JPH0363971U - - Google Patents
Info
- Publication number
- JPH0363971U JPH0363971U JP12343789U JP12343789U JPH0363971U JP H0363971 U JPH0363971 U JP H0363971U JP 12343789 U JP12343789 U JP 12343789U JP 12343789 U JP12343789 U JP 12343789U JP H0363971 U JPH0363971 U JP H0363971U
- Authority
- JP
- Japan
- Prior art keywords
- bare conductor
- parallel
- circuit board
- pattern
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 3
- 238000005219 brazing Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案の一実施例の斜視図、第２図
は第１図の実施例のはんだ付け部の断面図、第３
図はこの考案の他の実施例の斜視図、第４図は従
来例の斜視図、第５図は第４図の従来例のはんだ
付け部の断面図である。
１……回路基板、２……電子部品、３……リー
ド線、４，５，６，８，９……裸導線、７……は
んだ、１０……パターン。
Fig. 1 is a perspective view of one embodiment of this invention, Fig. 2 is a sectional view of the soldering part of the embodiment of Fig. 1, and Fig. 3 is a perspective view of an embodiment of the invention.
4 is a perspective view of another embodiment of the invention, FIG. 4 is a perspective view of a conventional example, and FIG. 5 is a sectional view of the soldering portion of the conventional example shown in FIG. 1... Circuit board, 2... Electronic component, 3... Lead wire, 4, 5, 6, 8, 9... Bare conducting wire, 7... Solder, 10... Pattern.
Claims (1)
、該裸導線の一部または全体が互いに平行に近接
して回路基板に固定される少なくとも１本の裸導
線とからなり、前記裸導線平行部分に電子部品の
リード線を平行に置き鑞付けすることを特徴とす
る電子部品接続装置。 It consists of one bare conductor that is electrically connected to the pattern of the circuit board, and at least one bare conductor that is partially or entirely fixed to the circuit board in parallel and close proximity to each other, and the parallel part of the bare conductor An electronic component connecting device characterized by placing lead wires of electronic components parallel to each other and brazing them.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12343789U JPH0363971U (en) | 1989-10-21 | 1989-10-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12343789U JPH0363971U (en) | 1989-10-21 | 1989-10-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0363971U true JPH0363971U (en) | 1991-06-21 |
Family
ID=31671414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12343789U Pending JPH0363971U (en) | 1989-10-21 | 1989-10-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0363971U (en) |
-
1989
- 1989-10-21 JP JP12343789U patent/JPH0363971U/ja active Pending
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