JPH0364821A - Cathode body structure - Google Patents

Cathode body structure

Info

Publication number
JPH0364821A
JPH0364821A JP1200626A JP20062689A JPH0364821A JP H0364821 A JPH0364821 A JP H0364821A JP 1200626 A JP1200626 A JP 1200626A JP 20062689 A JP20062689 A JP 20062689A JP H0364821 A JPH0364821 A JP H0364821A
Authority
JP
Japan
Prior art keywords
heat
side edge
back surface
temperature
heating elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1200626A
Other languages
Japanese (ja)
Inventor
Kinjiro Sano
佐野 金治郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1200626A priority Critical patent/JPH0364821A/en
Publication of JPH0364821A publication Critical patent/JPH0364821A/en
Pending legal-status Critical Current

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  • Electrodes For Cathode-Ray Tubes (AREA)
  • Solid Thermionic Cathode (AREA)

Abstract

PURPOSE:To uniform the temperature of a substrate metal during its operation and restrain the variation of a color tone with temperature by forming a side edge-lead wires on the peripheral parts along the longitudinal direction on the back surface of a heat-resistant insulation substrate. CONSTITUTION:Snaking-like heating elements 5a-5c composed of three tungsten thin films are arranged in a straight line state on the back surface of a heat- resistant insulation substrate 1, and these heating elements 5a-5c are seriesly connected with a lead wire 5d. From the heating elements 5a and 5c in both sides, a ribbon-like side edge lead wire 7 extends to a 180 deg. opposite side along the peripheral part of the back surface of the heat-resistant insulation substrate 1 so as to be connected to a heater terminal 6. Since thus the side edge lead wire 7 is arranged on a peripheral part in a longitudinal direction on the back surface of the heat-resistant insulation substrate 1, heat loss produced via an outside lead wire can be relaxed, and also the emission from the peripheral part of the heat-resistant insulation substrate 1, of heat generated by a heating element 5 can be reduced. This enables the temperature of three substrate metals 2 to be uniformed, an electron emission characteristic to be stabilized, and thereby the variation of a color tone during an action to be restrained.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は陰極構体に関する。さらに詳しくは、インライ
ン型カラーブラウン管に用いられる積層状の陰極構体に
関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cathode assembly. More specifically, the present invention relates to a laminated cathode structure used in an in-line color cathode ray tube.

[従来の技術] 従来よりインライン型カラーブラウン管には、第5〜7
図に示すような積層状陰極構体が用いられている。第5
図は電子放射側の拡大平面図、第6図は加熱側の拡大平
面図、第7図は陰極構体の拡大断面図である。第5〜7
図において、(1)は耐熱性絶縁8基板で、たとえば0
.1〜0.4mm程度の厚さのアルミナなどからできて
いる。(2a)、(2b)、(2c)は直線状に配設さ
れた基体金属で、前記耐熱性絶縁基板(1)の表面にた
とえば還元性不純物を微量含有するニッケルなどがたと
えば、スパッタリングなどの方法で被着形成されている
。(4)はたとえば(Ba、 Sr、 Ca) Oなど
のアルカリ土類金属酸化物からなる電子放射物質で、前
記金属基体(2a)、(2b)、(2C〉上にスプレー
などの方法で被着形成されている。(3)はリード線で
あり基体金属(2)と同様の方法で一体的に前記耐熱性
絶縁基板(1)上に被着形成されている。(3a〉はリ
ード線(3)の先端にある陰極端子で、図示はしていな
いが外部と導線により接続される。(5a)、(5b)
、(5C)は発熱体で、耐熱性絶縁基板(1)の裏面の
前記基体金属(2a)、(2b)、(2C)に対応する
部位にスパッタリングなどによりタングステンなどが蛇
行状に被着形成されている。
[Conventional technology] Traditionally, in-line color cathode ray tubes have 5th to 7th
A laminated cathode structure as shown in the figure is used. Fifth
6 is an enlarged plan view of the electron emission side, FIG. 6 is an enlarged plan view of the heating side, and FIG. 7 is an enlarged sectional view of the cathode structure. 5th to 7th
In the figure, (1) is a heat-resistant insulated 8-board, for example 0
.. It is made of alumina or the like with a thickness of about 1 to 0.4 mm. (2a), (2b), and (2c) are base metals arranged in a straight line, and nickel or the like containing a small amount of reducing impurities is applied to the surface of the heat-resistant insulating substrate (1) by sputtering or the like. It is formed by adhesion method. (4) is an electron-emitting material made of an alkaline earth metal oxide such as (Ba, Sr, Ca) O, and is coated onto the metal substrates (2a), (2b), and (2C) by a method such as spraying. (3) is a lead wire, which is integrally formed on the heat-resistant insulating substrate (1) in the same manner as the base metal (2). (3a> is a lead wire) The cathode terminal at the tip of (3) is connected to the outside by a conductor (not shown). (5a), (5b)
, (5C) is a heating element, in which tungsten or the like is deposited in a serpentine shape by sputtering or the like on the back surface of the heat-resistant insulating substrate (1) corresponding to the base metals (2a), (2b), and (2C). has been done.

