JPH0367976B2 - - Google Patents
Info
- Publication number
- JPH0367976B2 JPH0367976B2 JP27872286A JP27872286A JPH0367976B2 JP H0367976 B2 JPH0367976 B2 JP H0367976B2 JP 27872286 A JP27872286 A JP 27872286A JP 27872286 A JP27872286 A JP 27872286A JP H0367976 B2 JPH0367976 B2 JP H0367976B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- surface layer
- glass
- nickel
- platinum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 32
- 239000002344 surface layer Substances 0.000 claims description 31
- 239000011521 glass Substances 0.000 claims description 24
- 239000010410 layer Substances 0.000 claims description 22
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 19
- 229910052759 nickel Inorganic materials 0.000 claims description 15
- 238000000465 moulding Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 10
- 229910052697 platinum Inorganic materials 0.000 claims description 8
- 239000010936 titanium Substances 0.000 claims description 5
- 239000011651 chromium Substances 0.000 claims description 4
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 239000000956 alloy Substances 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 6
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 5
- 229910052786 argon Inorganic materials 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000007733 ion plating Methods 0.000 description 3
- PXXKQOPKNFECSZ-UHFFFAOYSA-N platinum rhodium Chemical compound [Rh].[Pt] PXXKQOPKNFECSZ-UHFFFAOYSA-N 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- HWLDNSXPUQTBOD-UHFFFAOYSA-N platinum-iridium alloy Chemical compound [Ir].[Pt] HWLDNSXPUQTBOD-UHFFFAOYSA-N 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- 238000000992 sputter etching Methods 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000011195 cermet Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 239000005304 optical glass Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B11/00—Pressing molten glass or performed glass reheated to equivalent low viscosity without blowing
- C03B11/06—Construction of plunger or mould
- C03B11/08—Construction of plunger or mould for making solid articles, e.g. lenses
- C03B11/084—Construction of plunger or mould for making solid articles, e.g. lenses material composition or material properties of press dies therefor
- C03B11/086—Construction of plunger or mould for making solid articles, e.g. lenses material composition or material properties of press dies therefor of coated dies
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2215/00—Press-moulding glass
- C03B2215/02—Press-mould materials
- C03B2215/08—Coated press-mould dies
- C03B2215/14—Die top coat materials, e.g. materials for the glass-contacting layers
- C03B2215/16—Metals or alloys, e.g. Ni-P, Ni-B, amorphous metals
