JPH0368768A - Rotational taking up device for coating fine wire - Google Patents

Rotational taking up device for coating fine wire

Info

Publication number
JPH0368768A
JPH0368768A JP1204769A JP20476989A JPH0368768A JP H0368768 A JPH0368768 A JP H0368768A JP 1204769 A JP1204769 A JP 1204769A JP 20476989 A JP20476989 A JP 20476989A JP H0368768 A JPH0368768 A JP H0368768A
Authority
JP
Japan
Prior art keywords
thin wire
reel
fine wire
coating
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1204769A
Other languages
Japanese (ja)
Inventor
Shunpei Miyajima
俊平 宮嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Priority to JP1204769A priority Critical patent/JPH0368768A/en
Publication of JPH0368768A publication Critical patent/JPH0368768A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/01Manufacture or treatment
    • H10W72/011Apparatus therefor
    • H10W72/0115Apparatus for manufacturing bond wires
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54Apparatus specially adapted for continuous coating
    • C23C16/545Apparatus specially adapted for continuous coating for coating elongated substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/01Manufacture or treatment
    • H10W72/011Apparatus therefor
    • H10W72/0116Apparatus for manufacturing strap connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/01Manufacture or treatment
    • H10W72/015Manufacture or treatment of bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/01Manufacture or treatment
    • H10W72/015Manufacture or treatment of bond wires
    • H10W72/01515Forming coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/075Connecting or disconnecting of bond wires
    • H10W72/07502Connecting or disconnecting of bond wires using an auxiliary member
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/075Connecting or disconnecting of bond wires
    • H10W72/07541Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/521Structures or relative sizes of bond wires
    • H10W72/522Multilayered bond wires, e.g. having a coating concentric around a core

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To form the uniform film of an inorg. material on the surface of a fine wire by installing the rotational taking up device for coating a fine wire to the vacuum chamber of a vacuum device and making a vapor deposition operation simultaneously with delivery of the fine wire while rotating the wire around its axial direction. CONSTITUTION:This rotating device for coating the fine wire is installed to the vacuum chamber 36 of a dry coating device, such as sputtering, ion plating, vacuum vapor deposition of plasma CVD. The delivery and taking up of the coiled fine wire 4 are executed and simultaneously the fine wire 4 is rotated around the progressing direction thereof as an axis 12. The material to be evaporated is thereby deposited by evaporation uniformly on the fine wire.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、各種細線の表面に均一な皮膜を被覆すること
、特に、半導体チップと外部リードとをボンディングす
る細線の表面にドライコーティング法により無機物質を
連続して均一に被覆する場合に用いるコーティング用回
転巻取装置に関するものである。
Detailed Description of the Invention (Industrial Field of Application) The present invention is directed to coating the surfaces of various thin wires with a uniform film, and in particular coating the surfaces of thin wires for bonding semiconductor chips and external leads with a dry coating method. The present invention relates to a coating rotary winding device used to continuously and uniformly coat an inorganic substance.

(従来の技術) 細線、例えば半導体チップとリードフレームを結ぶボン
ディング細線は、裸のま〜使用されていたが、近時次第
に高密度化接合となっておりそのため細線間の接触が起
って回路が短絡し、チップの正常な働きを阻害すること
が多くなっている。
(Prior art) Thin wires, such as bonding thin wires that connect semiconductor chips and lead frames, were used bare, but in recent years, bonding has become increasingly dense, and as a result, contact between the thin wires occurs and circuits are damaged. It is becoming increasingly common for chips to short-circuit and interfere with the normal functioning of the chip.

そこで、ボンディング細線の表面に有機高分子樹脂より
なる絶縁皮膜を被覆する方法が例えば特開昭58−23
39号公報に開示されているが、前述のような樹脂皮膜
は、チップと細線の接合時に細線表面(ボンディングボ
ール上)に残留し接合不良を起すことがある。そのため
この残留樹脂をガスで吹き飛ばし、吸引除去することが
特開昭63−318132号公報に開示されているが、
これは設備的にも複雑になるという問題点を有する。
Therefore, a method of coating the surface of the bonding thin wire with an insulating film made of organic polymer resin has been proposed, for example, in JP-A-58-23.
As disclosed in Japanese Patent No. 39, the resin film as described above may remain on the surface of the thin wire (on the bonding ball) when the chip and the thin wire are bonded, resulting in poor bonding. Therefore, Japanese Patent Application Laid-Open No. 63-318132 discloses that this residual resin is blown away with gas and removed by suction.
This has the problem of complicating the equipment.

