filling rate is
It was 89.3% by volume. Examples 5 to 11 Sintered bodies were manufactured under the same conditions as in Example 4 using the mixture of the fine polyamide-imide resin powder used in Example 1 and additives. The test results for this product are shown in Table 2.
【表】
実施例 12
実施例9のポリアミドイミド樹脂と弗素樹脂と
の混合物を、常温、大気中で、4000Kg/cm2の圧力
により、直径40mm、厚さ3mmの円盤に圧縮成形し
た。加圧時間は3分間である。
この成形体を空気中、300℃で2時間加熱して
焼結体とした。東洋ボールドウイン(株)製の摩擦・
摩耗試験機(EFM−−B)を用いて、この焼
結体の摩耗速度および動摩擦係数を測定した。試
験は無潤滑で行ない、相手材はSUS304を用い
た。結果を第3表に示す。
実施例 13
実施例1のポリアミドイミド樹脂を用い、実施
例12と全く同様にして焼結体を製造し、かつその
摩耗速度および動摩擦係数を測定した。
結果を第3表に示す。[Table] Example 12 The mixture of the polyamideimide resin and fluororesin of Example 9 was compression molded into a disk having a diameter of 40 mm and a thickness of 3 mm at room temperature and in the atmosphere under a pressure of 4000 Kg/cm 2 . The pressurization time was 3 minutes. This molded body was heated in air at 300° C. for 2 hours to obtain a sintered body. Friction made by Toyo Baldwin Co., Ltd.
The wear rate and dynamic friction coefficient of this sintered body were measured using an abrasion tester (EFM--B). The test was conducted without lubrication, and the mating material was SUS304. The results are shown in Table 3. Example 13 Using the polyamide-imide resin of Example 1, a sintered body was produced in exactly the same manner as in Example 12, and its wear rate and coefficient of dynamic friction were measured. The results are shown in Table 3.
Claims (1)
100μのものが98%以上であり、且つこの部分の
コールターカウンターによる粒度分布に基づいて
計算されるD1(長さ平均粒径)およびD4(重量平
均粒径)が D1≦20μ、D4/D1≦3 なる条件を満足する粒径および粒度分布のポリア
ミドイミド樹脂の微細粉末を該樹脂の軟化温度以
上分解温度以下の温度で加熱焼結させることによ
つて得られる多孔質焼結体。[Claims] 1. Particle size of 4 to 4 when measured with a Coulter counter.
100μ is 98% or more, and D 1 (length average particle diameter) and D 4 (weight average particle diameter) calculated based on the particle size distribution by Coulter counter of this part are D 1 ≦20μ, D Porous sintered material obtained by heating and sintering fine powder of polyamideimide resin having a particle size and particle size distribution satisfying the following conditions: 4 /D 1 ≦3 at a temperature above the softening temperature and below the decomposition temperature of the resin. body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8278982A JPS58198542A (en) | 1982-05-17 | 1982-05-17 | Sintered porous article |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8278982A JPS58198542A (en) | 1982-05-17 | 1982-05-17 | Sintered porous article |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58198542A JPS58198542A (en) | 1983-11-18 |
| JPH0363578B2 true JPH0363578B2 (en) | 1991-10-01 |
Family
ID=13784169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8278982A Granted JPS58198542A (en) | 1982-05-17 | 1982-05-17 | Sintered porous article |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58198542A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5422034A (en) * | 1992-12-16 | 1995-06-06 | Hitachi Chemical Company, Ltd. | Purification of liquid crystals and liquid crystal composition |
-
1982
- 1982-05-17 JP JP8278982A patent/JPS58198542A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58198542A (en) | 1983-11-18 |
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