JPH0366722A - Epoxy resin composition for sealing semiconductor - Google Patents
Epoxy resin composition for sealing semiconductorInfo
- Publication number
- JPH0366722A JPH0366722A JP20220689A JP20220689A JPH0366722A JP H0366722 A JPH0366722 A JP H0366722A JP 20220689 A JP20220689 A JP 20220689A JP 20220689 A JP20220689 A JP 20220689A JP H0366722 A JPH0366722 A JP H0366722A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- filler
- epoxy
- copolymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 35
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 35
- 239000000203 mixture Substances 0.000 title claims abstract description 19
- 239000004065 semiconductor Substances 0.000 title claims abstract description 9
- 238000007789 sealing Methods 0.000 title abstract 3
- 229920001577 copolymer Polymers 0.000 claims abstract description 13
- 239000003054 catalyst Substances 0.000 claims abstract description 11
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 10
- 239000000945 filler Substances 0.000 claims abstract description 10
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 7
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 7
- 239000004215 Carbon black (E152) Substances 0.000 claims abstract description 4
- 229930195733 hydrocarbon Natural products 0.000 claims abstract description 4
- 150000002430 hydrocarbons Chemical class 0.000 claims abstract description 4
- 238000006243 chemical reaction Methods 0.000 claims description 8
- 238000005538 encapsulation Methods 0.000 claims description 5
- 229910052698 phosphorus Inorganic materials 0.000 claims description 2
- 239000011574 phosphorus Substances 0.000 claims description 2
- -1 phosphorus compound Chemical class 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 9
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 7
- 239000004593 Epoxy Substances 0.000 abstract description 4
- 150000002903 organophosphorus compounds Chemical class 0.000 abstract description 4
- 238000006116 polymerization reaction Methods 0.000 abstract description 4
- 239000000377 silicon dioxide Substances 0.000 abstract description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 3
- 239000011521 glass Substances 0.000 abstract description 3
- 229920003986 novolac Polymers 0.000 abstract description 3
- 229920005989 resin Polymers 0.000 abstract description 3
- 239000011347 resin Substances 0.000 abstract description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 2
- 229920001568 phenolic resin Polymers 0.000 abstract description 2
- 239000005011 phenolic resin Substances 0.000 abstract description 2
- 238000001721 transfer moulding Methods 0.000 abstract 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000007822 coupling agent Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 150000003003 phosphines Chemical group 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はトランジスタ、ＩＣ及びＬＳＩなどの〔従来の
技術〕
エポキシ樹脂組成物は他の熱硬化性樹脂組成物と比べ、
電気特性、耐湿性、機械特性、接着性等のバランスが最
も優れているため、現在半導体封止用材料の主流となっ
ている。[Detailed Description of the Invention] [Industrial Application Field] The present invention applies to transistors, ICs, LSIs, etc. [Prior Art] Compared to other thermosetting resin compositions, the epoxy resin composition has
Because it has the best balance of electrical properties, moisture resistance, mechanical properties, adhesiveness, etc., it is currently the mainstream material for semiconductor encapsulation.
一方、近年素子の大型化、アルミ配線の細線化、パッケ
ージの小型薄肉化に伴い、素子上のパッシベーションク
ラック、アルミ配線変形、パッケージクラック等の不良
が顕著になり、封止用材料の低応力化がますます重要と
なっている。On the other hand, in recent years, as devices have become larger, aluminum wiring has become thinner, and packages have become smaller and thinner, defects such as passivation cracks on devices, deformation of aluminum wiring, and package cracks have become more prominent, and the stress of sealing materials has become lower. is becoming increasingly important.
封止材の低応力化には、低弾性率化と低熱膨張化があり
、低弾性率化には、シリコーン等の可撓剤を添加する方
法、また低熱膨張化にはシリカ等のフィラーの添加量を
増量する手法が一般的である。しかし、これら手法は、
いづれもエポキシ組成物の流動性を低下させるため、可
撓剤、フィラ−の使用量には限界がある。There are two ways to reduce the stress of the encapsulant: lowering the modulus of elasticity and lowering the thermal expansion. To lower the modulus of elasticity, add a flexibilizing agent such as silicone, and to lower the thermal expansion, add a filler such as silica. A common method is to increase the amount added. However, these methods
Since both of these reduce the fluidity of the epoxy composition, there is a limit to the amount of flexibilizers and fillers that can be used.
本発明は上記観点からなされたものであり、流動性に優
れかつ低応力の半導体封止用エポキシ樹脂組成物を得よ
うとするものである。The present invention has been made from the above-mentioned viewpoint, and an object is to obtain an epoxy resin composition for semiconductor encapsulation that has excellent fluidity and low stress.