(5d)は3個の発熱体(5a〉、(5b)、(5C)
を直列接続する導線であり発熱体(5a)、(5b)、
(5C〉と一体内に被着形成されている。(6)はヒー
タ端子で外部導線(図示せず)と接続され、発熱体(5
)を加熱するための電圧が印加される。(5e)はヒー
タ端子(6)と両側の発熱体〈5a)、(5C〉とを接
続する導線である。
(5d) is three heating elements (5a>, (5b), (5C)
It is a conducting wire that connects in series the heating elements (5a), (5b),
(6) is a heater terminal connected to an external conductor (not shown), and a heating element (5C).
) is applied. (5e) is a conducting wire connecting the heater terminal (6) and the heating elements (5a) and (5C) on both sides.

このように構成された陰極構体において、ヒータ端子(
6)に電圧を印加すると発熱体(5a)、(5b)、(
5c)に電流が流れ式(■): g、、、12xRxt       (1)(式中、Q
は発生熱量、iは電流、Rは抵抗、tは時間を表わす)
で表わされるジュール熱が発生する。
In the cathode structure configured in this way, the heater terminal (
When voltage is applied to 6), the heating elements (5a), (5b), (
5c) Current flows through the equation (■): g, , 12xRxt (1) (in the equation, Q
is the amount of heat generated, i is the current, R is the resistance, and t is the time)
Joule heat expressed as is generated.

発生したジュール熱は熱伝導および熱輻射によって耐熱
性絶縁基板(1)を通して3個の基体金属(2a)、(
2b)、〈2C〉を加熱する。そして、基体金属(2a
)、(2b)、(2C)が約800℃の動作温度まで加
熱されると電子放射物質(4)から電子ビームが発射さ
れ、カラーブラウン管の3色の蛍光面を光らせる。
The generated Joule heat passes through the heat-resistant insulating substrate (1) to the three base metals (2a), (
2b), heat <2C>. Then, the base metal (2a
), (2b), and (2C) are heated to an operating temperature of about 800°C, an electron beam is emitted from the electron emitting material (4), causing the three-color phosphor screen of the color cathode ray tube to glow.

[発明が解決しようとする課題] しかしながら、前述のように各発熱体(5a)、(5b
〉、(5c)に電圧を印加して基体金属(2a)、(2
b)、(2C)を約800℃の動作温度にする際、中央
の基体金属(2b)の温度がその両側に配置されている
基体金属(2a)、(2c)の温度よりも高温になる。
[Problem to be solved by the invention] However, as described above, each heating element (5a), (5b
>, (5c) to apply a voltage to the base metals (2a), (2
b) When bringing the operating temperature of (2C) to approximately 800°C, the temperature of the central base metal (2b) becomes higher than the temperature of the base metals (2a) and (2c) arranged on both sides thereof. .