一方有機樹脂に替えて、無機物質をスパッタリング、イ
オンブレーティング、真空蒸着、プラズマCVDなどの
ドライコーティング法によって細線表面に被覆すること
が考えられている。
On the other hand, it has been considered to coat the surface of the thin wire with an inorganic substance instead of an organic resin by a dry coating method such as sputtering, ion blasting, vacuum deposition, or plasma CVD.

一般にスパッタリング、イオンブレーティング、真空蒸
着あるいはプラズマCVDなとのドライコーティング法
は、湿式めっき法あるいは溶媒中に溶解させた高分子の
塗布法などによる被覆法に較べて皮膜とする物質が広い
範囲から選べ、また膜厚の制御がしやすいという特長が
あり、機能性薄膜の製造法として半導体工業を中心に広
く用いられている。
In general, dry coating methods such as sputtering, ion blasting, vacuum evaporation, or plasma CVD can cover a wider range of materials than coating methods such as wet plating or coating with polymers dissolved in a solvent. It is widely used mainly in the semiconductor industry as a method for producing functional thin films because it has the advantage of being flexible and easy to control the film thickness.

しかしながら、一般のドライコーティング法においては
、蒸着されて薄膜となる物質は真空槽内の坩堝、(スパ
ッタリング)ターゲットなどの蒸着源からほぼ一方向に
飛来し、基板上に堆積する仕組みとなっており、平板状
あるいはそれに近い形状の基板にコーティングする場合
には良いものの、立体的形状の基体の表面にコーティン
グする場合には蒸着源から見て陰となる部分への蒸着物
質の回り込みが不十分なため均一にコーティングするこ
とが困難であった。
However, in the general dry coating method, the material that is deposited to form a thin film flies in almost one direction from a deposition source such as a crucible in a vacuum chamber or a (sputtering) target, and is deposited on the substrate. Although this is good when coating a substrate with a flat or similar shape, when coating the surface of a three-dimensional substrate, the vapor deposition material does not wrap around to the shadowed part when viewed from the vapor deposition source. Therefore, it was difficult to coat the film uniformly.

特に真空槽にくらべて非常に長い細線状の基体にコーテ
ィングする場合には糸巻様のリールに巻いた細線を蒸着
ゾーンに送り出しながらコーティングを行なうことが必
要であるが、やはり細線の表面のうち蒸着源から見て陰
になる部分へ蒸着される割合が少なくなるため結果とし
て均一な膜厚を得ることは不可能であった。
In particular, when coating a thin wire-shaped substrate that is much longer than a vacuum chamber, it is necessary to perform coating while sending the thin wire wound on a peg-like reel to the deposition zone. As a result, it was impossible to obtain a uniform film thickness because the proportion of the vapor deposited in the shaded area when viewed from the source was reduced.

この解決策として、いわゆるホローカソードスパッタリ
ングなどのように、軸対称の構造を持つ装置を用い、軸
に相当する空間に細線を送り出すことによって、細線の
表面上にどの部分も均一にコーティングする方法が従来
から考案されている。
As a solution to this problem, a method such as so-called hollow cathode sputtering uses a device with an axially symmetrical structure and sends out the thin wire into a space corresponding to the axis, thereby uniformly coating any part of the surface of the thin wire. It has been devised for a long time.

しかしこの方法では、ターゲットやガス導入部分などの
円筒形配置をはじめ複雑な構成を持つ専用の装置を必要
とすること、および細線のほかに対極が配置できないた
め堆積条件が制御しにくいことなどの欠点があった。
However, this method requires a specialized device with a complex configuration including a cylindrical arrangement of the target and gas introduction part, and it is difficult to control the deposition conditions because it is not possible to arrange a counter electrode in addition to the thin wire. There were drawbacks.

(発明が解決しようとする課題) 本発明は、上記したような堆積条件が制御しにくい特殊
形状の蒸着装置を用いることなく、−船釣なドライコー
ティング法によって、細線表面に均一な無機物質の皮膜
を形成させるための装置を提供することを目的とするも
のである。
(Problems to be Solved by the Invention) The present invention enables uniform inorganic material to be coated on the surface of a fine wire by using a dry coating method carried out on a boat, without using a specially shaped vapor deposition device in which the deposition conditions are difficult to control as described above. The object of the present invention is to provide an apparatus for forming a film.

