JPH0365585A - Production of compound semiconductor single crystal - Google Patents
Production of compound semiconductor single crystalInfo
- Publication number
- JPH0365585A JPH0365585A JP19920189A JP19920189A JPH0365585A JP H0365585 A JPH0365585 A JP H0365585A JP 19920189 A JP19920189 A JP 19920189A JP 19920189 A JP19920189 A JP 19920189A JP H0365585 A JPH0365585 A JP H0365585A
- Authority
- JP
- Japan
- Prior art keywords
- boat
- heat
- reaction tube
- single crystal
- furnace core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は化合物半導体単結晶の製造技術さらには熱伝導
率の低いII−VI族化合物半導体単結晶を横型ボート
法により育成する技術に関し、特にCdTs系単結晶の
製造に利用して効果のある技術に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a technology for manufacturing compound semiconductor single crystals, and more particularly, to a technology for growing II-VI group compound semiconductor single crystals with low thermal conductivity by a horizontal boat method. The present invention relates to a technique that is effective when used in the production of CdTs-based single crystals.
[従来の技術]
従来、G a A sやInPのような化合物半導体単
結晶の製造方法の一つに横型ボート法がある。[Prior Art] One of the conventional methods for manufacturing compound semiconductor single crystals such as GaAs and InP is the horizontal boat method.
第3図に、横型ボート法の一つである二温度帯水平ブリ
ッジマン法を実現する一般的な単結晶成長装置の概略構
成を示す。FIG. 3 shows a schematic configuration of a general single crystal growth apparatus that implements the two-temperature horizontal Bridgman method, which is one of the horizontal boat methods.
すなわち、炉芯管1内には原料を充填したボート2と蒸
気圧制御用の元素3および対流防止板4が真空封入され
た石英反応管5が挿入され、炉芯管1の外側には分割ヒ
ータ6が配置され、このヒータ6によって炉芯管↓内に
軸方向に沿って2つの均熱*TL、T2が形成されるよ
うに構成されている。石英反応管5は当初原料を装填し
たボート2が高温度均熱帯T□に位置し、蒸気圧制御用
の元素3が低温度均熱帯T2に位置するように配置され
る。上記高温度均熱帯T工は、ボート2内の原料の融点
よりも少し高い温度に、また低温度均熱帯T2は反応管
S内が元素3の蒸気圧によって所望の圧力となるように
温度が制御される。この状態で、先ずボート2内の原料
を溶融させてから、ボート2が高温度均熱帯T1から低
温度均熱帯T2に向かうようにヒータ6を左方へ移動さ
せることにより、ボート2内の原料の固液界面を相対的
に移動させ、右端から左端に向かって結晶を成長させる
ものである。That is, a quartz reaction tube 5 in which a boat 2 filled with raw materials, an element 3 for steam pressure control, and a convection prevention plate 4 are vacuum-sealed is inserted into the furnace core tube 1, and a divided tube is placed outside the furnace core tube 1. A heater 6 is disposed, and the heater 6 is configured to form two equal heats *TL and T2 along the axial direction inside the furnace core tube ↓. The quartz reaction tube 5 is initially arranged so that the boat 2 loaded with raw materials is located in the high-temperature soaking zone T□, and the element 3 for vapor pressure control is located in the low-temperature soaking zone T2. The high-temperature soaking zone T has a temperature slightly higher than the melting point of the raw materials in the boat 2, and the low-temperature soaking zone T2 has a temperature so that the inside of the reaction tube S has a desired pressure due to the vapor pressure of element 3. controlled. In this state, the raw materials in the boat 2 are first melted, and then the heater 6 is moved to the left so that the boat 2 moves from the high temperature soaking zone T1 to the low temperature soaking zone T2. The solid-liquid interface of the solid-liquid interface is moved relatively to grow the crystal from the right end to the left end.
[発明が解決しようとする課題]
ところで、上記のような横型ボート法による結晶成長装
置において、例えばCdTeのような■−■族化合物半
導体単結晶を製造する場合、CdTeは表1に示すよう
にG a A sのような■−■族化合物半導体や、−
殻内なボート材質であるグラファイトやpBNに比べて
熱伝導率が1桁以上小さい。[Problems to be Solved by the Invention] By the way, when producing a single crystal of a ■-■ group compound semiconductor such as CdTe in a crystal growth apparatus using the horizontal boat method as described above, CdTe is grown as shown in Table 1. ■-■ group compound semiconductors such as GaAs, -
Thermal conductivity is more than an order of magnitude lower than graphite and pBN, which are the materials for the boat inside the shell.
