JPH036838U - - Google Patents
Info
- Publication number
- JPH036838U JPH036838U JP1989065832U JP6583289U JPH036838U JP H036838 U JPH036838 U JP H036838U JP 1989065832 U JP1989065832 U JP 1989065832U JP 6583289 U JP6583289 U JP 6583289U JP H036838 U JPH036838 U JP H036838U
- Authority
- JP
- Japan
- Prior art keywords
- cooling module
- cooling structure
- facing
- cooling
- immersion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Description
第１図ａは本考案の一実施例を示す図であり、
同図ｂはその第１図における−′断面図、第
２図ａは本考案の他の実施例を示す図であり、同
図ｂはその第２図における−′断面図、第３
図は本考案が適用される冷却システムの全体構成
図、第４図は従来の冷却モジユール内部構造図、
第５図は第４図におけるＡ−Ａ′断面図を示して
いる。
図において、１……基板、２……素子、５……
低沸点冷媒、６ａ……冷却水通路、８……放熱フ
イン、１００……冷却モジユールをそれぞれ示す
。
FIG. 1a is a diagram showing an embodiment of the present invention,
Figure b is a cross-sectional view taken at -' in Figure 1, Figure 2 a is a diagram showing another embodiment of the present invention, Figure b is a cross-sectional view taken at -' in Figure 2, and Figure 3 is a cross-sectional view taken at
The figure is an overall configuration diagram of a cooling system to which the present invention is applied, and Figure 4 is a diagram of the internal structure of a conventional cooling module.
FIG. 5 shows a sectional view taken along the line AA' in FIG. In the figure, 1... substrate, 2... element, 5...
Low boiling point refrigerant, 6a...Cooling water passage, 8...Radiation fin, 100...Cooling module, respectively.
Claims (1)
とも該素子２と対向する部分が金属体より構成さ
れた冷却モジユール１００に低沸点冷媒５を充填
して該素子２の冷却を行う素子の浸漬冷却構造に
於いて、 前記素子２と対向する側の前記冷却モジユール
１００に熱伝導冷却構造を形成したことを特徴と
する素子の浸漬冷却構造。 (2) 前記冷却モジユール１００における前記素
子２と対向する内側表面を櫛歯形状４ａとしたこ
とを特徴とする請求項１記載の素子の浸漬冷却構
造。[Claims for Utility Model Registration] (1) A cooling module 100 having a substrate 1 on which an element 2 is mounted, and at least a portion facing the element 2 made of a metal body, is filled with a low boiling point refrigerant 5. An immersion cooling structure for an element that cools the element 2, characterized in that a heat conduction cooling structure is formed on the cooling module 100 on the side facing the element 2. (2) The immersion cooling structure for an element according to claim 1, wherein the inner surface of the cooling module 100 facing the element 2 has a comb-teeth shape 4a.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989065832U JPH036838U (en) | 1989-06-07 | 1989-06-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989065832U JPH036838U (en) | 1989-06-07 | 1989-06-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH036838U true JPH036838U (en) | 1991-01-23 |
Family
ID=31598019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989065832U Pending JPH036838U (en) | 1989-06-07 | 1989-06-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH036838U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004297069A (en) * | 2003-03-27 | 2004-10-21 | Stmicroelectronics Inc | Systems and methods for direct convection cooling of exposed integrated circuit die surfaces |
| JP2010134693A (en) * | 2008-12-04 | 2010-06-17 | Fujitsu Ltd | Cooling jacket, cooling unit, cooling system, and electronic appliance |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61135144A (en) * | 1984-12-05 | 1986-06-23 | Fujitsu Ltd | Cooling device for electronic part |
-
1989
- 1989-06-07 JP JP1989065832U patent/JPH036838U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61135144A (en) * | 1984-12-05 | 1986-06-23 | Fujitsu Ltd | Cooling device for electronic part |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004297069A (en) * | 2003-03-27 | 2004-10-21 | Stmicroelectronics Inc | Systems and methods for direct convection cooling of exposed integrated circuit die surfaces |
| JP2010134693A (en) * | 2008-12-04 | 2010-06-17 | Fujitsu Ltd | Cooling jacket, cooling unit, cooling system, and electronic appliance |
| US8422228B2 (en) | 2008-12-04 | 2013-04-16 | Fujitsu Limited | Cooling jacket, cooling unit, and electronic apparatus |
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