この理由は、両側の発熱体(5a)、(5C〉はヒータ
端子(6)を通しての熱伝導損失が大きいため温度が上
がりにくいことによる。そのため、この中央の発熱体(
5b)に対応して配設されている中央の基体金属(2b
)の温度がその両側に配置しである基体金属(2a)、
(2c)の温度よりも高くなる。一般に基体金属(2)
の温度が所定の動作温度よりも高くなればなるほど、基
体金属(2)に微量含まれていて、電子放射物質(4)
を活性化する作用を有する還元性元素であるSlやMg
の拡散蒸発速度を加速することになる。
The reason for this is that the heating elements (5a) and (5C) on both sides have a large heat conduction loss through the heater terminal (6), making it difficult for the temperature to rise.
The central base metal (2b) is arranged corresponding to the base metal (2b).
) is arranged on both sides of the base metal (2a),
The temperature becomes higher than that in (2c). Generally base metal (2)
The higher the temperature of
Sl and Mg, which are reducing elements that have the effect of activating
This will accelerate the rate of diffusion and evaporation.

その結果、長時間動作を行なうと温度の高い中央の基体
金属(2b)からの電子放射特性が両側の基体金属(2
a)、(2C)のそれに比べ早期に劣化し始め、3個の
基体金属(2)からの電子放射特性のバランスが崩れ、
いわゆるホワイトバランス崩れと称される蛍光面上での
色調の変化が生じる欠点があった。
As a result, when operating for a long time, the electron emission characteristics from the high-temperature central base metal (2b) change from the base metals on both sides (2b).
Compared to a) and (2C), it begins to deteriorate earlier, and the balance of electron emission characteristics from the three base metals (2) is lost.
There was a drawback that a change in color tone on the phosphor screen, so-called white balance collapse, occurred.

さらに、同じ基体金属(2)の中でも第5図に示すV方
向での温度差があり、たとえば基体金属(2)の最中央
部と最周縁部とでは約15℃の温度差が生じている。こ
れは、耐熱性絶縁基板(1)の長辺側に陰極端子(3)
があり、これに接続された外部リード線を通して熱伝導
損失が発生するためである。このような温度差があると
同一基体金属(2)内で電子放射特性のムラを生ずるこ
とにもなる。
Furthermore, even within the same base metal (2), there is a temperature difference in the V direction shown in Figure 5. For example, there is a temperature difference of approximately 15°C between the centermost part and the most peripheral part of the base metal (2). . This has a cathode terminal (3) on the long side of the heat-resistant insulating board (1).
This is because heat conduction loss occurs through the external lead wires connected to this. Such a temperature difference also causes unevenness in electron emission characteristics within the same base metal (2).

本発明は前記問題点に鑑みなされたものであって、3個
の基体金属(2)の動作中の温度を均一化して長時間の
動作でも色調の変化を抑制することができる陰極構体を
提供することを目的とする。
The present invention has been made in view of the above-mentioned problems, and provides a cathode structure that can equalize the temperature of the three base metals (2) during operation and suppress changes in color tone even during long-time operation. The purpose is to

[課題を解決するための手段] 本発明の陰極構体は、長方形状の耐熱性絶縁基板の表面
に直線状に配設された3個の基体金属と、該基体金属に
被覆形成された電子放射物質と、前記耐熱性絶縁基板の
裏面上の前記各金属基体と対応する位置に蛇行配設され
た薄膜リボン状の発熱体と、前記発熱体相互を直列接続
する接続導線と、前記耐熱性絶縁基板の裏面上の長手方
向周縁部に配設された側縁導線とからなることを特徴と
している。
[Means for Solving the Problems] The cathode structure of the present invention includes three base metals arranged in a straight line on the surface of a rectangular heat-resistant insulating substrate, and an electron emitting base metal coated on the base metal. a substance, a heating element in the shape of a thin film ribbon meanderingly disposed at a position corresponding to each of the metal substrates on the back surface of the heat-resistant insulating substrate, a connecting wire connecting the heating elements in series, and the heat-resistant insulating material. It is characterized by comprising a side edge conductor wire disposed at the longitudinal periphery on the back surface of the substrate.