- C03B2215/17—Metals or alloys, e.g. Ni-P, Ni-B, amorphous metals comprising one or more of the noble meals, i.e. Ag, Au, platinum group metals
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
〔産業上の利用分野〕
本発明は、ガラスをプレス成形するための成形
型に関し、特に、プレス成形後に研磨を必要とし
ない高精度のガラス成形体に成形するための成形
型に関する。
〔従来の技術〕
一般に、プレス成形によるガラスの成形では、
所定の表面形状（例えば球面または非球面）に仕
上げた表面層を有する成形型内に、予め軟化させ
た被成形ガラスを入れ（または被成形ガラスを成
形型に入れてから加熱・軟化させ）、この成形型
に所定の圧力を加えることによつて、成形型の表
面層が被成形ガラスに転写される。したがつて、
成形型は、その表面層の形状がガラス成形体の表
面形状としてそのまま転写されることから、その
表面層に気孔等の欠陥がなく、緻密で鏡面状に精
密加工することができ、かつ高温において十分な
硬度および強度を保てる等の要件を満たすことが
求められる。
このような成形型の材料としては、従来、シリ
コンカーバイド（SiC）やシリコンナイトライド
（Si3N4）（特開昭52−45613号公報）、タングステ
ンカーバイド（特開昭56−59641号公報）、酸化ジ
ルコニウム（ZrO2）を基盤材料とし、その上に
白金−ロジウム（Pt−Rh）合金または白金−イ
リジウム（Pt−Ir）合金のコーテイング膜を形成
したもの（特開昭60−176930号公報）が提案され
ている。
〔発明が解決しようとする問題点〕
しかし、シリコンカーバイドやシリコンナイト
ライドを表面層とする成形型は、緻密で、かつ硬
度および強度の点ですぐれているものの、被成形
ガラスに鉛を多量に含有する重フリント系光学ガ
ラスを使用した場合、鉛との化学反応性が高く、
高精度のガラス成形体に成形することが困難とな
る。
次に、タングステンカーバイドの成形型は、加
工性にすぐれるが、高温下で酸化しやすく、型表
面が肌荒れを起こし、光学表面を保持することが
できない。また、被成形ガラスと反応しやすい問
題もあつた。
また、白金−ロジウムまたは白金−イリジウム
の合金のコーテイング膜を形成したものは、被成
形ガラスとの化学作用を起こさないことが利点と
して挙げられているが、本発明者らの実験によれ
ば、ガラス成形体との離型性がプレス成型開始当
初から悪いという問題があつた。
〔問題点を解決するための手段〕
本発明による第１のガラス成形体の成形型は、
成形型の表面層を白金（Pt）を主成分とし、ニ
ツケル（Ni）を５〜45wt％含有する少なくとも
２成分からなる物質により形成したものである。
本発明による第２のガラス成形体の成形型は、
上述した表面層を用いるとともに、この表面層と
下地の基盤との間に、ニツケル（Ni）、チタン
（Ti）、クロム（Cr）、モリブデン（Mo）、コバル
ト（Co）、チタンナイトライド（TiN）、チタン
カーバイド（TiC）およびこれらの混合物のうち
から選択された少なくとも１つを含む中間層を介
在させたものである。
これらの表面層や中間層は、所定形状に加工さ
れた基盤上にスパツタリング法、イオンプレーテ
イング法などにより形成される。膜厚は0.05〜
10μｍ程度が好ましい。薄すぎると均一な膜が得
にくく、厚すぎると成膜時間を長くするのみなら
ず、プレス成形時に圧力・温度等のプレス成形条
件によつては変形しやすくなる。
なお、表面層材料として、ニツケルの他に、イ
リジウム（Ir）、ロジウム（Rh）、および金
（Au）なでを加えれば、一層高温のプレスでの使
用に耐えるようになる。
成形型の基盤材料については、基盤として一般
に要求される硬度、強度および耐熱性等を満足す
るものであれば特に限定されず、ステンレス鋼、
タングステンカーバイド（WC）、酸化ジルコニ
ウム（ZrO2）、サーメツト、シリコンカーバイド
（SiC）およびシリコンナイトライド（Si3N4）な
どが使用可能である。また、プレス成形時の圧力
が変形が問題にならない程度であれば、この基盤
材料は、上述した表面層や中間層の各物質と同一
の合金等を用いてもよい。
〔作用〕
本発明の成形型の表面層は、緻密性、硬度、強
度、加工性および耐化学反応性のそれぞれにおい
て良好であるばかりでなく、プレス成形されたガ
ラス成形体との離形性も良好になる。すなわち、
主成分（50wt％以上）の白金に対してニツケル
を含有させることにより、特にガラス成形体との
離形性を向上させることができる。その含有率を
５〜45（好ましくは10〜40）wt％としたのは、ニ
ツケルが5wt％未満では硬度が低くなり傷が発生
しやすく、またプレス成形後のガラス成形体との
離型性を改善する効果が十分に得られにくく、一
方、45wt％を越えると、プレス成形時にニツケ
ルがガラス成形体に拡散しやすくなるためであ
る。
また、中間層は基盤と表面層との親和性を高
め、型寿命を長くする作用を有する。
〔実施例〕
第１図は本発明の一実施例を示す成形型の断面
図である。成形型は、上型１と下型２とから構成
される。上型１と下型２とは、それぞれその外周
面が案内型３の内周面上を滑動するように、案内
型３の内部に配置されている。これらの上型１お
よび下型２は、それぞれ基盤１ａと表面層１ｂお
よび基盤２ａと表面層２ｂからなり、表面層１
ｂ，２ｂを相互に対向させて配置してある。
基盤１ａ，２ａは、焼結時にHIP処理を施して
緻密にしたタングステンカーバイドを用い、これ
を円柱状（直径18mm、高さ28mm）に加工し、その
一端面を凹球面状に研削し、最終仕上げとしてダ
イヤモンド砥石により高精度の光学鏡面に研磨
し、それぞれ所定の曲率半径（32mm）の凹球面に
加工した。この凹球面の面粗さは100Å以下であ
つた。
この基盤１ａ，２ａの凹球面に対し、スパツタ
リング装置を用い、表に示した実施例１〜10の物
質組成のターゲツトを使用し、所定の成膜条件で
所定の厚さの表面層１ｂ，２ｂを形成した。な
お、その際、基盤１ａ，２ａと表面層１ｂ，２ｂ
との密着性を一層強固にするために、表面層１
ｂ，２ｂの成膜に先立つて、逆スパツタリングに
より基盤１ａ，２ａの各表面を清浄化することは
有効である。
例えば、実施例１ではターゲツトが白金
（95wt％）−ニツケル（5wt％）合金、膜厚が0.5μ
ｍであり、そのときの成膜条件はアルゴンガス圧
１×10-8Torr、成膜速度500Å／minであつた。
