JPH0363831B2 - - Google Patents
Info
- Publication number
- JPH0363831B2 JPH0363831B2 JP59230709A JP23070984A JPH0363831B2 JP H0363831 B2 JPH0363831 B2 JP H0363831B2 JP 59230709 A JP59230709 A JP 59230709A JP 23070984 A JP23070984 A JP 23070984A JP H0363831 B2 JPH0363831 B2 JP H0363831B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- conductors
- flexible wiring
- insulating film
- spring material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電気機器に広く利用することのできる
可撓性配線板関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a flexible wiring board that can be widely used in electrical equipment.
従来例の構成とその問題点
近年、電気機器の小型化、軽量化そして機器組
立工程の合理化を目的として可撓性配線板が多く
用いられている。これらの可撓性配線板は、他の
電気回路の導体と電気的に接続して使用されるこ
とが多く、また、単に電気回路の導体相互を接続
するための接続線として用いられることも多い。Conventional Structures and Their Problems In recent years, flexible wiring boards have been widely used for the purpose of reducing the size and weight of electrical equipment and streamlining the equipment assembly process. These flexible wiring boards are often used by electrically connecting conductors of other electric circuits, and are also often used simply as connecting wires to connect conductors of electric circuits to each other. .
以下、図面を用いて、従来の可撓性配線板を用
いた電気回路導体の接続方法について説明する。 Hereinafter, a method for connecting electric circuit conductors using a conventional flexible wiring board will be described with reference to the drawings.
第1図は、従来の可撓性配線板を用いた最も一
般的な電気回路導体の接続方法の一例を示す斜視
図であり、これは、導体配線を設けた硬質性配線
板4に、コネクター装置5を搭載接続し、このコ
ネクター装置に、挿入を容易にするために硬質性
絶縁板3を裏打ちした可撓性配線板1を挿入し
て、コネクター装置の金属片導体と可撓性配線板
の配線導体とを接触させ電気的に接続する方法で
ある。この場合、接触部の電気的接続を安定にす
るために金属片および配線導体に貴金属メツキを
施す。この方法は、コネクター装置を必要とする
ので極めてコスト高になると同時にコネクター装
置の金属片導体の間隔には製造上限界があり小型
化が難しいという欠点があつた。 FIG. 1 is a perspective view showing an example of the most common electrical circuit conductor connection method using a conventional flexible wiring board. A device 5 is mounted and connected, and a flexible wiring board 1 lined with a rigid insulating plate 3 is inserted into this connector device to facilitate insertion, and the metal piece conductor of the connector device and the flexible wiring board are inserted. This is a method of electrically connecting the wires by bringing them into contact with the wiring conductors. In this case, the metal piece and the wiring conductor are plated with a precious metal in order to stabilize the electrical connection at the contact portion. This method has the disadvantage that it requires a connector device, resulting in extremely high costs, and at the same time, there is a manufacturing limit to the spacing between the metal strip conductors of the connector device, making miniaturization difficult.
第2図および第3図は、もう一つの従来の可撓
性配線板を用いた電気回路導体の接続方法を示す
斜視図および断面図であり、絶縁性フイルム11
上に並列配置して形成した多数の配線導体12を
有する可撓性配線板と、硬質性絶縁基板14上に
並列配置して形成した回路導体16を有する硬質
性配線板のそれぞれの導体12および16を対向
させて半田接続部17により電気的に接続する方
法である。この方法の半田接続は、予じめ配線導
体に盛り上げて形成した予備半田あるいは半田ペ
ーストを加熱加圧して半田を再溶融して行なう。
しかしこの接続方法は、半田の再溶融は絶縁性フ
イルムを介しての間接加熱であり絶縁性フイルム
に損傷を与えたり微細配線での配線導体同志の位
置合わせが難しくまた加圧により溶接半田が押し
出され隣接した配線導体と短絡する危険があるな
ど多くの問題点を有していた。 FIGS. 2 and 3 are perspective views and cross-sectional views showing another conventional method for connecting electric circuit conductors using a flexible wiring board, in which an insulating film 11
Conductors 12 and 16 are placed facing each other and electrically connected through solder connection portions 17. Solder connection in this method is performed by remelting the solder by heating and pressurizing preliminary solder or solder paste that has been previously formed on the wiring conductor.