[作 用] 本発明においては、耐熱性絶縁基板(1)の裏面上の長
手方向周縁部に側縁導線を配設しているので、外部導線
を介して生ずる熱損失を緩和できるとともに、発熱体(
5)により発生された熱が耐熱性絶縁基板の周縁部から
放出されるのを緩和することができる。
[Function] In the present invention, since the side edge conductor is disposed at the longitudinal peripheral edge on the back surface of the heat-resistant insulating substrate (1), it is possible to alleviate heat loss occurring through the external conductor, and also to reduce heat generation. body(
5) It is possible to reduce the release of the heat generated from the periphery of the heat-resistant insulating substrate.

[実施例] 以下、本発明の実施例を図面に基づき説明するが、本発
明はかかる実施例のみに限定されるものではない。
[Examples] Hereinafter, examples of the present invention will be described based on the drawings, but the present invention is not limited only to these examples.

第1図は本発明の陰極構体の耐熱性絶縁基板(1)の裏
面拡大図である。第1図において従来例と同一または類
似の要素については同一符号を付してその説明は省略す
る。第1図に示すように3個のタングステンの薄膜から
なる蛇行状の発熱体(5a)、(5b)、(5c〉が、
耐熱性絶縁基板(1)の裏面上に直線状ニ配設すレ、コ
レらの発熱体(5a〉、(5b)、(5c)は導線(5
d〉により直列接続されている。両側の発熱体(5a)
、(5c)からはリボン状の側縁導線(刀が延びて耐熱
性絶縁基板(1)の裏面の周縁部に沿って180’反対
側まで延びてヒータ端子(6)に接続されている。これ
らの発熱体(5a)、(5b〉、(5c〉、導線(5d
)、側縁導線(7)およびヒータ端子(6)は全てタン
グステンをスパッタリング法で一体的に形成したもので
ある。これらの膜厚は3胴で幅は0.2關である。この
側縁導線(7)は幅をたとえば0.14mmとし、単位
長さ当りの抵抗値を43%大きくして副発熱体とするこ
ともできる。側縁導線(7)に副発熱体としての機能を
もたせるための膜厚、幅および単位長さ当りの抵抗値は
、前記に限定されるものではなく、膜厚は2〜5洞、幅
は0.1〜0 、3 oneの範囲で適宜選定でき、ま
た単位長当りの抵抗値は最大50%まで大きくすること
ができる。膜厚が2胴未満であれば抵抗値がばらつき、
一方5珊を超えれば抵抗が小さくなり発熱しにくいとい
う問題を生じる。また幅が0.1a未満であれば断線な
どを生じ信頼性に問題があり、一方0 、3 mrsを
超えれば小型化が不可能であり、かつ抵抗が小さくなり
発熱しにくいという問題を生じる。
FIG. 1 is an enlarged view of the back side of the heat-resistant insulating substrate (1) of the cathode structure of the present invention. In FIG. 1, elements that are the same or similar to those of the conventional example are given the same reference numerals and their explanations will be omitted. As shown in Fig. 1, three meandering heating elements (5a), (5b), (5c) made of tungsten thin films are
These heating elements (5a>, (5b), and (5c) are arranged in a straight line on the back surface of the heat-resistant insulating substrate (1).
d> are connected in series. Heating elements on both sides (5a)
, (5c), a ribbon-shaped side edge conductor extends along the peripheral edge of the back surface of the heat-resistant insulating substrate (1) to the opposite side 180' and is connected to the heater terminal (6). These heating elements (5a), (5b>, (5c), conductor (5d)
), the side edge conductor (7), and the heater terminal (6) are all integrally formed of tungsten by sputtering. The thickness of these films is 3 mm and the width is 0.2 mm. This side edge conducting wire (7) may have a width of, for example, 0.14 mm, and may have a resistance value per unit length increased by 43% to serve as a sub-heating element. The film thickness, width, and resistance value per unit length for giving the side edge conductor (7) a function as a sub-heating element are not limited to the above, and the film thickness is 2 to 5 holes and the width is It can be appropriately selected in the range of 0.1 to 0.3 one, and the resistance value per unit length can be increased up to 50%. If the film thickness is less than 2 cylinders, the resistance value will vary,
On the other hand, if it exceeds 5 corals, the resistance becomes small and a problem arises in that it is difficult to generate heat. Furthermore, if the width is less than 0.1a, wire breakage may occur, resulting in reliability problems, while if it exceeds 0.3 mrs, miniaturization is impossible, and the resistance becomes small, causing problems in that heat generation is difficult.