成膜条件は、実施例２〜10についてもほぼ同様で
あつた。
なお、案内型３は、本実施例では上型・下型の
基盤１ａ，２ａと同様のタングステンカーバイド
で構成されている。
第２図に、本発明の他の実施例を示す成形型の
断面図である。本実施例の上型１′および下型
２′は、それぞれ基盤１ａと表面層１ｂとの間お
よび基盤２ａと表面層２ｂとの間に、第１中間層
１ｃと第２中間層１ｄおよび第１中間層２ｃと第
２中間層２ｄが介在させてある点で、第１図の上
型１および下型２と相違するが、その他は構造上
同一である。中間層は、２層図示したが、１層の
みまたは３層以上にしてもよい。表に、中間層を
１層のみとした例を実施例11〜13、16〜19および
21として示し、中間層を２層とした例を実施例
14、15および20として示した。
これらの中間層および表面層は、例えば実施例
11では、基盤１ａ，２ａをイオンエツチングした
後、イオンプレーテイング法により、所定の成膜
条件（真空度５×10-5Torr、成膜速度300Å／
min、基盤電圧−300V）でチタンからなる第１
中間層１ｃ，２ｃ（膜厚0.05μｍ）を成膜した後、
その上に、スパツタリング法により白金（95wt
％）−ニツケル（5wt％）合金をターゲツトとし、
所定の成膜条件（アルゴンガス圧１×10-8Torr、
成膜速度500Å／min）で表面層１ｂ，２ｂ（膜厚
3.0μｍ）を成膜することにより形成した。
また、実施例20においては、基盤１ａ，２ａを
イオンエツチングした後、その凹球面上にイオン
プレーテイング法により、所定の成膜条件（チツ
素ガス圧５×10-4Torr、成膜速度300Å／min、
基盤電圧−300V）でチタンナイトライドからな
る第２中間層１ｄ，２ｄ（膜厚0.3μｍ）を成膜し
た。次いで、スパツタリング法により所定の成膜
条件（アルゴンガス圧１×10-8Torr、成膜速度
400Å／min）でニツケルからなる第１中間層１
ｃ，２ｃ（膜厚0.05μｍ）を成膜し、引続き同様の
方法により、白金（80wt％）−ニツケル（10wt
％）−イリジウム（10wt％）合金をターゲツトと
し、所定の成膜条件（アルゴンガス圧１×
10-8Torr、成膜速度500Å／min）で表面層１ｂ，
２ｂ（膜厚1.0μｍ）を成膜した。
その他の実施例も、これらとほぼ同様の方法に
より中間層および表面層を形成した。
[Industrial Application Field] The present invention relates to a mold for press-molding glass, and particularly to a mold for molding into a high-precision glass molded body that does not require polishing after press-molding. [Prior art] Generally, when glass is formed by press molding,
A pre-softened glass to be formed is placed in a mold having a surface layer finished with a predetermined surface shape (for example, spherical or aspherical) (or the glass to be formed is placed in the mold and then heated and softened), By applying a predetermined pressure to this mold, the surface layer of the mold is transferred to the glass to be molded. Therefore,
Since the shape of the surface layer of the mold is directly transferred as the surface shape of the glass molded object, the mold has no defects such as pores in the surface layer, and can be precisely processed into a dense, mirror-like surface, and can be processed at high temperatures. It is required to meet requirements such as maintaining sufficient hardness and strength. Conventional materials for such molds include silicon carbide (SiC), silicon nitride (Si 3 N 4 ) (Japanese Patent Laid-Open No. 52-45613), and tungsten carbide (Japanese Patent Laid-Open No. 56-59641). , which uses zirconium oxide (ZrO 2 ) as a base material and on which a coating film of platinum-rhodium (Pt-Rh) alloy or platinum-iridium (Pt-Ir) alloy is formed (Japanese Patent Laid-Open No. 176930/1983) ) has been proposed. [Problems to be solved by the invention] However, although molds with a surface layer of silicon carbide or silicon nitride are dense and have excellent hardness and strength, they do not contain a large amount of lead in the glass to be molded. When using heavy flint-based optical glass containing lead, it has high chemical reactivity with lead.