(課題を解決するための手段) 上記目的を達成するため本発明は次の事項を要旨とする
。すなわち フランジを有する支持台に、細線送り出しリールを回転
自在に取付けると共に前記フランジに支持台を回転する
回転体を連結した細線送り出し機構と、フランジを有す
る支持台に、連動装置を介して回転する細線巻取リール
を設置すると共に、前記フランジに支持台を回転する回
転体を連結し、かつ、前記連動装置と連結する回転体を
設けた細線巻取り機構とを、同軸上に回転するよう配置
し、外部動力により回転する同期回転機構を、前記送り
出し機構及び巻取り機構のそれぞれの回転体と連動する
よう連結したことを特徴とする細線コーティング用回転
巻取装置。
(Means for Solving the Problems) In order to achieve the above object, the present invention has the following points. In other words, a thin wire sending reel is rotatably attached to a support base having a flange, and a fine wire sending reel is connected to the flange to rotate a rotating body for rotating the support base. A take-up reel is installed, and a thin wire winding mechanism is arranged to rotate coaxially, and a thin wire winding mechanism is provided, in which a rotating body for rotating the support base is connected to the flange, and a rotating body is connected to the interlocking device. A rotary winding device for thin wire coating, characterized in that a synchronous rotation mechanism rotated by external power is connected to the respective rotating bodies of the sending mechanism and the winding mechanism so as to interlock with each other.

そして、上記要旨の発明には更に次の条件を付加するこ
とができることも、本発明の特徴である。
It is also a feature of the present invention that the following conditions can be added to the invention as summarized above.

すなわち上記発明において、 1、送り出し機構及び巻取り機構の各支持台に細線案内
スプールを設けること 2、送り出し機構支持台に細線案内と共に張力制御が可
能な複数個のスプールを設けることを特徴とする。
That is, the above invention is characterized in that: 1. Each support of the feeding mechanism and the winding mechanism is provided with a thin wire guide spool; 2. The feeding mechanism support is provided with a plurality of spools capable of controlling the tension as well as the thin wire guide. .

本発明装置は、スパッタリング、イオンブレーティング
、真空蒸着、あるいはプラズマCVDなどのドライコー
ティング装置の真空槽内に設置し、コイル状に巻かれた
細線の送り出しおよび巻取りをすると同時に細線をその
進行方向を軸として回転させることで、蒸発物質を均一
に蒸着することを可能とするものである。
The device of the present invention is installed in a vacuum chamber of a dry coating device for sputtering, ion blasting, vacuum evaporation, or plasma CVD, and simultaneously sends out and winds up a thin wire wound into a coil, and simultaneously moves the thin wire in its traveling direction. By rotating it around the axis, it is possible to uniformly deposit the evaporated substance.

ドライコーティング法による被覆法は、一般に湿式めっ
き法あるいは溶媒中に溶解させた高分子の塗布法などに
よる被覆法に較べて皮膜とする物質が広い範囲から選べ
、また膜厚の制御がしやすいという特長がある。
Compared to wet plating methods or coating methods using polymers dissolved in a solvent, dry coating methods generally allow for a wider range of materials to be formed into the film, and are easier to control the film thickness. It has its features.

コーティングの方法として、スパッタリング法では膜厚
などの制御性に特にすぐれた緻密な薄膜がコーティング
され、またイオンブレーティング法では短時間で密着性
の高い薄膜のコーティングが行えるという特徴がある。
As a coating method, the sputtering method coats a dense thin film with particularly good controllability of film thickness, and the ion blasting method has the characteristic of being able to coat a thin film with high adhesion in a short time.

以下本発明を、図に示す実施例に基づいて詳細に説明す
る。
The present invention will be described in detail below based on embodiments shown in the drawings.

第1図は、本発明の正面図であり、第2図は同平面図で
ある。図において、Aは細線送り出し機構、Bは細I!
巻取り機構、Cは同期回転機構を示している。
FIG. 1 is a front view of the present invention, and FIG. 2 is a plan view thereof. In the figure, A is the thin wire feeding mechanism, and B is the thin wire I!
The winding mechanism C indicates a synchronous rotation mechanism.