ヒータ端子(6)には図示はされていないが直径0.1
+m+sのニッケル線が溶接により接続され、このニッ
ケル線を介して外部より発熱体(5a)、(5b)、(
5c)を加熱するための電圧が印加される。ヒータ端子
(6)から電圧が印加されると各発熱体(5a)、(5
b)、(5c)は従来例でも触れたようにジュール熱が
発生する。従来の構成では両側の発熱体(5a)、(5
c)とヒータ端子(6)間の距離が短くヒータ端子(6
)を通しての熱伝導損失が大であったが、本発明の構成
であれば発熱体(5a)、(5c)からヒータ端子(6
)までの距離を長くとっているため、熱伝導損失による
発熱体(5a〉、(5c)の温度低下は無視できる。
Although not shown in the diagram, the heater terminal (6) has a diameter of 0.1
+m+s nickel wires are connected by welding, and heating elements (5a), (5b), (
A voltage is applied to heat 5c). When voltage is applied from the heater terminal (6), each heating element (5a), (5
In cases b) and (5c), Joule heat is generated as mentioned in the conventional example. In the conventional configuration, the heating elements (5a) and (5
c) and the heater terminal (6) is short.
), but with the configuration of the present invention, the heat conduction loss from the heating elements (5a) and (5c) to the heater terminal (6
), the temperature drop in the heating elements (5a>, (5c) due to thermal conduction loss can be ignored).

また、側縁導線(′7)の抵抗を発熱体(5)の抵抗よ
りも大きくし副発熱体としたばあいは、側縁導線(′7
)付近の温度が王かりやすくなるため、陰極端子(3)
を通しての熱伝導損失を補うこともできる。
In addition, when the resistance of the side edge conductor ('7) is made larger than the resistance of the heating element (5) and used as a sub-heating element, the side edge conductor ('7)
) The temperature near the cathode terminal (3) increases easily.
It can also compensate for heat conduction losses through.

第2図は側縁導線(7)に副発熱体としての機能をもた
せたばあいの基体金属(2a〉、(2b)、(2c)の
温度分布を示すグラフである。第2図には比較のために
従来例の基体金属の温度分布も併せて記載しである。第
2図より本発明の実施例では中央の基体金属(2b)と
両側の基体金属(2a)、(2c)との温度差はほとん
どないことがわかる。これに対し、従来例においては中
央の基体金属(2b)の温度が両側の基体金属(2a)
、〈2C)の温度に比べて約30℃高温であった。
Figure 2 is a graph showing the temperature distribution of the base metals (2a>, (2b), and (2c)) when the side edge conductor (7) has a function as a sub-heating element. Therefore, the temperature distribution of the base metal in the conventional example is also described.As can be seen from Figure 2, in the embodiment of the present invention, the temperature distribution between the center base metal (2b) and the base metals (2a) and (2c) on both sides is It can be seen that there is almost no temperature difference.In contrast, in the conventional example, the temperature of the central base metal (2b) is lower than that of the base metals (2a) on both sides.
The temperature was about 30°C higher than that of , <2C).