このように熱伝導率の小さい化合物半導体単結晶をボー
ト内で成長させる場合、凝固潜熱が結晶内を伝わって逃
げにくくなるために、ボートを伝わって逃げる熱の割合
が多くなってしまう。その結果、固液界面形状が第5図
に示すごとく融液側に凹状となるため、ボートに接した
部分に核ができて、多結晶化したり、リニエージやセル
構造等の転位の発生を助長するという欠点があった。When a compound semiconductor single crystal with such a low thermal conductivity is grown in a boat, it becomes difficult for the latent heat of solidification to travel through the crystal and escape, resulting in a large proportion of the heat escaping through the boat. As a result, the solid-liquid interface shape becomes concave toward the melt side, as shown in Figure 5, and nuclei are formed in the area in contact with the boat, promoting polycrystalization and the generation of dislocations such as lineage and cell structures. There was a drawback to that.
本発明は、上記のような問題点に着目してなされたもの
で、その目的とするところは、横型ボート法によりCd
Teのような熱伝導率の低い化合物半導体単結晶を育成
する場合に、単結晶化率を向上させ、かつ転位の発生を
低減させることにある。The present invention was made in view of the above-mentioned problems, and its purpose is to reduce Cd by the horizontal boat method.
The purpose of this invention is to improve the single crystallization rate and reduce the occurrence of dislocations when growing a compound semiconductor single crystal with low thermal conductivity such as Te.
[課題を解決するための手段]
横型ボート法によりCd T eのような熱伝導率の低
い化合物半導体単結晶を育成する方法において、炉芯管
と反応管との間もしくはボートと反応管との間に、断熱
材を介在させるようにするものである。[Means for solving the problem] In a method of growing a compound semiconductor single crystal with low thermal conductivity such as CdTe by a horizontal boat method, it is necessary to A heat insulating material is interposed between the two.
[作用]
上記手段によればボートの周囲に断熱材が配置されてい
るため発生した凝固潜熱のうちボートの側面もしくは底
面から逃げる伝導熱、輻射熱の熱量が低減され、これに
対して結晶を伝わって逃げる熱量の割合が大きくなり、
これによって従来の方法では第5図に示すように融液側
に凹状となっていた固液界面を第4図に示すように平坦
化させて単結晶化率を向上させ、転位の発生を低減させ
ることができる。[Function] According to the above means, since the heat insulating material is placed around the boat, the amount of conductive heat and radiant heat that escapes from the side or bottom of the boat among the solidification latent heat generated is reduced, and in contrast, the amount of conductive heat and radiant heat that is transmitted through the crystal is reduced. The proportion of heat that escapes increases,
As a result, the solid-liquid interface, which was concave on the melt side as shown in Fig. 5 in the conventional method, is flattened as shown in Fig. 4, improving the single crystallization rate and reducing the occurrence of dislocations. can be done.
[実施例コ
第1図および第2図に本発明に係る横型ボート法による
結晶成長装置の一実施例の要部を示す。[Embodiment] FIGS. 1 and 2 show essential parts of an embodiment of a crystal growth apparatus using a horizontal boat method according to the present invention.
この実施例では、炉芯管1内に、敷板8および断熱材7
を介して石英製反応管5が配置され、反応管5内に原料
を入れたボート2が封入されている。すなわち、反応管
5の外周にはボート2の側面および底面を覆うように断
熱材7が被覆されている。特に限定されるものではない
が、断熱材7で覆われた反応管5は敷板8によって炉芯
管1の略中心に位置するように支持されている。In this embodiment, a bottom plate 8 and a heat insulating material 7 are provided inside the furnace core tube 1.
A quartz reaction tube 5 is disposed through the reaction tube 5, and a boat 2 containing raw materials is enclosed within the reaction tube 5. That is, the outer periphery of the reaction tube 5 is coated with a heat insulating material 7 so as to cover the side and bottom surfaces of the boat 2. Although not particularly limited, the reaction tube 5 covered with a heat insulating material 7 is supported by a bottom plate 8 so as to be located approximately at the center of the furnace core tube 1.
上記断熱材7は育成する結晶より熱伝導率の低い材料、
例えばアルミナ(Af1203)とシリカ(SiO2)
を主成分とする繊維を布状にしたものを用いる。また、
断熱材7は、その両端が開口され、かつボート2の両端
よりもΔaだけ外側に突出するとともに、上端はボート
2の上端よりもΔhだけ上方へ突出するように形成され
ている。The heat insulating material 7 is a material with lower thermal conductivity than the crystal to be grown.
For example, alumina (Af1203) and silica (SiO2)
A cloth-like material made of fibers whose main component is Also,
The heat insulating material 7 is open at both ends, protrudes outward by Δa from both ends of the boat 2, and is formed such that its upper end protrudes upward by Δh from the upper end of the boat 2.
ここで、突出量Δ(はO〜80+nm、ΔhはO〜10
+niの範囲とするとよい。Here, the protrusion amount Δ(is O~80+nm, Δh is O~10
It is preferable to set the range to +ni.