細線送り出し機構Aは、以下のように構成される。すな
わち、フランジ1′を有するL型の支持台1上に、支軸
2に回転自在に取付けた送り出しリール3を該支軸2を
介して固定すると共に細線4の送り出し方向に並列して
設け、支軸5,6゜7のそれぞれに回転自在に取付けた
スプール8゜9.10を、該支軸5.6. 7を介して
固定している。またフランジ1′には、支持台1を回転
する回転歯車11を軸12を介して連結されている。1
3は回転軸12を軸受け20を介して支持する架台であ
る。
The thin wire delivery mechanism A is configured as follows. That is, on an L-shaped support 1 having a flange 1', a delivery reel 3 rotatably attached to a support shaft 2 is fixed via the support shaft 2, and is provided in parallel in the delivery direction of the fine wire 4. A spool 8°9.10 rotatably attached to each of the support shafts 5, 6°7 is connected to the support shaft 5.6. It is fixed via 7. Further, a rotary gear 11 for rotating the support base 1 is connected to the flange 1' via a shaft 12. 1
Reference numeral 3 denotes a frame that supports the rotating shaft 12 via a bearing 20.

上記スプール8. 9.10は、必要に応じて設置すれ
ばよいのであるが本実施例では3個設けている(支Id
15.6. 7或はスプール8. 9.10は、取り外
し可能な構造とする。)。これは細線の送り出しにあた
って細線の進行方向が、回転中心軸に一致するように案
内すると共に巻取時に張力を調整して、たるみが起きな
いように細線を移行させる役割を果たしている。このた
め、例えば軸6を支持台の回転軸と直交方向に可動とし
、前後のスプールとの重り深さを制御できる構造とする
ことが好ましい。
Above spool 8. 9.10 can be installed as needed, but in this example, three are provided (support ID
15.6. 7 or spool 8. 9.10 shall be of removable construction. ). This plays the role of guiding the thin wire so that the direction of movement of the thin wire coincides with the central axis of rotation when feeding out the thin wire, and also adjusting the tension during winding to move the thin wire so that it does not sag. For this reason, it is preferable to have a structure in which, for example, the shaft 6 is movable in a direction orthogonal to the rotation axis of the support base, and the weight depth between the front and rear spools can be controlled.

細線巻取り機構Bでは、送り出し機構Aと同様にフラン
ジ14’を有するL型の支持台14を設けており、この
支持台14には、該台14に固定した軸受け15により
巻取り−ルミ6を取付けた回転軸17を支承している。
The fine wire winding mechanism B is provided with an L-shaped support base 14 having a flange 14' like the feeding mechanism A, and the support base 14 has a bearing 15 fixed to the base 14 to support the winding-lumi 6. It supports the rotating shaft 17 with the attached.

フランジ14’ には支持台回転歯車18が軸19を介
して固定され、軸】9は軸受け20を介して架台13′
 に支持されている。21はリール1Bを回転するため
の伝達歯車であり、軸受け2aで回転自在に支承されて
いる軸22の一端に固定されている。
A support rotating gear 18 is fixed to the flange 14' via a shaft 19, and the shaft 9 is connected to the frame 13' via a bearing 20.
is supported by 21 is a transmission gear for rotating the reel 1B, and is fixed to one end of a shaft 22 rotatably supported by a bearing 2a.

軸22の他端には、傘歯車23が固定されており、該歯
車23は、支持台14上に固定された軸受け24に支持
されている中間伝達歯車25を介して、巻取リール回転
軸17に取付けられたリール回転歯車26と連結してい
る。27は支軸28に回転自在に係合した細線案内スプ
ールで、必要に応じて取付け、細線が回転中心軸を移行
するようにガイドする。尚支軸28は取はずし可能に、
支持台に固定されている。
A bevel gear 23 is fixed to the other end of the shaft 22, and the gear 23 is connected to the take-up reel rotation shaft via an intermediate transmission gear 25 supported by a bearing 24 fixed on the support base 14. It is connected to a reel rotation gear 26 attached to 17. Reference numeral 27 denotes a fine wire guide spool rotatably engaged with the support shaft 28, which is attached as necessary to guide the fine wire so that it moves along the center axis of rotation. In addition, the support shaft 28 is removable,
fixed to a support.