また第2図では明瞭に示されていないが、基体金属(2
)の最中6部と最周辺部で約15℃あった温度差も本構
成によれば5℃以下にすることができ実用上の問題はな
くなった。
Although it is not clearly shown in Fig. 2, the base metal (2
) The temperature difference, which was about 15°C between the middle 6th part and the outermost part, can be reduced to 5°C or less with this configuration, eliminating any practical problems.

第3図は本発明の陰極構体の他の実施例の耐熱性絶縁基
板(1)の裏面拡大図である。本実施例においてはヒー
タ端子(6)が耐熱性絶縁基板(1)の略中央部両側に
配設されているので、発熱体(5a)、(5c)のヒー
タ端子(6)からの熱伝導損失を少なくすると同時に、
耐熱性絶縁基板(1)を介してヒータ端子(6)を通し
て発熱体(5b)の熱伝導損失を図ることができる。発
熱体(5b)のヒータ端子(6)により熱伝導損失は両
側の発熱体(5a)、(5c)からの熱輻射により熱損
失が補償され、それぞれの発熱体(5a)、(5b)、
(5c)の温度を均一化することができる。
FIG. 3 is an enlarged view of the back side of a heat-resistant insulating substrate (1) of another embodiment of the cathode structure of the present invention. In this embodiment, since the heater terminals (6) are arranged on both sides of the heat-resistant insulating substrate (1) at the approximate center, heat conduction from the heater terminals (6) of the heating elements (5a) and (5c) While reducing losses,
Heat conduction loss of the heating element (5b) can be reduced through the heater terminal (6) via the heat-resistant insulating substrate (1). Heat conduction loss through the heater terminal (6) of the heating element (5b) is compensated for by thermal radiation from the heating elements (5a), (5c) on both sides, and the heat loss is compensated for by the heat radiation from the heating elements (5a), (5c) on both sides.
(5c) The temperature can be made uniform.

第4図は本実施例の基体金属(2a〉、(2b)、(2
c)の温度分布を示すグラフである。第4図にも第2図
と同様比較のために従来例の基体金属の温度分布も併せ
て記載しである。第4図より本実施例も先の実施例と同
様基体金属(2a)、(2b)、(2c)の温度差をほ
とんどなくすことかできる。
Figure 4 shows the base metals (2a>, (2b), (2) of this example).
It is a graph which shows the temperature distribution of c). Similarly to FIG. 2, FIG. 4 also shows the temperature distribution of the base metal of the conventional example for comparison. As can be seen from FIG. 4, in this embodiment as well as in the previous embodiment, the temperature difference between the base metals (2a), (2b), and (2c) can be almost eliminated.

以上の説明においては発熱体(5)の材料をタングステ
ンを例として説明したが、そのほか、モリブデン、チタ
ンまたはレニウムなどの高融点耐熱性材料を用いてもよ
い。また、側縁導線(7)を副発熱体と作用させるばあ
い、側縁導線(7)の厚さを発熱体(5a)、(5b)
、(5c)の厚みよりも薄くして抵抗値を高くしても該
作用を発揮させることができる。
In the above description, tungsten was used as an example of the material of the heating element (5), but other heat-resistant materials with high melting points such as molybdenum, titanium, or rhenium may also be used. In addition, when the side edge conductor (7) is made to interact with the sub-heating element, the thickness of the side edge conductor (7) should be adjusted to match the thickness of the side edge conductor (7) between the heating elements (5a) and (5b).
, (5c) and the resistance value can be increased to exhibit this effect.

[発明の効果] 以上説明したように、本発明によれば3個の基体金属の
温度が均一化され、電子放射特性が長期間にわたって安
定化され動作中の色調の変化を抑制することができると
ともに、基体金属内での温度ムラも改善され電子放射特
性を安定化することができる。
[Effects of the Invention] As explained above, according to the present invention, the temperature of the three base metals is made uniform, the electron emission characteristics are stabilized over a long period of time, and changes in color tone during operation can be suppressed. At the same time, temperature unevenness within the base metal is also improved and electron emission characteristics can be stabilized.