However, in this connection method, the solder is remelted by indirect heating through the insulating film, which can damage the insulating film, make it difficult to align the wiring conductors with each other in fine wiring, and pressurize the welding solder. This had many problems, including the risk of short circuiting with adjacent wiring conductors.
発明の目的
本発明の目的は、電気回路導体の接続が容易で
しかも接続部の小型化を可能とする可撓性配線板
とこれを用いた回路導体の接続方法を提供するこ
とにある。OBJECTS OF THE INVENTION An object of the present invention is to provide a flexible wiring board that allows easy connection of electric circuit conductors and miniaturization of the connecting portion, and a method of connecting circuit conductors using the flexible wiring board.
発明の構成
本発明の可撓性配線板は、接続端子部の並列配
置した配線導体に対して垂直方向に弾力性を生ず
るバネ材を有するように構成するものである。こ
れにより、硬質性配線板への可撓性配線板の挿入
時には、バネ材によつて可撓性配線板の並列配置
した配線導体と硬質性配線板の回路導体とが密着
した構造となり、半田浴への浸漬法により確実に
半田接続できるために、電気回路導体の接続が容
易でしかも接続部の小型化が可能となるものであ
る。Configuration of the Invention The flexible wiring board of the present invention is configured to have a spring material that generates elasticity in a direction perpendicular to the wiring conductors arranged in parallel in the connection terminal portion. As a result, when the flexible wiring board is inserted into the rigid wiring board, the wiring conductors arranged in parallel on the flexible wiring board and the circuit conductors on the rigid wiring board are in close contact with each other due to the spring material, and the soldering Since solder connection can be reliably performed by dipping into a bath, it is easy to connect electric circuit conductors and it is possible to miniaturize the connecting portion.
実施例の説明
以下本発明の一実施例について、図面を参照し
ながら説明する。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.
第4図および第5図は本発明の一実施例におけ
る可撓性配線板の斜視図である。第4図において
21は絶縁性フイルム、22は接続端子部の並列
配置した配線導体、23は板バネ材で耐熱性樹脂
成型品である。接続端子部の配線導体22の反対
面の絶縁性フイルム21と板バネ材23を耐熱性
接着剤により接着一体化して第5図の状態を得
た。第5図は本実施例の可撓性配線板の完成状態
である。 4 and 5 are perspective views of a flexible wiring board in one embodiment of the present invention. In FIG. 4, 21 is an insulating film, 22 is a wiring conductor of connecting terminal portions arranged in parallel, and 23 is a plate spring material molded from a heat-resistant resin. The insulating film 21 on the opposite side of the wiring conductor 22 of the connection terminal portion and the leaf spring material 23 were bonded together with a heat-resistant adhesive to obtain the state shown in FIG. 5. FIG. 5 shows the completed state of the flexible wiring board of this example.
以上のように構成された本実施例の可撓性配線
板は、板バネ材により接続端子部の並列配置した
配線導体に対して垂直方向に弾力性を生ずる構造
になつている。板バネ材23は、配線導体22の
ない側から前記絶縁性フイルム21に配置され、
さらに、長手方向の寸法が絶縁性フイルム21よ
り長く、かつ後述のスリツト孔への過剰挿入防止
のためのキリカキおよび挿入後の脱落防止のため
のカエリを設けた構造にしてある。 The flexible wiring board of this embodiment constructed as described above has a structure in which the plate spring material provides elasticity in the direction perpendicular to the wiring conductors arranged in parallel in the connection terminal portion. The leaf spring material 23 is placed on the insulating film 21 from the side without the wiring conductor 22,
Further, it has a structure in which the longitudinal dimension is longer than the insulating film 21, and is provided with a slit to prevent excessive insertion into the slit hole, which will be described later, and a burr to prevent it from falling off after insertion.