It becomes difficult to form a glass molded body with high precision. Next, although tungsten carbide molds have excellent workability, they are susceptible to oxidation at high temperatures, causing roughness on the mold surface and making it impossible to maintain an optical surface. Another problem was that it easily reacted with the glass to be formed. In addition, it is said that the advantage of coatings formed with platinum-rhodium or platinum-iridium alloys is that they do not cause chemical reactions with the glass to be formed, but according to experiments conducted by the present inventors, There was a problem that the mold releasability from the glass molded product was poor from the beginning of press molding. [Means for solving the problems] The mold for the first glass molded body according to the present invention is as follows:
The surface layer of the mold is made of a material consisting of at least two components, the main component of which is platinum (Pt) and 5 to 45 wt% of nickel (Ni). The mold for the second glass molded body according to the present invention is:
In addition to using the above-mentioned surface layer, nickel (Ni), titanium (Ti), chromium (Cr), molybdenum (Mo), cobalt (Co), titanium nitride (TiN) is used between this surface layer and the underlying base. ), titanium carbide (TiC), and a mixture thereof. These surface layers and intermediate layers are formed on a substrate processed into a predetermined shape by a sputtering method, an ion plating method, or the like. Film thickness is 0.05~
The thickness is preferably about 10 μm. If it is too thin, it will be difficult to obtain a uniform film, and if it is too thick, it will not only take a long time to form the film, but also be easily deformed during press molding depending on the press molding conditions such as pressure and temperature. In addition, if iridium (Ir), rhodium (Rh), and gold (Au) are added to the surface layer material in addition to nickel, it will be able to withstand use in a press at even higher temperatures. The base material of the mold is not particularly limited as long as it satisfies the hardness, strength, heat resistance, etc. generally required for a base, and stainless steel,
Tungsten carbide (WC), zirconium oxide (ZrO 2 ), cermet, silicon carbide (SiC) and silicon nitride (Si 3 N 4 ) can be used. Further, as long as the pressure during press molding is such that deformation does not become a problem, the base material may be made of the same alloy as the materials of the above-mentioned surface layer and intermediate layer. [Function] The surface layer of the mold of the present invention not only has good density, hardness, strength, workability, and chemical reaction resistance, but also has good releasability from a press-molded glass molded body. Become good. That is,
By including nickel in the main component (50 wt% or more) of platinum, it is possible to particularly improve the mold releasability from the glass molded body. The reason why the content of nickel is 5 to 45 (preferably 10 to 40) wt% is because if the content of nickel is less than 5 wt%, the hardness will be low and scratches will easily occur. On the other hand, if it exceeds 45 wt%, nickel tends to diffuse into the glass molded body during press molding. Further, the intermediate layer has the effect of increasing the affinity between the base and the surface layer and extending the life of the mold. [Example] FIG. 1 is a sectional view of a mold showing an example of the present invention. The mold is composed of an upper mold 1 and a lower mold 2. The upper mold 1 and the lower mold 2 are arranged inside the guide mold 3 so that their respective outer peripheral surfaces slide on the inner peripheral surface of the guide mold 3. These upper mold 1 and lower mold 2 each consist of a base 1a and a surface layer 1b, and a base 2a and a surface layer 2b.
b, 2b are arranged to face each other. The bases 1a and 2a are made of tungsten carbide made dense by HIP treatment during sintering, processed into a cylinder (diameter 18 mm, height 28 mm), one end surface of which is ground into a concave spherical shape, and the final As a finishing touch, they were polished to a high-precision optical mirror surface using a diamond grindstone, and each was processed into a concave spherical surface with a predetermined radius of curvature (32 mm). The surface roughness of this concave spherical surface was 100 Å or less. The concave spherical surfaces of the substrates 1a and 2a were coated with surface layers 1b and 2b of a predetermined thickness under predetermined film forming conditions using a sputtering device and using targets having the material compositions of Examples 1 to 10 shown in the table. was formed. In addition, in that case, the bases 1a, 2a and the surface layers 1b, 2b
In order to further strengthen the adhesion with the surface layer 1
It is effective to clean the surfaces of the substrates 1a and 2a by reverse sputtering prior to forming the films b and 2b. For example, in Example 1, the target was a platinum (95wt%)-nickel (5wt%) alloy, and the film thickness was 0.5μ.
