JPH0363578U

JPH0363578U -

Info

Publication number: JPH0363578U
Application number: JP12062589U
Authority: JP
Priority date: 1989-10-17
Filing date: 1989-10-17
Publication date: 1991-06-20
Anticipated expiration: 2004-10-05
Also published as: JPH0638115Y2

Description

[Brief explanation of drawings]

第１図は本考案のメツキ液循環タンクの戻り管
構造の縦断面図、第２図は第１図の−断面図
である。第３図は電気メツキラインにおけるメツ
キ液の循環系の全体説明図、第４図は従来のメツ
キ液循環タンクの戻り管構造の縦断面図、第５図
は第４図のＹ−Ｙ断面図である。１……メツキ循環タンク、２……吸引管、３…
…ポンプ、４……メツキセル、５……受けパン、
６……戻り管、７……滞留メツキ液、８……タン
ク側壁、９……タンク側壁、１０……タンク底壁
、１１……タンク側壁、１２……タンク側壁、１
３……吸引口、１４……吐出口、１５……メツキ
液面、１６……衝突板、１７……支持棒、１８…
…筒体、１９……支持棒、２０……吐出口、２１
……滞留室。 FIG. 1 is a vertical cross-sectional view of the return pipe structure of the plating liquid circulation tank of the present invention, and FIG. 2 is a cross-sectional view taken from FIG. Fig. 3 is an overall explanatory diagram of the plating liquid circulation system in the electric plating line, Fig. 4 is a vertical cross-sectional view of the return pipe structure of a conventional plating liquid circulation tank, and Fig. 5 is a Y-Y cross-sectional view of Fig. 4. be. 1...Metsuki circulation tank, 2...Suction pipe, 3...
...Pump, 4...Metsukicell, 5...Ukepan,
6... Return pipe, 7... Retained plating liquid, 8... Tank side wall, 9... Tank side wall, 10... Tank bottom wall, 11... Tank side wall, 12... Tank side wall, 1
3... Suction port, 14... Discharge port, 15... Metering liquid level, 16... Collision plate, 17... Support rod, 18...
... Cylindrical body, 19 ... Support rod, 20 ... Discharge port, 21
...Retention room.

Claims

[Scope of Claim for Utility Model Registration] A suction port of a suction pipe for the temporarily retained plating liquid is provided near the bottom of the side wall at one end in the horizontal direction of a horizontally arranged plating liquid circulation tank, and near the side wall at the other end. A plating liquid circulation tank of an electroplating liquid circulation system in which a return pipe for the plating liquid is arranged vertically so that the discharge port of the plating liquid containing air bubbles is located with a gap from the surface of the temporarily retained plating liquid. In this plating liquid return pipe structure, a collision plate with which the plating liquid discharged from the return pipe collides is arranged between the discharge port of the return pipe and the liquid level of the temporarily retained plating liquid, and the inner circumferential surface of the upper end is arranged so that the plating liquid collides with it. The cylindrical body is positioned with a gap between the outer circumferential surface of the lower end of the return pipe and the outer circumferential surface of the above-mentioned collision plate, and the cylindrical body is arranged so that the lower end is located below the surface of the temporarily retained plating liquid. A discharge port with a discharge cross-sectional area larger than the discharge cross-sectional area of the return pipe is formed between the inner circumference of the body and a temporary retention chamber for the plating liquid between the inner circumference of the cylinder above the collision plate and the outer circumference of the return pipe. The plating liquid return pipe structure of the plating liquid circulation tank of the electroplating liquid circulation system is characterized by the following.