JPH0365937U - - Google Patents
Info
- Publication number
- JPH0365937U JPH0365937U JP12736589U JP12736589U JPH0365937U JP H0365937 U JPH0365937 U JP H0365937U JP 12736589 U JP12736589 U JP 12736589U JP 12736589 U JP12736589 U JP 12736589U JP H0365937 U JPH0365937 U JP H0365937U
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- sensing part
- contact
- temperature sensor
- covered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 150000001875 compounds Chemical class 0.000 claims description 5
- 239000011810 insulating material Substances 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Description
第１図は本考案の温度センサーのコンパウンド
充填前の正面説明図、第２図は同じくコンパウン
ド充填後の断面説明図である。
１……サーマルＩＣ、２……アルミケース、３
……プリント基板、４……ゴムコンパウンド、５
……サーマルコンパウンド、６……熱収縮チユー
ブ、７……断熱カバー、８……金属性ボルト、９
……入・出力端子。
FIG. 1 is an explanatory front view of the temperature sensor of the present invention before filling with compound, and FIG. 2 is an explanatory cross-sectional view of the temperature sensor of the present invention after filling with compound. 1...Thermal IC, 2...Aluminum case, 3
...Printed circuit board, 4...Rubber compound, 5
... Thermal compound, 6 ... Heat shrink tube, 7 ... Heat insulation cover, 8 ... Metal bolt, 9
...Input/output terminal.
Claims (1)
覆つた温度センサーに於いて、前記接触面側の感
温部の周囲にサーマルコンパウンドを充填してな
る温度センサー。 A temperature sensor in which a temperature-sensing part is covered with a heat insulating material except for the surface in contact with a temperature-sensitive body, and a thermal compound is filled around the temperature-sensing part on the contact surface side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12736589U JPH0365937U (en) | 1989-10-31 | 1989-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12736589U JPH0365937U (en) | 1989-10-31 | 1989-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0365937U true JPH0365937U (en) | 1991-06-26 |
Family
ID=31675124
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12736589U Pending JPH0365937U (en) | 1989-10-31 | 1989-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0365937U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57125333A (en) * | 1981-01-27 | 1982-08-04 | Matsushita Electric Ind Co Ltd | Temperature sensor |
| JPS5931427A (en) * | 1982-08-14 | 1984-02-20 | Matsushita Electric Works Ltd | Filling method of silicone resin in sensor part |
| JPS62121324A (en) * | 1985-11-21 | 1987-06-02 | Sharp Corp | temperature sensor |
-
1989
- 1989-10-31 JP JP12736589U patent/JPH0365937U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57125333A (en) * | 1981-01-27 | 1982-08-04 | Matsushita Electric Ind Co Ltd | Temperature sensor |
| JPS5931427A (en) * | 1982-08-14 | 1984-02-20 | Matsushita Electric Works Ltd | Filling method of silicone resin in sensor part |
| JPS62121324A (en) * | 1985-11-21 | 1987-06-02 | Sharp Corp | temperature sensor |
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