第6図、第7図および第8図は本発明の上記の
可撓性配線板を用いた電気回路導体の接続方法の
斜視図および断面図である。第6図,第7図およ
び第8図において24は硬質性絶縁基板、25は
硬質性絶縁基板に設けたスリツト孔、26は硬質
性絶縁基板上に形成した回路導体であり、24と
26を含めたものが硬質性配線板である。 6, 7, and 8 are a perspective view and a sectional view of a method for connecting electric circuit conductors using the above-described flexible wiring board of the present invention. 6, 7, and 8, 24 is a rigid insulating substrate, 25 is a slit hole provided in the rigid insulating substrate, and 26 is a circuit conductor formed on the rigid insulating substrate. What is included is a rigid wiring board.
第6図に示すような状態で、スリツト孔および
スリツト孔端部まで回路導体を形成した硬質性配
線板のスリツト孔に、前記の本実施例の可撓性配
線板の接続端子部を挿入する。第7図は挿入状態
の断面図であるが、可撓性配線板の並列配置した
配線導体22と硬質性配線板の回路導体26は板
バネ材23の弾力性による作用により極めて良く
密着した状態となる。次に、一般的な半田付け法
である半田浴への浸漬法により、他の電気回路部
品と同時に半田付けを行なう。第8図は、半田付
けを行なつて可撓性配線板の並列配置した配線導
体21と硬質性配線板の回路導体26を半田接続
部27により接続した状態の断面図である。第7
図に示すように、可撓性配線板の配線導体22と
硬質性配線板の回路導体26は良好に密着した状
態で半田浴に浸漬されるので確実な半田接続が得
られた。なお、可撓性配線板の配線導体および硬
質性配線板の回路導体の並列配置間隔について
種々の検討を行なつたが、導体幅0.3mm導体間隔
0.3mm以上で短絡もなく良好な結果が得られた。 In the state shown in FIG. 6, the connection terminal portion of the flexible wiring board of this embodiment is inserted into the slit hole of the rigid wiring board in which the circuit conductor is formed up to the end of the slit hole. . FIG. 7 is a cross-sectional view of the inserted state, and the wiring conductors 22 arranged in parallel on the flexible wiring board and the circuit conductors 26 on the rigid wiring board are in extremely close contact due to the elasticity of the leaf spring material 23. becomes. Next, soldering is performed at the same time as other electric circuit components using a common soldering method, ie, immersion in a solder bath. FIG. 8 is a cross-sectional view of a state in which the wiring conductors 21 of the flexible wiring board and the circuit conductors 26 of the rigid wiring board are connected by solder connection portions 27, which are arranged in parallel by soldering. 7th
As shown in the figure, the wiring conductor 22 of the flexible wiring board and the circuit conductor 26 of the rigid wiring board were immersed in the solder bath while being in good contact with each other, so that a reliable solder connection was obtained. In addition, various studies were conducted regarding the parallel arrangement spacing of the wiring conductors on the flexible wiring board and the circuit conductors on the rigid wiring board, and the conductor spacing was 0.3 mm in conductor width.
Good results were obtained with no short circuits at 0.3 mm or more.
なお、上記実施例では板バネ材として耐熱性樹
脂成形品を使用したが、金属等の耐熱性および弾
力性を有する材料が使用できる。また、可撓性配
線板を板バネ材の片面のみに構成したが、両面に
も構成できる。 In the above embodiment, a heat-resistant resin molded product was used as the leaf spring material, but a material having heat resistance and elasticity, such as metal, can be used. Moreover, although the flexible wiring board is configured on only one side of the leaf spring material, it can be configured on both sides.