同期回転機構Cは、次の構成を有する。すなわち、回転
軸29の両端側に同期回転歯車30.31を固設すると
共に、駆動歯車32を固定して駆動モーターMと連結し
ている。33は細線送り出し機構Aの支持台回転歯車と
連結する送り出し側同期連動歯車であり、34は細線巻
取り機構Bの支持台回転歯車18と連結している巻取側
同期連動歯車である。
The synchronous rotation mechanism C has the following configuration. That is, synchronous rotating gears 30 and 31 are fixedly installed on both ends of the rotating shaft 29, and a driving gear 32 is fixedly connected to the driving motor M. Reference numeral 33 denotes a feed-out side synchronous interlocking gear connected to the support rotating gear of the fine wire sending mechanism A, and 34 denotes a winding side synchronous interlocking gear connected to the support rotating gear 18 of the fine wire winding mechanism B.

巻取側同期連動歯車34には、巻取リールの回転伝達歯
車21と連結する連動歯車35が固定されている。
An interlocking gear 35 that is connected to the rotation transmission gear 21 of the take-up reel is fixed to the take-up side synchronous interlocking gear 34 .

上記の構成において、送り出しり−ル3に巻回している
細線4は、進行方向を回転軸としながら巻取リール16
に巻取られる。すなわちモーターMによって駆動される
同期回転軸29は両サイドの歯車30.31を同期回転
し、この動力を連動歯車33゜34より支持台回転歯車
11.18に伝達する。該回転歯車11.18は軸12
と19を中心に支持台1及び14を同一方向に同期回転
をする。同様に、連動歯車35よりの動力が伝達歯車2
1に伝わりこの回転によって傘歯車23及び中間伝達歯
車25よりリール回転歯車26に伝達され巻取り−ル1
6を回転する。巻取リール1Bの回転により細線4は回
転しながら引張られ、自由回転する送り出しり−ル3よ
り繰り出されて巻取リール16に巻取られるが、この際
細線の移行は、支持台の各フランジ1’ 、 14’の
支持軸12.19の中心(すなわち回転軸)と一致する
ように、リール3.16を配置している。そして、これ
は各支持台に立設されるスプールlO及び27を、回転
中心軸に細線が位置するように配置することによって前
記リール3616の配置に関係なく達成できる。
In the above configuration, the thin wire 4 wound around the feed reel 3 is wound around the take-up reel 16 with the direction of rotation as the axis of rotation.
It is wound up. That is, the synchronous rotating shaft 29 driven by the motor M synchronously rotates the gears 30, 31 on both sides, and transmits this power to the support rotating gears 11, 18 through the interlocking gears 33, 34. The rotating gear 11.18 is connected to the shaft 12.
The supports 1 and 14 are rotated synchronously in the same direction around and 19. Similarly, the power from the interlocking gear 35 is transmitted to the transmission gear 2.
This rotation is transmitted to the reel rotation gear 26 from the bevel gear 23 and the intermediate transmission gear 25, and the rotation is transmitted to the reel rotation gear 26.
Rotate 6. The thin wire 4 is rotated and pulled by the rotation of the take-up reel 1B, and is fed out from the freely rotating feed-out reel 3 and wound onto the take-up reel 16. At this time, the thin wire is transferred to each flange of the support base. The reel 3.16 is arranged so as to coincide with the center (i.e., the rotation axis) of the support shaft 12.19 of the reels 1' and 14'. This can be achieved regardless of the arrangement of the reel 3616 by arranging the spools 1O and 27, which are erected on each support stand, so that the thin wire is located at the central axis of rotation.

第3図及び第4図は、本発明の別の実施例であり、細線
1が送り出し機構Aと、巻取り機構の間を1乃至複数回
往復移行する構造となっている。
3 and 4 show another embodiment of the present invention, in which the thin wire 1 is configured to reciprocate between the feeding mechanism A and the winding mechanism one or more times.

