JPH0367433U - - Google Patents

Info

Publication number
JPH0367433U
JPH0367433U JP12834689U JP12834689U JPH0367433U JP H0367433 U JPH0367433 U JP H0367433U JP 12834689 U JP12834689 U JP 12834689U JP 12834689 U JP12834689 U JP 12834689U JP H0367433 U JPH0367433 U JP H0367433U
Authority
JP
Japan
Prior art keywords
base material
wiring base
terminal end
conductive pattern
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12834689U
Other languages
Japanese (ja)
Other versions
JP2509351Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989128346U priority Critical patent/JP2509351Y2/en
Publication of JPH0367433U publication Critical patent/JPH0367433U/ja
Application granted granted Critical
Publication of JP2509351Y2 publication Critical patent/JP2509351Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例に係る配線基材の要
部拡大平面図、第２図は第１図導電パターンを有
する配線基材の全体を示す斜視図、第３図は従来
例のＴＡＢテープの斜視図、第４図は同じくＴＡ
Ｂテープの部分拡大平面図である。 １……絶縁基体、２……導電パターン（リード
）。 FIG. 1 is an enlarged plan view of essential parts of a wiring base material according to an embodiment of the present invention, FIG. 2 is a perspective view showing the entire wiring base material having the conductive pattern shown in FIG. 1, and FIG. 3 is a diagram of a conventional example. A perspective view of TAB tape, Figure 4 is also TAB tape.
It is a partially enlarged plan view of B tape. 1... Insulating base, 2... Conductive pattern (lead).

Claims (1)

【実用新案登録請求の範囲】 絶縁基体上に積層した金属箔をエツチングして
導電パターンを形成した配線基材において、 上記導電パターンのうち、平行配置され終端部
が互いに隣接する導電パターンのいずれか一方の
終端を他方の終端より突出させて形成したことを
特徴とする配線基材。[Claims for Utility Model Registration] In a wiring base material in which a conductive pattern is formed by etching metal foil laminated on an insulating substrate, any of the conductive patterns arranged in parallel and having terminal ends adjacent to each other. A wiring base material characterized in that one terminal end is formed so as to protrude from the other terminal end.
JP1989128346U 1989-10-31 1989-10-31 Wiring base material Expired - Lifetime JP2509351Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989128346U JP2509351Y2 (en) 1989-10-31 1989-10-31 Wiring base material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989128346U JP2509351Y2 (en) 1989-10-31 1989-10-31 Wiring base material

Publications (2)

Publication Number Publication Date
JPH0367433U true JPH0367433U (en) 1991-07-01
JP2509351Y2 JP2509351Y2 (en) 1996-09-04

Family

ID=31676058

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989128346U Expired - Lifetime JP2509351Y2 (en) 1989-10-31 1989-10-31 Wiring base material

Country Status (1)

Country Link
JP (1) JP2509351Y2 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5025177A (en) * 1973-07-05 1975-03-17
JPH01119034A (en) * 1987-10-30 1989-05-11 Ibiden Co Ltd Film carrier for mounting electronic component

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5025177A (en) * 1973-07-05 1975-03-17
JPH01119034A (en) * 1987-10-30 1989-05-11 Ibiden Co Ltd Film carrier for mounting electronic component

Also Published As

Publication number Publication date
JP2509351Y2 (en) 1996-09-04

Similar Documents

Publication Publication Date Title
JPS58134853U (en) printed wiring fuses
JPH0367433U (en)
JPS61121773U (en)
JPH03117862U (en)
JPH0482880U (en)
JPS6452272U (en)
JPS6294673U (en)
JPS5939965U (en) printed wiring board structure
JPS63137975U (en)
JPH03124675U (en)
JPS62134213U (en)
JPS61177479U (en)
JPS64356U (en)
JPS61162074U (en)
JPS62201972U (en)
JPS5929008U (en) thick film wiring board
JPH0221776U (en)
JPH0428440U (en)
JPS5989576U (en) Wiring chip
JPS6357778U (en)
JPH036861U (en)
JPH0213731U (en)
JPS61158927U (en)
JPS6226876U (en)
JPH02108364U (en)

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term