なお、図示しないが、上記反応管5内には第3図に示す
従来の装置と同様に中央に対流防止板4が配置されてい
るとともに、他端にはCd等化合物半導体の構成元素ま
たはそれと同族の元素が蒸気圧制御用元素として封入さ
れている。また、炉芯管1の周囲には分割型のヒータが
配置され、反応管5とヒータとはその軸方向に相対移動
可能に構成されている。Although not shown, a convection prevention plate 4 is disposed in the center of the reaction tube 5 as in the conventional apparatus shown in FIG. Elements of the same family are included as vapor pressure control elements. Further, a split type heater is arranged around the furnace core tube 1, and the reaction tube 5 and the heater are configured to be movable relative to each other in the axial direction.
上記実施例においては、断熱材7を反応管5の外周に配
設しているが、ボート2の外壁と反応管5の内壁との間
に断熱材7を介在させるようにしてもよい。ただし、反
応管5の内側に配設すると、断熱材7の成分や断熱材に
付着していた不純物が育成結晶中に混入するのを防止す
るため前もって長時間のベーキング等の処理を行なって
おく必要があるので、上記実施例のように反応管5の外
側に断熱材を配設する方が望ましい。In the above embodiment, the heat insulating material 7 is disposed around the outer periphery of the reaction tube 5, but the heat insulating material 7 may be interposed between the outer wall of the boat 2 and the inner wall of the reaction tube 5. However, if it is placed inside the reaction tube 5, a long baking process or other treatment must be performed in advance to prevent the components of the heat insulating material 7 and impurities attached to the heat insulating material from being mixed into the grown crystal. Therefore, it is preferable to provide a heat insulating material on the outside of the reaction tube 5 as in the above embodiment.
−例として、全長400nn+、高さ42nnのpBN
製ボート2に原料となるCdとTeとZnを総重量で2
.2kg入れ、このボートを蒸気圧制御用元素としての
Cdとともに石英反応管5に入れて封入し、反応管5の
外周には全長450mm、高さ42.5ua+の断熱材
7をボート2の側面および底面を覆うように被覆して炉
芯管1内に設置した。- As an example, a pBN with a total length of 400 nn+ and a height of 42 nn
The total weight of Cd, Te, and Zn as raw materials is 2 in the manufactured boat 2.
.. 2 kg, and this boat was sealed in a quartz reaction tube 5 together with Cd as an element for controlling vapor pressure.A heat insulating material 7 with a total length of 450 mm and a height of 42.5 ua+ was placed around the outer periphery of the reaction tube 5 on the sides of the boat 2 and It was placed in the furnace core tube 1 with a coating covering the bottom surface.
そして、二温度帯水平ブリッジマン法を適用し、高温度
均熱帯を1105℃、低温度均熱帯を819℃に制御し
てヒータを相対速度Q、5mm/hrで移動しながら結
晶を育成した。その結果、最大結晶粒がおよそ35X4
0X120mで結晶粒の数が4個のCd Z n T
e結晶が得られた。Then, by applying the two-temperature zone horizontal Bridgman method, crystals were grown while controlling the high-temperature soaking zone to 1105° C. and the low-temperature soaking zone to 819° C. while moving the heater at a relative speed Q of 5 mm/hr. As a result, the maximum grain size is approximately 35X4
Cd Z n T with 0x120m and 4 crystal grains
e crystals were obtained.
断熱材7としてはアルミナとシリカを主成分とする繊維
を布状にしたものを用いた。As the heat insulating material 7, a cloth-like material made of fibers containing alumina and silica as main components was used.
比較のため、第1図の装置において断熱材を使用せず、
上記実施例と同一の条件の下で、二温度帯水平ブリッジ
マン法を適用して、重量2.1kgのCd ZnTe結
晶を育成した。その結果、最大結晶粒がおよそ25X3
0X40anで数10個の結晶粒からなるCdZnTe
結晶が得られた。For comparison, the device shown in Figure 1 without using insulation material,
A Cd ZnTe crystal weighing 2.1 kg was grown by applying the two-temperature horizontal Bridgman method under the same conditions as in the above example. As a result, the maximum grain size is approximately 25X3
CdZnTe consisting of several dozen crystal grains at 0x40an
Crystals were obtained.