発明の効果
以上の説明から明らかなように、本発明の可撓
性配線板は接続端子部の並列配置した配線導体に
対して、垂直方向に弾力性を生ずるバネ材を絶縁
フイルムに配線導体のない側から配置し、かつそ
の長手方向の寸法が絶縁フイルムよりも長く、さ
らに、その両端が硬質性配線板に設けたスリツト
孔への過剰挿入防止のためのキリカキおよび挿入
後の脱落防止のためのカエリを備えたバネ材を備
えているので、コネクター等の特別の接続装置を
必要とせず、一般の電気回路部品と同時に半田付
けすることにより容易に電気回路の接続ができ、
しかも微細な配線でも確実に接続できるので接続
部の小型化が可能であるという優れた効果が得ら
れる。さらに可撓性配線板を板バネ材の両面にも
構成できるという効果が得られる。Effects of the Invention As is clear from the above description, the flexible wiring board of the present invention has a spring material that generates elasticity in the vertical direction with respect to the wiring conductors arranged in parallel in the connecting terminal portion, and the wiring conductors are attached to the insulating film. It is placed from the non-contact side, and its longitudinal dimension is longer than the insulating film, and its both ends are sharpened to prevent excessive insertion into the slit hole provided in the rigid wiring board, and to prevent it from falling off after insertion. Since it is equipped with a spring material with a burr, there is no need for special connection devices such as connectors, and electrical circuits can be easily connected by soldering at the same time as general electrical circuit components.
Moreover, since even fine wiring can be reliably connected, an excellent effect can be obtained in that the connecting portion can be made smaller. Furthermore, there is an advantage that flexible wiring boards can be formed on both sides of the leaf spring material.
第1図、第2図および第3図は従来の可撓性配
線板を用いた電気回路導体の接続方法の斜視図お
よび断面図、第4図および第5図はそれぞれ本発
明の一実施例における可撓性配線板の斜視図、第
6図、第7図および第8図は本発明の可撓性配線
板を用いた電気回路導体の接続方法の斜視図およ
び断面図である。
1……可撓性配線板、3……硬質性絶縁板、4
……硬質性配線板、5……コネクター装置、1
1,21……絶縁性フイルム、12,22……配
線導体、23……板バネ材、14,24……硬質
性絶縁基板、25……スリツト孔、16,26…
…硬質性配線板の回路導体、17,27……半田
接続部。
1, 2 and 3 are perspective views and sectional views of a conventional method of connecting electric circuit conductors using a flexible wiring board, and FIGS. 4 and 5 are an embodiment of the present invention, respectively. FIG. 6, FIG. 7, and FIG. 8 are a perspective view and a sectional view of a method for connecting electric circuit conductors using the flexible wiring board of the present invention. 1... Flexible wiring board, 3... Rigid insulating board, 4
... Rigid wiring board, 5 ... Connector device, 1
1, 21... Insulating film, 12, 22... Wiring conductor, 23... Leaf spring material, 14, 24... Rigid insulating substrate, 25... Slit hole, 16, 26...
...Circuit conductor of rigid wiring board, 17, 27...Solder connection part.
Claims (1)
列配置した接続端子部の配線導体と、前記配線導
体のない側から前記絶縁フイルムに配置され、か
つ、前記配線導体に対して垂直方向に弾力性を生
ずるバネ材とを備え、前記バネ材の長手方向の寸
法が前記絶縁フイルムの幅より長く、かつその両
端が硬質性配線板に設けたスリツト孔への過剰挿
入防止のためのキリカキおよび挿入後の脱落防止
のためのカエリを備えたことを特徴とする可撓性
配線板。1. An insulating film, a wiring conductor of a connecting terminal portion arranged in parallel to the insulating film, and a wiring conductor arranged on the insulating film from the side without the wiring conductor and having elasticity in a direction perpendicular to the wiring conductor. a spring material to be generated, the longitudinal dimension of the spring material is longer than the width of the insulating film, and both ends thereof are provided with sharp edges to prevent excessive insertion into a slit hole provided in a rigid wiring board, and after insertion. A flexible wiring board characterized by having a burr to prevent it from falling off.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59230709A JPS61108193A (en) | 1984-11-01 | 1984-11-01 | flexible wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59230709A JPS61108193A (en) | 1984-11-01 | 1984-11-01 | flexible wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61108193A JPS61108193A (en) | 1986-05-26 |
| JPH0363831B2 true JPH0363831B2 (en) | 1991-10-02 |
Family
ID=16912077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59230709A Granted JPS61108193A (en) | 1984-11-01 | 1984-11-01 | flexible wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61108193A (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59172288A (en) * | 1983-03-18 | 1984-09-28 | 松下電器産業株式会社 | Printed board unit |
-
1984
- 1984-11-01 JP JP59230709A patent/JPS61108193A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61108193A (en) | 1986-05-26 |
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