The film forming conditions at that time were an argon gas pressure of 1×10 −8 Torr and a film forming rate of 500 Å/min.
The film forming conditions were almost the same for Examples 2 to 10. In this embodiment, the guide mold 3 is made of tungsten carbide, similar to the bases 1a and 2a of the upper and lower molds. FIG. 2 is a sectional view of a mold showing another embodiment of the present invention. The upper mold 1' and the lower mold 2' of this example have a first intermediate layer 1c, a second intermediate layer 1d, and a This mold differs from the upper mold 1 and the lower mold 2 shown in FIG. 1 in that a first intermediate layer 2c and a second intermediate layer 2d are interposed therebetween, but the structure is otherwise the same. Although two intermediate layers are illustrated, the intermediate layer may include only one layer or three or more layers. Examples 11-13, 16-19 and examples with only one intermediate layer are shown in the table.
21, and an example in which the middle layer is two layers is shown as an example.
Shown as 14, 15 and 20. These intermediate layers and surface layers are, for example,
In No. 11, after ion etching the substrates 1a and 2a, the ion plating method was used under predetermined film forming conditions (degree of vacuum 5×10 -5 Torr, film forming rate 300 Å/
min, substrate voltage -300V) and the first one made of titanium.
After forming the intermediate layers 1c and 2c (film thickness 0.05 μm),
On top of that, platinum (95 wt.
%) - nickel (5wt%) alloy as a target,
Predetermined film formation conditions (argon gas pressure 1×10 -8 Torr,
The surface layers 1b and 2b (film thickness
3.0 μm). In Example 20, after ion etching the substrates 1a and 2a, the ion plating method was applied to the concave spherical surfaces of the substrates under predetermined film forming conditions (nitrogen gas pressure of 5×10 -4 Torr, film forming rate of 300 Å). /min,
Second intermediate layers 1d and 2d (film thickness: 0.3 μm) made of titanium nitride were formed at a substrate voltage of −300 V). Next, a sputtering method was used under predetermined film forming conditions (argon gas pressure 1×10 -8 Torr, film forming speed
400 Å/min) and the first intermediate layer 1 made of nickel.
c, 2c (thickness: 0.05 μm), and then platinum (80wt%)-nickel (10wt%) was formed using the same method.
%)-iridium (10wt%) alloy as a target, and specified film formation conditions (argon gas pressure 1×
10 -8 Torr, deposition rate 500 Å/min), the surface layer 1b,
2b (film thickness 1.0 μm) was formed. In other Examples, the intermediate layer and the surface layer were formed by substantially the same method as these.
本発明によれば、成形型の表面層を、白金を主
成分とし、ニツケルを５〜45wt％含有する少な
くとも２成分からなる物質で形成したことによ
り、緻密性、硬度および強度ならびに耐化学反応
性のそれぞれにおいて良好な結果が得られるとと
もに、ガラス成形体との離型性も向上する。
According to the present invention, the surface layer of the mold is formed of a material consisting of at least two components, mainly platinum and containing 5 to 45 wt% of nickel, which improves density, hardness, strength, and chemical reaction resistance. In each case, good results are obtained, and the releasability from the glass molded body is also improved.
第１図は本発明の一実施例を示す成形型の断面
図、第２図は本発明の他の実施例を示す断面図、
第３図はプレス成形機の構成例を示す断面図であ
る。
１，１′……上型、１ａ，２ａ……基盤、１ｂ，
２ｂ……表面層、１ｃ，１ｄ，２ｃ，２ｄ……中
間層、２，２′……下型。
FIG. 1 is a sectional view of a mold showing one embodiment of the present invention, FIG. 2 is a sectional view showing another embodiment of the present invention,
FIG. 3 is a sectional view showing an example of the configuration of a press molding machine. 1, 1'...Upper mold, 1a, 2a...Base, 1b,
2b... surface layer, 1c, 1d, 2c, 2d... middle layer, 2, 2'... bottom mold.
