JPH0367060U - - Google Patents
Info
- Publication number
- JPH0367060U JPH0367060U JP12941389U JP12941389U JPH0367060U JP H0367060 U JPH0367060 U JP H0367060U JP 12941389 U JP12941389 U JP 12941389U JP 12941389 U JP12941389 U JP 12941389U JP H0367060 U JPH0367060 U JP H0367060U
- Authority
- JP
- Japan
- Prior art keywords
- trap
- vacuum vessel
- sputtering
- exhaust
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 238000004544 sputter deposition Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 2
- 239000007789 gas Substances 0.000 claims 1
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
Landscapes
- Physical Vapour Deposition (AREA)
Description
第１図及び第２図は、本考案の各実施例を示す
スパツタ装置の説明図、第３図は、上記各実施例
におけるスパツタ装置から液体窒素冷却トラツプ
を取外した状態を示す説明図である。
１……真空容器、２……スパツタ物質、３……
ターゲツト電極、５……排気通路、６……排気口
、８……断熱材、９……液体窒素冷却トラツプ、
１０……被スパツタ物質。
1 and 2 are explanatory diagrams of sputtering equipment showing each embodiment of the present invention, and FIG. 3 is an explanatory diagram showing a state in which the liquid nitrogen cooling trap is removed from the sputtering equipment in each of the above embodiments. . 1... Vacuum container, 2... Spatter substance, 3...
Target electrode, 5...Exhaust passage, 6...Exhaust port, 8...Insulating material, 9...Liquid nitrogen cooling trap,
10...Substance to be spattered.
Claims (1)
空容器・真空ポンプ間を接続する排気通路とを備
える装置において、 前記排気通路のうち真空容器側の排気口に、液
体窒素によつて冷却されたトラツプをその全体或
いは大半が前記真空容器内に位置するように配置
してなることを特徴とするスパツタ装置。 ２ 第１請求項において、前記トラツプは、排気
導入路を有するメタルブロツクよりなり、このメ
タルブロツクが前記排気口に断熱材を介して設置
されるスパツタ装置。[Claims for Utility Model Registration] 1. In an apparatus comprising a vacuum vessel for sputtering and an exhaust passage connecting the vacuum vessel and the vacuum pump, an exhaust port on the vacuum vessel side of the exhaust passage is provided with liquid nitrogen. 1. A sputtering apparatus characterized in that a trap cooled by a trap is disposed such that the entire or most of the trap is located within the vacuum container. 2. The sputtering device according to claim 1, wherein the trap is made of a metal block having an exhaust gas introduction passage, and the metal block is installed at the exhaust port via a heat insulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12941389U JPH0367060U (en) | 1989-11-06 | 1989-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12941389U JPH0367060U (en) | 1989-11-06 | 1989-11-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0367060U true JPH0367060U (en) | 1991-06-28 |
Family
ID=31677042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12941389U Pending JPH0367060U (en) | 1989-11-06 | 1989-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0367060U (en) |
-
1989
- 1989-11-06 JP JP12941389U patent/JPH0367060U/ja active Pending
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