本発明者らは上記問題点を解決すべく鋭意検討を行った
結果、特定なオルガノボリレ０キサンとエポキシ樹脂と
を反応させて得られる共重合体をエポキシ樹脂組１１ｉ
、！ｌ！７Ｊに配合することにより、前記問題点を解決
することができることを見出し、この知見に基づいて本
発明を完成するに至った。The present inventors conducted extensive studies to solve the above problems, and as a result, we developed a copolymer obtained by reacting a specific organoborylene xane with an epoxy resin.
,! l! It was discovered that the above-mentioned problems could be solved by blending it with 7J, and the present invention was completed based on this knowledge.
すなわち、本発明は（Ａ）エポキシ樹脂、（Ｂ）硬化剤
、（Ｃ）充填剤及び（Ｄ）カルボキシル基含有オルガノ
ポリシロキサンとエポキシ樹脂とを下記一般式（１）で
示される有機リン系化合物触媒により反応させて得られ
る共重合体からなることを特徴とする半導体封止用エポ
キシ樹脂組成物を提供するものである。That is, the present invention combines (A) an epoxy resin, (B) a curing agent, (C) a filler, and (D) a carboxyl group-containing organopolysiloxane, and an epoxy resin with an organic phosphorus compound represented by the following general formula (1). An object of the present invention is to provide an epoxy resin composition for semiconductor encapsulation, which is comprised of a copolymer obtained by reaction with a catalyst.
Ｐ−（−Ｒ）、、−−−−−−−−・−（１）（式中の
Ｒは一価、炭化水素基）
以下に本発明の詳細な説明する。P-(-R), ----------(1) (R in the formula is a monovalent, hydrocarbon group) The present invention will be described in detail below.
本発明において用いられる（Ｄ）のカルボキシル基含有
オルガノポリシロキサンとエポキシ樹脂とを反応させて
得られる共重合体は、触媒の存在下で単純な加熱反応に
より得ることができる。The copolymer obtained by reacting the carboxyl group-containing organopolysiloxane (D) with an epoxy resin used in the present invention can be obtained by a simple heating reaction in the presence of a catalyst.
この加熱反応においては反応性の点で、溶媒を用いるこ
とが好ましく、溶媒としては具体的には、トルエン、Ｍ
ＩＢＫ、ジオキサン等が挙げられる。In this heating reaction, it is preferable to use a solvent from the viewpoint of reactivity, and specific examples of the solvent include toluene, M
Examples include IBK and dioxane.
本発明において用いられるカルボキシル基含有オルガノ
ポリシロキサンとしては重合度が５００以下のものが好
ましい０重合度が５００を超えると流動性が低下する。The carboxyl group-containing organopolysiloxane used in the present invention preferably has a degree of polymerization of 500 or less. If the degree of polymerization exceeds 500, fluidity decreases.
また反応させるエポキシ樹脂としては、フェノール、ク
レゾール、ビスフェノールＡ等とホルムアルデヒドなど
を酸性触媒下で縮合させて得られる樹脂を原料として、
エピクロルヒドリンでグリシジルエニテル化するなどし
てエポキシ化したものが好ましく用いられる。またエポ
キシ樹脂はエポキシ当量が１７０〜３００のものが好ま
しく用いられ、さらに、エポキシ当量が１８０〜２００
のものが硬化性の点で優れている。The epoxy resin to be reacted is made from a resin obtained by condensing phenol, cresol, bisphenol A, etc. with formaldehyde under an acidic catalyst.
Epoxidized products such as glycidyl enyterization with epichlorohydrin are preferably used. Moreover, the epoxy resin having an epoxy equivalent of 170 to 300 is preferably used, and furthermore, an epoxy resin having an epoxy equivalent of 180 to 200 is used.
is superior in terms of curability.
反応の際用いられる触媒としては一般的には、イミダゾ
ール、ＤＢＵ（１，８−ジアザビシクロ（５，４，０）
ウンデセン−７）、ＢＤＭＡ等のアミン系が知られてい
るが、組成物の流動性の点で、下記一般式（１）で示さ
れる有機リン系化合物触媒が用いられる。Catalysts used in the reaction are generally imidazole, DBU (1,8-diazabicyclo(5,4,0)
Although amine-based catalysts such as undecene-7) and BDMA are known, an organic phosphorus-based compound catalyst represented by the following general formula (1) is used from the viewpoint of fluidity of the composition.