すなわち、送り出し機構側の支持台1及び巻取り機構側
の支持台i4には支軸7および28を固定し、この支軸
7,28にはそれぞれ案内スプール10゜10’および
27.27’が回転自在に取付けられている。送り出し
リールより繰り出される細線4はスプールlOに案内さ
れてスプール27に移行し、これを転回してスプール1
0′を通り、更にスプール27′ に案内されてリール
1Bに巻取られる。このように細線4はスプール10.
27間を一往復するが、この際軸12.19によって回
転する各機構A、Bの中心軸近傍を細線は回転しながら
移行する。本実施例ではスプールを各支持台上に2箇支
持しているがこれを増すことによって細線の往復回数を
増すことができる。尚、本実施例の他の構造は、第1.
2図に示した構成と同様である。
That is, the support shafts 7 and 28 are fixed to the support stand 1 on the feeding mechanism side and the support stand i4 on the winding mechanism side, and guide spools 10° 10' and 27.27' are attached to the support shafts 7 and 28, respectively. It is rotatably mounted. The fine wire 4 fed out from the feed reel is guided by the spool 1O and transferred to the spool 27, which is then turned and transferred to the spool 1.
0', and is further guided to the spool 27' and wound onto the reel 1B. In this way, the thin wire 4 is connected to the spool 10.
27, and at this time, the thin wire moves while rotating near the central axes of the mechanisms A and B, which are rotated by shafts 12 and 19. In this embodiment, two spools are supported on each support stand, but by increasing the number of spools, the number of reciprocations of the thin wire can be increased. Incidentally, the other structure of this embodiment is the first one.
The configuration is similar to that shown in FIG.

以上の実施例において、回転伝達機構を歯車を用いた構
成で説明したが、本発明はこれに限定されることなく、
同期回転が可能な別な手段例えば、チェー3ベルト方式
を採用することによっても目的が達成できることは云う
までもない。
In the above embodiments, the rotation transmission mechanism was explained as having a configuration using gears, but the present invention is not limited to this.
It goes without saying that the object can also be achieved by employing another means capable of synchronous rotation, such as a chain three belt system.

本発明装置はドライコーティング装置の真空槽内に設置
される、第5図にイオンブレーティング装置に本発明を
取付けた例を示す。すなわち、図中の36が真空槽、3
7が真空ポンプと連通し、槽内を減圧する排気管、88
は雰囲気ガス供給管、39は本発明装置で、槽壁に取付
けた架台4oに固定される。41は蒸発物質を挿入する
ルツボ、42は電子ビーム(EB)ガン、43は高周波
誘導コイルで蒸発物質を矢印の方向に移送する。細線1
は蒸着ゾーン44を、蒸着物質の流れ方向(矢印)に対
して垂直方向に進行するよう配置される。
The apparatus of the present invention is installed in a vacuum chamber of a dry coating apparatus. FIG. 5 shows an example in which the present invention is installed in an ion blating apparatus. That is, 36 in the figure is a vacuum chamber, 3
7 is an exhaust pipe that communicates with the vacuum pump and reduces the pressure inside the tank; 88
39 is an atmospheric gas supply pipe, and 39 is a device of the present invention, which is fixed to a pedestal 4o attached to the tank wall. 41 is a crucible into which the evaporated substance is inserted, 42 is an electron beam (EB) gun, and 43 is a high-frequency induction coil that transports the evaporated substance in the direction of the arrow. Thin line 1
is arranged to advance through the deposition zone 44 in a direction perpendicular to the flow direction (arrow) of the deposition material.

以下に本発明の適用例を示す。Application examples of the present invention are shown below.

直径30H、長さ20mの金合金ボンディング細線を第
1図に示す回転巻取装置にセットし、これをイオンブレ
ーティング装置の真空槽内に設置して、絶縁被覆用の酸
化アルミニウムを表面にコーティングした。コーティン
グ条件は以下の通りであった。
A thin gold alloy bonding wire with a diameter of 30H and a length of 20m was set in the rotating winding device shown in Figure 1, placed in the vacuum chamber of the ion blating device, and the surface was coated with aluminum oxide for insulation coating. did. The coating conditions were as follows.

手    法 :イオンブレーティング蒸発物質:Al
□O1粉末 雰 囲 気 : Ar 十o2混合(1: 1)ガス導
入、5 X 10−’Torr 蒸  発  法 : E B、  10kV、  20
0mARF ハ’7−  : 0.1klllコイル送
り速度: 27cm/i1n。
Method: Ion blasting Evaporated substance: Al
□O1 powder atmosphere: Ar and O2 mixed (1:1) gas introduction, 5 x 10-'Torr Evaporation method: EB, 10kV, 20
0mARF Ha'7-: 0.1klll Coil feed speed: 27cm/i1n.