【図面の簡単な説明】 第1図は本発明の一実施例の陰極構体の平面図、第2図
は第1図に示す実施例の陰極構体の温度分布を示すグラ
フ、第3図は本発明の他の実施例の陰極構体の平面図、
第4図は第3図に示す実施例の陰極構体の温度分布を示
すグラフ、第5〜7図は従来の陰極構体の平面図、裏面
図および断面図である。 (図面の主要符号) (1):耐熱性絶縁基板 (2)二基体金属 (4):電子放射物質 (5a)、(5b)、 (5c)    :発熱体 (5d) :導 線 (6):ヒータ端子 (7):側縁導線 代  理  人 大  岩
[BRIEF DESCRIPTION OF THE DRAWINGS] FIG. 1 is a plan view of a cathode assembly according to an embodiment of the present invention, FIG. 2 is a graph showing the temperature distribution of the cathode assembly according to the embodiment shown in FIG. A plan view of a cathode structure according to another embodiment of the invention,
FIG. 4 is a graph showing the temperature distribution of the cathode assembly of the embodiment shown in FIG. 3, and FIGS. 5 to 7 are a plan view, a back view, and a sectional view of the conventional cathode assembly. (Main symbols in the drawing) (1): Heat-resistant insulating substrate (2) Bi-substrate metal (4): Electron emitting material (5a), (5b), (5c): Heating element (5d): Conductive wire (6) : Heater terminal (7): Side conductor wire charge

Claims (3)

【特許請求の範囲】[Claims] (1)長方形状の耐熱性絶縁基板の表面に直線状に配設
された3個の基体金属と、該基体金属に被覆形成された
電子放射物質と、前記耐熱性絶縁基板の裏面上の前記各
金属基体と対応する位置に蛇行配設された薄膜リボン状
の発熱体と、前記発熱体相互を直列接続する接続導線と
、前記耐熱性絶縁基板の裏面上の長手方向周縁部に配設
された側縁導線とからなることを特徴とする陰極構体。
(1) Three base metals arranged linearly on the surface of a rectangular heat-resistant insulating substrate, an electron emitting material coated on the base metal, and the three base metals on the back surface of the heat-resistant insulating substrate. A thin film ribbon-shaped heating element is arranged in a meandering manner at a position corresponding to each metal substrate, a connecting conductor wire is arranged to connect the heating elements in series, and a heating element is arranged in a longitudinal direction on the back surface of the heat-resistant insulating substrate. A cathode structure comprising a side edge conducting wire.
(2)前記側縁導線の単位長さ当りの抵抗値を発熱体の
単位長さ当りの抵抗値よりも大きくしたことを特徴とす
る請求項1記載の陰極構体。
(2) The cathode assembly according to claim 1, wherein the resistance value per unit length of the side edge conductor is greater than the resistance value per unit length of the heating element.
(3)前記側縁導線の端部が前記耐熱性絶縁基板の略中
央部に設けられてなる請求項1記載の陰極構体。
(3) The cathode assembly according to claim 1, wherein the end portion of the side edge conductor is provided approximately at the center of the heat-resistant insulating substrate.
JP1200626A 1989-08-02 1989-08-02 Cathode body structure Pending JPH0364821A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1200626A JPH0364821A (en) 1989-08-02 1989-08-02 Cathode body structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1200626A JPH0364821A (en) 1989-08-02 1989-08-02 Cathode body structure

Publications (1)

Publication Number Publication Date
JPH0364821A true JPH0364821A (en) 1991-03-20

Family

ID=16427508

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1200626A Pending JPH0364821A (en) 1989-08-02 1989-08-02 Cathode body structure

Country Status (1)

Country Link
JP (1) JPH0364821A (en)

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