Ｐ −Ｇ−Ｒ）３ −・・〜・−一一一一・ （１）
（式中のＲは一価の炭化水素基）
前記有機リン系化合物としては、トリフェニルホスフィ
ン、トリブチルホスフィン、トリバラトリルホスフィン
等の三級ホスフィン、特にトリフェニルホスフィンが好
ましく用いられる。触媒量としてはエポキシ樹脂に対し
０．１〜２ｗｔ％用いられる。P-G-R)3 -・・〜・−１１１１・(1)
(R in the formula is a monovalent hydrocarbon group) As the organic phosphorus compound, tertiary phosphines such as triphenylphosphine, tributylphosphine, and trivalatrylphosphine, particularly triphenylphosphine, are preferably used. The amount of catalyst used is 0.1 to 2 wt% based on the epoxy resin.
反応時のオルガノシロキサンとエポキシ樹脂との配合比
は、カルボキシル基１個に対し、エポキシ基５個以上と
することが好ましく、５個未満ではゲル化する恐れがあ
る。The compounding ratio of organosiloxane and epoxy resin during the reaction is preferably 5 or more epoxy groups to 1 carboxyl group, and if it is less than 5, gelation may occur.
次に、（Ｂ）の硬化剤としては、ノボラック型フェノー
ル樹脂が好適であり、具体的には、フェノール、クレゾ
ール、ビスフェノールＡなどとホルムアルデヒドなどを
酸性触媒下で縮合させて得られる樹脂が挙げられる。Next, as the curing agent (B), a novolak type phenolic resin is suitable, and specific examples include resins obtained by condensing phenol, cresol, bisphenol A, etc. with formaldehyde under an acidic catalyst. .
また、（Ａ）のエポキシ樹脂としては、先に述べた共重
合体を合成する際のエポキシ樹脂が用いられる。エポキ
シ樹脂と硬化剤の配合比は、エポキシ樹脂中に含まれる
エポキシ基１個当たり硬化剤中のフェノール性水酸基等
の官能基が０．５〜２゜０個、好適には０．８〜１．２
個となるような割合で用いる。Further, as the epoxy resin (A), the epoxy resin used in synthesizing the copolymer described above is used. The blending ratio of the epoxy resin and the curing agent is such that the number of functional groups such as phenolic hydroxyl groups in the curing agent is 0.5 to 20, preferably 0.8 to 1 per epoxy group contained in the epoxy resin. .2
Use in proportions such that
エポキシ樹脂組成物中の共重合体の添加量は総エポキシ
樹脂１００重量部に対し、共重合体中のシロキサン量が
１０〜３０重量部となるように添加することが好ましく
、シロキサン量が１０重量部未満では低応力化の効果が
小さく、３０重量部を超える流動性が低下する。The amount of the copolymer added to the epoxy resin composition is preferably such that the amount of siloxane in the copolymer is 10 to 30 parts by weight based on 100 parts by weight of the total epoxy resin, and the amount of siloxane is 10 parts by weight. If the amount is less than 30 parts by weight, the effect of reducing stress will be small, and if it exceeds 30 parts by weight, the fluidity will decrease.
本発明において用いられる（Ｃ）の充填剤としては、シ
リカ、ガラス、ケイソウ土、タルク、マイカ、アスベス
ト、アルミナ等を用いることができるが、シリカ、ガラ
ス、アルミナが電気特性の点で優れている。充填剤の使
用量は（Ａ）、（Ｂ）及び（Ｄ）の合計１００重量部に
対し、１００〜５００重量部が良好であり、１００重量
部未満では耐湿性に劣り、また５００重量部を超えると
、流動性が失われる。As the filler (C) used in the present invention, silica, glass, diatomaceous earth, talc, mica, asbestos, alumina, etc. can be used, but silica, glass, and alumina are superior in terms of electrical properties. . The amount of filler to be used is preferably 100 to 500 parts by weight based on the total of 100 parts by weight of (A), (B), and (D); less than 100 parts by weight results in poor moisture resistance; If this is exceeded, liquidity will be lost.
また、エポキシ樹脂と硬化剤との反応を促進するために
硬化促進剤さらに配合することが好ましい。硬化促進剤
としては、具体的にはトリブチルアミン、１，８−ジア
ザビシクロ（５，４，０）ウンデセン−７のようなアミ
ン類、トリフェニルホスフィンのような有機リン系化合
物、２−フェニルイミダゾールのようなイミダゾール類
が挙げられる。配合量はエポキシ樹脂に対して好ましく
は０．１〜３重量％である。Further, it is preferable to further include a curing accelerator in order to promote the reaction between the epoxy resin and the curing agent. Specific examples of curing accelerators include tributylamine, amines such as 1,8-diazabicyclo(5,4,0)undecene-7, organic phosphorus compounds such as triphenylphosphine, and 2-phenylimidazole. Examples include imidazoles such as The blending amount is preferably 0.1 to 3% by weight based on the epoxy resin.
