JPH0367445U - - Google Patents

Info

Publication number
JPH0367445U
JPH0367445U JP6961389U JP6961389U JPH0367445U JP H0367445 U JPH0367445 U JP H0367445U JP 6961389 U JP6961389 U JP 6961389U JP 6961389 U JP6961389 U JP 6961389U JP H0367445 U JPH0367445 U JP H0367445U
Authority
JP
Japan
Prior art keywords
semiconductor device
moisture absorption
plastic mold
sealed
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6961389U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6961389U priority Critical patent/JPH0367445U/ja
Publication of JPH0367445U publication Critical patent/JPH0367445U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案の一実施例による半導体装置
の斜視図、第2図は同半導体装置の収納箱への収
納要領を示す斜視図、第3図は従来の半導体装置
の梱包状態を示す斜視図、第4図は同半導体装置
の収納箱への収納要領を示す斜視図である。 2……トレイ、3……収納箱、4……収納袋、
6……半導体装置、7……プラスチツクモールド
、8……吸湿表示物である。なお、図中、同一符
号は同一または相当部分を示す。
FIG. 1 is a perspective view of a semiconductor device according to an embodiment of the invention, FIG. 2 is a perspective view showing how to store the semiconductor device in a storage box, and FIG. 3 is a perspective view showing a conventional packaging state of the semiconductor device. 4 are perspective views showing how to store the semiconductor device in the storage box. 2...Tray, 3...Storage box, 4...Storage bag,
6...Semiconductor device, 7...Plastic mold, 8...Moisture absorption display object. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子を封止したプラスチツクモールドの
表面に吸湿度表示物を取り付けたことを特徴とす
る半導体装置。
A semiconductor device characterized in that a moisture absorption indicator is attached to the surface of a plastic mold in which a semiconductor element is sealed.
JP6961389U 1989-06-14 1989-06-14 Pending JPH0367445U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6961389U JPH0367445U (en) 1989-06-14 1989-06-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6961389U JPH0367445U (en) 1989-06-14 1989-06-14

Publications (1)

Publication Number Publication Date
JPH0367445U true JPH0367445U (en) 1991-07-01

Family

ID=31605073

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6961389U Pending JPH0367445U (en) 1989-06-14 1989-06-14

Country Status (1)

Country Link
JP (1) JPH0367445U (en)

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