[効果コ
以上説明したように上記実施例においては、横型ボート
法によりCd ZnTeのような熱伝導率の低い化合物
半導体単結晶を育成する方法において、炉芯管と反応管
との間もしくはボートと反応管との間に、断熱材を介在
させるようにしたので、発生した凝固潜熱のうちボート
の側面もしくは底面から逃げる熱量よりも結晶を伝わっ
て逃げる熱量の割合の方が多くなり、これによって従来
の方法では融液側に凹状となっていた固液界面が平坦化
され、単結晶化率が向上し、転位の発生が低減するとい
う効果がある。[Effects] As explained above, in the above embodiment, in the method of growing a compound semiconductor single crystal with low thermal conductivity such as CdZnTe by the horizontal boat method, the Since a heat insulating material is interposed between the reaction tube and the reaction tube, the amount of heat escaping through the crystal is larger than the amount of heat escaping from the side or bottom of the boat, which is different from the conventional method. The method has the effect of flattening the solid-liquid interface, which was concave on the melt side, improving the single crystallization rate, and reducing the occurrence of dislocations.
また、断熱材の寸法を、ボートの全長よりも少し長くか
つボートの高さよりもわずかに高くなるように設定した
ので、ボートからの放熱を抑えることができ、一方融液
表面からの輻射による放熱はほとんど変わらないことか
ら、結晶を伝わって放熱する熱量の割合を増加させるこ
とが可能となり、単結晶化率を向上させ転位を減らすこ
とができる。In addition, because the dimensions of the insulation material were set to be slightly longer than the overall length of the boat and slightly higher than the height of the boat, it was possible to suppress heat radiation from the boat, while heat radiation due to radiation from the melt surface Since there is almost no change in the amount of heat transmitted through the crystal, it is possible to increase the proportion of heat dissipated through the crystal, thereby improving the single crystallization rate and reducing dislocations.
なお、実施例では一例としてCdZnTe結晶を育成し
たが、この発明は、CdTe結晶その地熱伝導率の低い
n−vt族化合物半導体単結晶の製造に利用できる。In the examples, a CdZnTe crystal was grown as an example, but the present invention can be used to manufacture a CdTe crystal or an n-vt group compound semiconductor single crystal having low geothermal conductivity.
第工図は本発明に係る化合物半導体単結晶製造装置の一
実施例の要部を示す断面正面図、第2図は第1図の装置
の断面側面図、
第3図は横型ボート法による結晶成長装置の全体を示す
断面正面図、
第4図(A)、(B)は本発明を適用した場合の結晶育
成中の固液界面の形状を示す平面説明図と正面説明図、
第5図(A)、(B)は従来法により育成を行なった場
合の固液界面の形状を示す平面説明図および正面説明図
である。
1・・・・炉芯管、2・・・・ボート、5・・・・反応
管、6・・・・ヒータ、7・・・・断熱材。
第
1
図
第
図
第
図
(A)
FB)
第
図
(AlFig. 2 is a cross-sectional front view showing the essential parts of an embodiment of the compound semiconductor single crystal manufacturing apparatus according to the present invention, Fig. 2 is a cross-sectional side view of the apparatus shown in Fig. 1, and Fig. 3 is a crystallization by the horizontal boat method. 4(A) and (B) are a plan view and a front view showing the shape of the solid-liquid interface during crystal growth when the present invention is applied; FIG. 5 is a sectional front view showing the entire growth apparatus; (A) and (B) are an explanatory plan view and an explanatory front view showing the shape of a solid-liquid interface when grown by a conventional method. 1...Furnace core tube, 2...Boat, 5...Reaction tube, 6...Heater, 7...Insulating material. Figure 1 (A) FB) Figure (Al
Claims (1)
応管を設置し、炉芯管の外側にはヒータを配置して、所
望の温度ゾーンを形成し、上記ボート内の原料を一旦溶
融させてからヒータを相対移動させ、ボート内の融液を
一端から他端へ向からて徐々に固化させてII−VI族化合
物半導体単結晶を育成する結晶成長方法において、上記
炉芯管と反応管との間もしくは上記ボートと反応管との
間に、断熱材を介在させたことを特徴とする化合物半導
体単結晶の製造方法。(1) A reaction tube containing a horizontal boat containing raw materials is installed inside the furnace core tube, a heater is placed outside the furnace core tube to form a desired temperature zone, and the raw materials in the boat are temporarily removed. In a crystal growth method in which a II-VI group compound semiconductor single crystal is grown by melting and then moving a heater relative to each other to gradually solidify the melt in a boat from one end to the other, the above-mentioned furnace core tube and A method for producing a compound semiconductor single crystal, characterized in that a heat insulating material is interposed between the reaction tube and the boat and the reaction tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19920189A JPH0365585A (en) | 1989-08-02 | 1989-08-02 | Production of compound semiconductor single crystal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19920189A JPH0365585A (en) | 1989-08-02 | 1989-08-02 | Production of compound semiconductor single crystal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0365585A true JPH0365585A (en) | 1991-03-20 |
Family
ID=16403823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19920189A Pending JPH0365585A (en) | 1989-08-02 | 1989-08-02 | Production of compound semiconductor single crystal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0365585A (en) |
-
1989
- 1989-08-02 JP JP19920189A patent/JPH0365585A/en active Pending
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