本発明のエポキシ樹脂組成物に、は必要に応じて離型剤
、着色剤、難燃剤、難燃助剤、カップリング剤などを使
用することもできる。特にカップリング剤は充填剤の効
果を有効に発揮させるために重要であり、例えばγ−グ
リシドキシブロビルトリメトキシシラン、β−（３，４
−エポキシシクロヘキシル）−エチルトリメトキシシラ
ンなどがある。In the epoxy resin composition of the present invention, a mold release agent, a coloring agent, a flame retardant, a flame retardant aid, a coupling agent, etc. can also be used as necessary. In particular, coupling agents are important for effectively exerting the effect of fillers, such as γ-glycidoxybrobyltrimethoxysilane, β-(3,4
-epoxycyclohexyl)-ethyltrimethoxysilane.
本発明のエポキシ樹脂組成物は、上記のエポキシ樹脂、
硬化剤、硬化促進剤、共重合体、充填剤、カップリング
剤その他の添加剤などをミキシングロールで加熱しなが
ら混練する方法により製造することができる。The epoxy resin composition of the present invention comprises the above-mentioned epoxy resin,
It can be manufactured by a method of kneading a curing agent, a curing accelerator, a copolymer, a filler, a coupling agent, and other additives while heating them with a mixing roll.
得られたエポキシ樹脂組成物は、トランスファー底形、
注型などの方法により底形する。The obtained epoxy resin composition has a transfer bottom shape,
Shape the bottom by casting or other methods.
以下に実施例により本発明を具体的に説明する。 The present invention will be specifically explained below using Examples.
なお実施例を示す前に、物性の測定方法、共重合体の製
造方法等を以下に示す。Before showing Examples, methods for measuring physical properties, methods for producing copolymers, etc. will be shown below.
（１）スパイラルフロー（ＳＦ）
ＥＭＭＩ規格に準じた金型を用いて１７５°ｃ１６．８
６ＭＰａの条件で測定した。(1) Spiral flow (SF) 175°c16.8 using a mold according to EMMI standard
Measurement was performed under the condition of 6 MPa.
（２）線膨張係数（α、）
理学電機製の熱機械分析装置ＴＭＡ標準形を用いて昇温
速度５℃／ｗｉｎ、試験片寸法１９ｍｍＸ４ａｍＸ４ｍ
で測定した。(2) Coefficient of linear expansion (α,) Using Rigaku's thermomechanical analyzer TMA standard type, heating rate 5°C/win, test piece size 19 mm x 4 am x 4 m
It was measured with
（３）曲げ弾性率（Ｅ）
Ｊ Ｉ Ｓ−に６９１１に準じ、成形温度１７５°Ｃ１
圧力６．８６ＭＰａ、成形時間２分の条件で試験片を作
成し１７５°Ｃ，６ｈベークしたものについて測定した
。(3) Flexural modulus (E) According to JIS-6911, molding temperature 175°C1
A test piece was prepared under the conditions of a pressure of 6.86 MPa and a molding time of 2 minutes, and was baked at 175°C for 6 hours.
（４）共重合体の製造方法
表１に示す配合比でカルボキシル基含有オルガノポリシ
ロキサンとエポキシ樹脂をトルエンに溶解し、さらに触
媒を加えたのち、トルエンの沸点で加熱攪拌した０反応
終了後、トルエンを常圧、及び減圧で除去し、共重合体
を得た。(4) Method for producing a copolymer A carboxyl group-containing organopolysiloxane and an epoxy resin were dissolved in toluene at the compounding ratio shown in Table 1, and a catalyst was further added thereto. After the reaction was completed, the mixture was heated and stirred at the boiling point of toluene. Toluene was removed under normal pressure and reduced pressure to obtain a copolymer.
（５）表１に示す組成物を配合し、直径１０インチのミ
キシングロールにて、前ロール２２ｒｐｍ。(5) The composition shown in Table 1 was blended, and the front roll was rolled at 22 rpm using a mixing roll with a diameter of 10 inches.