Claims (1)
レス成形により被成形ガラスに転写されてガラス
成形体を成形する成形型において、表面層が、白
金（Pt）を主成分とし、ニツケル（Ni）を５〜
45wt％が含有する少なくとも２成分からなる物
質で形成されていることを特徴とするガラス成形
体の成形型。 ２ 基盤、表面層およびこれら基盤と表面層との
間に位置する中間層を備え、表面層の形状がプレ
ス成形により被成形ガラスに転写されてガラス成
形体を成形する成形型において、表面層が、白金
（Pt）を主成分とし、ニツケル（Ni）を５〜45wt
％含有する少なくとも２成分からなる物質で形成
され、かつ中間層が、ニツケル（Ni）、チタン
（Ti）、クロム（Cr）、モリブデン（Mo）、コバル
ト（Co）、チタンナイトライド（TiN）、チタン
カーバイド（TiC）およびこれらの混合物から選
択された少なくとも１つを含む物質で形成されて
いることを特徴とするガラス成形体の成形型。[Scope of Claims] 1. A mold comprising a base and a surface layer, in which the shape of the surface layer is transferred to glass to be molded by press molding to form a glass molded article, the surface layer mainly containing platinum (Pt). and nickel (Ni) from 5 to
A mold for a glass molded article, characterized in that it is formed of a substance consisting of at least two components containing 45 wt%. 2. A mold comprising a base, a surface layer, and an intermediate layer located between these bases and the surface layer, in which the shape of the surface layer is transferred to the glass to be molded by press molding to form a glass molded object, in which the surface layer is , mainly composed of platinum (Pt) and 5 to 45wt of nickel (Ni).
%, and the intermediate layer is formed of a substance consisting of at least two components containing nickel (Ni), titanium (Ti), chromium (Cr), molybdenum (Mo), cobalt (Co), titanium nitride (TiN), A mold for a glass molded article, characterized in that it is formed of a material containing at least one selected from titanium carbide (TiC) and a mixture thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27872286A JPS63134526A (en) | 1986-11-25 | 1986-11-25 | Forming mold for formed glass article |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27872286A JPS63134526A (en) | 1986-11-25 | 1986-11-25 | Forming mold for formed glass article |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63134526A JPS63134526A (en) | 1988-06-07 |
| JPH0367976B2 true JPH0367976B2 (en) | 1991-10-24 |
Family
ID=17601285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27872286A Granted JPS63134526A (en) | 1986-11-25 | 1986-11-25 | Forming mold for formed glass article |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63134526A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1428801B1 (en) * | 2002-12-13 | 2016-03-23 | Sumita Optical Glass, Inc. | A coated moulding die for producing an optical glass element |
-
1986
- 1986-11-25 JP JP27872286A patent/JPS63134526A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63134526A (en) | 1988-06-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4721518A (en) | Mold for press-molding glass elements | |
| EP0605899B1 (en) | Press-molding die for glass optical elements | |
| JPH0367976B2 (en) | ||
| JP3630375B2 (en) | Mold for glass molding | |
| JPH0725557B2 (en) | Method for producing press-molding die for optical element and method for producing optical element | |
| JPH01111738A (en) | Molding die for molded glass | |
| JPH01115830A (en) | Forming mold for glass molded article | |
| JPH0424293B2 (en) | ||
| JPH01115836A (en) | Forming mold for formed glass article | |
| JPH0424294B2 (en) | ||
| JPH01111733A (en) | Molding die for molded glass | |
| JPH01115829A (en) | Forming mold for glass molded article | |
| JP2785888B2 (en) | Mold for optical element molding | |
| JPH01115837A (en) | Forming mold for formed glass article | |
| JPH01111742A (en) | Molding die for molded glass | |
| JPH01111739A (en) | Molding die for molded glass | |
| JPH01111741A (en) | Molding die for molded glass | |
| JPH01111740A (en) | Molding die for molded glass | |
| JPH01115832A (en) | Forming mold for formed glass article | |
| JPH01115839A (en) | Forming mold for formed glass article | |
| JPH01111737A (en) | Molding die for molded glass | |
| JPH01153542A (en) | Forming mold for glass moldings | |
| JPH01115835A (en) | Forming mold for formed glass article | |
| JPH01115840A (en) | Forming mold for formed glass article | |
| JPH01115834A (en) | Forming mold for formed glass article |