JPH0363950U - - Google Patents
Info
- Publication number
- JPH0363950U JPH0363950U JP1989124723U JP12472389U JPH0363950U JP H0363950 U JPH0363950 U JP H0363950U JP 1989124723 U JP1989124723 U JP 1989124723U JP 12472389 U JP12472389 U JP 12472389U JP H0363950 U JPH0363950 U JP H0363950U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- mounting device
- heat sink
- guide groove
- spring member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例を示す電子部品取り
付け装置の構成斜視図、第２図、第３図は従来の
取り付け装置の構成斜視図である。
１０……プリント基板、１１……電子部品、２
０……ヒートシンク、２１……平面部、２３……
腕部、２３ａ，２３ｂ……案内溝、２４……バネ
部材、２４ａ……移動板、２４ｂ……バネ部。
FIG. 1 is a perspective view of the structure of an electronic component mounting device showing an embodiment of the present invention, and FIGS. 2 and 3 are perspective views of the structure of a conventional mounting device. 10...Printed circuit board, 11...Electronic component, 2
0...Heat sink, 21...Plane part, 23...
Arm portion, 23a, 23b...guide groove, 24...spring member, 24a...moveable plate, 24b...spring portion.
Claims (1)
と、このヒートシンクに電子部品を押圧固定する
バネ部材とを備えた電子部品取り付け装置におい
て、 前記ヒートシンクに、先端部に案内溝を有し一
つ以上の電子部品を左右から囲む互いに平行する
腕部を設け、前記バネ部材を案内溝に挿入し案内
溝に囲まれた部分に設置された電子部品を押圧固
定するようにした電子部品の取り付け装置。 ２ ばね部材の断面形状を略Ｃ形状とした請求項
１記載の電子部品取り付け装置。[Claims for Utility Model Registration] 1. An electronic component mounting device comprising a heat sink mounted on a printed circuit board and a spring member for press-fixing an electronic component to the heat sink, wherein the heat sink has a guide groove at its tip. The electronic component is provided with mutually parallel arms that surround one or more electronic components from the left and right, and the spring member is inserted into a guide groove to press and fix the electronic component installed in the area surrounded by the guide groove. mounting device. 2. The electronic component mounting device according to claim 1, wherein the spring member has a substantially C-shaped cross section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989124723U JPH0363950U (en) | 1989-10-25 | 1989-10-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989124723U JPH0363950U (en) | 1989-10-25 | 1989-10-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0363950U true JPH0363950U (en) | 1991-06-21 |
Family
ID=31672628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989124723U Pending JPH0363950U (en) | 1989-10-25 | 1989-10-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0363950U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101144564B1 (en) * | 2005-12-14 | 2012-05-11 | 현대자동차주식회사 | A connecting structure for Intake device of engine |
-
1989
- 1989-10-25 JP JP1989124723U patent/JPH0363950U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101144564B1 (en) * | 2005-12-14 | 2012-05-11 | 현대자동차주식회사 | A connecting structure for Intake device of engine |
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