後ロール１８ｒｐｍの条件で常法に従い１０分間混練し
た。得られたシート状組成物を粉砕して、エポキシ樹脂
組成物を得た。The mixture was kneaded in a conventional manner for 10 minutes with a rear roll at 18 rpm. The obtained sheet-like composition was pulverized to obtain an epoxy resin composition.
なお、表中の符号は下記のものを示す。Note that the symbols in the table indicate the following.
１′″ ：０−タレゾールノボラック型エポキシ樹脂（
住友化学社製、ＥＳＣＮ−１９５−３）２″ ：
（重合度はいずれも平均値）
３″ ：
４１ ：
日立化成社製ＨＰ−８０ＯＮ
１．８−ジアザビシクロ（５，４，０）ウンデセン−７
５° ：
γ−グリシドキシブロビルトリメ
トキシ
シラン
以下余白
表１に示すように実施例１〜３の材料は比較例１〜４の
材料と比較し、スパイラルフローが大きく又低弾性率の
ため低応力化されていることがわかる。1''': 0-Talesol novolac type epoxy resin (
Manufactured by Sumitomo Chemical Co., Ltd., ESCN-195-3) 2": (all degrees of polymerization are average values) 3": 41: Manufactured by Hitachi Chemical Co., Ltd. HP-80ON 1.8-diazabicyclo(5,4,0) undecene-7 5°: γ-glycidoxybrobyltrimethoxysilane Below margin As shown in Table 1, the materials of Examples 1 to 3 have a larger spiral flow and lower elastic modulus than the materials of Comparative Examples 1 to 4. It can be seen that stress is reduced.
本発明のエポキシ樹脂組成物を用いて半導体を封止する
場合、流動性に優れ、且つ硬化物の低応力化効果もある
ことから、その半導体封止用材料として工業的価値は大
きい。When encapsulating a semiconductor using the epoxy resin composition of the present invention, it has excellent fluidity and is effective in reducing stress in the cured product, so it has great industrial value as a material for semiconductor encapsulation.
Claims (1)
ポキシ樹脂とを下記一般式 （１）で示される有機リン系化合物触媒 により反応させて得られる共重合体から なることを特徴とする半導体封止用エポ キシ樹脂組成物。 ▲数式、化学式、表等があります▼・・・・・・・・・
・・・・（１） （式中のＲは一価の炭化水素基）[Claims] 1. (A) an epoxy resin, (B) a curing agent, (C) a filler, and (D) a carboxyl group-containing organopolysiloxane and an epoxy resin represented by the following general formula (1). An epoxy resin composition for semiconductor encapsulation, comprising a copolymer obtained by reaction with a phosphorus compound catalyst. ▲There are mathematical formulas, chemical formulas, tables, etc.▼・・・・・・・・・
...(1) (R in the formula is a monovalent hydrocarbon group)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20220689A JPH0366722A (en) | 1989-08-03 | 1989-08-03 | Epoxy resin composition for sealing semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20220689A JPH0366722A (en) | 1989-08-03 | 1989-08-03 | Epoxy resin composition for sealing semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0366722A true JPH0366722A (en) | 1991-03-22 |
Family
ID=16453722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20220689A Pending JPH0366722A (en) | 1989-08-03 | 1989-08-03 | Epoxy resin composition for sealing semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0366722A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014061811A1 (en) * | 2012-10-19 | 2014-04-24 | 三菱瓦斯化学株式会社 | Resin composition, pre-preg, laminate, metal foil-clad laminate, and printed wiring board |
| US10639838B2 (en) | 2014-03-14 | 2020-05-05 | Kraussmaffei Berstorff Gmbh | Hose extrusion head and method for producing a hose |
-
1989
- 1989-08-03 JP JP20220689A patent/JPH0366722A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014061811A1 (en) * | 2012-10-19 | 2014-04-24 | 三菱瓦斯化学株式会社 | Resin composition, pre-preg, laminate, metal foil-clad laminate, and printed wiring board |
| CN104736589A (en) * | 2012-10-19 | 2015-06-24 | 三菱瓦斯化学株式会社 | Resin composition, pre-preg, laminate, metal foil-clad laminate, and printed wiring board |
| JPWO2014061811A1 (en) * | 2012-10-19 | 2016-09-05 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, laminate, metal foil clad laminate and printed wiring board |
| US10030141B2 (en) | 2012-10-19 | 2018-07-24 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, pre-preg, laminate, metal foil-clad laminate, and printed wiring board |
| US10639838B2 (en) | 2014-03-14 | 2020-05-05 | Kraussmaffei Berstorff Gmbh | Hose extrusion head and method for producing a hose |
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