膜     厚 : 25OA 細線温度:常温 コーテイング後のボンディング細線について形成された
薄膜の成分分析をAES法で行なったところ、はぼター
ゲットと同じ組成であった。また細線の断面をCMA 
(X線分析)で面分析したところ細線の側面にそって均
一に酸化アルミニウムがコーティングされていることが
わかった。
Film thickness: 25OA Thin wire temperature: room temperature When the composition of the thin film formed on the bonding thin wire after coating was analyzed by AES method, it was found to have the same composition as the Habo target. Also, CMA the cross section of the thin wire.
A surface analysis (X-ray analysis) revealed that aluminum oxide was coated uniformly along the sides of the thin wire.

(発明の効果) 本発明の細線コーティング用回転巻取装置を真空装置の
真空槽内に設置し、細線をその線方向を軸として回転さ
せながら送り出すと同時に蒸着操作を行なうことにより
、半導体用ボンディング細線、その他の金属線、合成繊
維あるいは炭素繊維等の細線上へ薄膜をコーティングす
ることができる。特に蒸着工程で細線は回転中心軸に一
致した移行をするため蒸着量がほぼ均一となり、細線表
面に緻密な均一無機皮膜を得ることができる。
(Effects of the Invention) The thin wire coating rotary winding device of the present invention is installed in a vacuum chamber of a vacuum device, and the thin wire is fed out while rotating around the wire direction as an axis, and at the same time vapor deposition operation is performed. The thin film can be coated onto thin wires such as thin wires, other metal wires, synthetic fibers, or carbon fibers. In particular, during the vapor deposition process, the thin wire moves in line with the central axis of rotation, so the amount of vapor deposition becomes almost uniform, and a dense and uniform inorganic film can be obtained on the surface of the thin wire.

【図面の簡単な説明】[Brief explanation of drawings]

図面は本発明の実施例であって、第1図は正面図、第2
図は平面図を示す。第3図は他の実施例の正面図、第4
図は第3図の1部平面図、第5図は本発明の使用例を示
す図である。 A:細線送り出し機構  B:細線巻取り機構C二同期
回転機構 1:支持台       1′:フランジ2:支 軸 
     3:送り出しり−ル4:細’a      
5.6.7:支軸8.9,10ニスプール  11:支
持台回転歯車12:軸      13.13’ :架
台14′:フランジ     14:支持台15:軸受
け       1B二巻取リール17:巻取リール回
転軸  18:支持台回転歯車19:軸       
  20:1Ill受け21:伝達歯車      2
2:軸 23:傘歯車       24:軸受け25:中間伝
達歯車    26:リール回転歯車27:案内スプー
ル   28:支 軸29:同期回転軸 ao、 31:同期回転歯車  32:駆動歯車33:
送り出し側同期連動歯車
The drawings show an embodiment of the present invention, and the first figure is a front view and the second figure is a front view.
The figure shows a plan view. Fig. 3 is a front view of another embodiment; Fig. 4 is a front view of another embodiment;
The figure is a partial plan view of FIG. 3, and FIG. 5 is a diagram showing an example of use of the present invention. A: Fine wire feeding mechanism B: Fine wire winding mechanism C Double synchronous rotation mechanism 1: Support stand 1': Flange 2: Support shaft
3: Feeding rule 4: Thin a
5.6.7: Support shaft 8.9, 10 varnish spool 11: Support base rotation gear 12: Shaft 13.13': Frame 14': Flange 14: Support base 15: Bearing 1B 2nd take-up reel 17: Take-up reel Rotating shaft 18: Support base rotating gear 19: Axis
20:1Ill receiver 21:Transmission gear 2
2: Shaft 23: Bevel gear 24: Bearing 25: Intermediate transmission gear 26: Reel rotation gear 27: Guide spool 28: Support shaft 29: Synchronous rotation axis ao, 31: Synchronous rotation gear 32: Drive gear 33:
Delivery side synchronous interlocking gear

Claims (5)

【特許請求の範囲】[Claims] 1.フランジを有する支持台に、細線送り出しリールを
回転自在に取付けると共に前記フランジに支持台を回転
する回転体を連結した細線送り出し機構と、フランジを
有する支持台に、連動装置を介して回転する細線巻取リ
ールを設置すると共に、前記フランジに支持台を回転す
る回転体を連結し、かつ、前記連動装置と連結する回転
体を設けた細線巻取り機構とを、同軸上に回転するよう
配置し、外部動力により回転する同期回転機構を、前記
送り出し機構及び巻取り機構のそれぞれの回転体と連動
するよう連結したことを特徴とする細線コーティング用
回転巻取装置。
1. A thin wire feed-out mechanism includes a fine wire feed-out reel rotatably attached to a support base having a flange, and a rotating body that rotates the support base is connected to the flange; In addition to installing a take-up reel, a thin wire winding mechanism having a rotating body connected to the flange that rotates the support base and a rotating body connected to the interlocking device is arranged so as to rotate coaxially, 1. A rotary winding device for thin wire coating, characterized in that a synchronous rotation mechanism rotated by external power is connected so as to interlock with each rotating body of the sending mechanism and the winding mechanism.
2.送り出し機構及び巻取り機構の各支持台に細線案内
スプールを設けたことを特徴とする請求項1記載の細線
コーティング用回転巻取装置。
2. 2. The rotary winding device for thin wire coating according to claim 1, wherein each support of the feeding mechanism and the winding mechanism is provided with a thin wire guide spool.
3.送り出し機構支持台に複数個のスプールを設けたこ
とを特徴とする請求項1または2記載の細線コーティン
グ用回転巻取装置。
3. 3. The rotary winding device for thin wire coating according to claim 1, wherein a plurality of spools are provided on the feeding mechanism support stand.
4.送り出しリールと巻取リールの間に設けたコーティ
ング領域を回転しながら進行する細線の回転軸が、送り
出し機構及び巻取り機構の回転軸と同軸になるようにセ
ットしたことを特徴とする請求項1、2または3記載の
細線コーティング用回転巻取装置。
4. Claim 1 characterized in that the rotation axis of the thin wire that rotates and advances in the coating area provided between the delivery reel and the take-up reel is set to be coaxial with the rotation axes of the delivery mechanism and the take-up mechanism. , 2 or 3. The rotary winding device for thin wire coating.
5.送り出しリールと巻取リールの間に設けたコーティ
ング領域を回転しながら進行する細線が、送り出し機構
及び巻取り機構の回転軸とほゞ同軸の範囲で少くとも1
往復するように、送り出し機構及び巻取り機構を配置し
たことを特徴とする請求項1、2、3記載の細線コーテ
ィング用回転巻取装置。
5. The thin wire that rotates in the coating area provided between the delivery reel and the take-up reel is at least once
4. The rotary winding device for fine wire coating according to claim 1, wherein the feeding mechanism and the winding mechanism are arranged so as to reciprocate.
JP1204769A 1989-08-09 1989-08-09 Rotational taking up device for coating fine wire Pending JPH0368768A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1204769A JPH0368768A (en) 1989-08-09 1989-08-09 Rotational taking up device for coating fine wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1204769A JPH0368768A (en) 1989-08-09 1989-08-09 Rotational taking up device for coating fine wire

Publications (1)

Publication Number Publication Date
JPH0368768A true JPH0368768A (en) 1991-03-25

Family

ID=16496043

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1204769A Pending JPH0368768A (en) 1989-08-09 1989-08-09 Rotational taking up device for coating fine wire

Country Status (1)

Country Link
JP (1) JPH0368768A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5524464A (en) * 1993-09-30 1996-06-11 Matsushita Electric Industrial Co., Ltd. Workpiece-bore processing apparatus and method
US5758421A (en) * 1994-05-02 1998-06-02 Matsushita Electric Industrial Co., Ltd. Method for manufacturing fluid bearing
JP2008068363A (en) * 2006-09-14 2008-03-27 Sii Micro Precision Kk Internal machining tool and machine tool using the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5524464A (en) * 1993-09-30 1996-06-11 Matsushita Electric Industrial Co., Ltd. Workpiece-bore processing apparatus and method
US5758421A (en) * 1994-05-02 1998-06-02 Matsushita Electric Industrial Co., Ltd. Method for manufacturing fluid bearing
JP2008068363A (en) * 2006-09-14 2008-03-27 Sii Micro Precision Kk Internal machining tool and machine tool using the same

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