JPH0369689B2 - - Google Patents

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a mold device for a so-called multi-plunger type transfer molding machine having the same number of plungers inserted into a plurality of material supply pots. Even when the pitch of the plunger is changed during replacement, there is no need to replace the lower mold master die set and the lower mold mount through which the plunger passes, and therefore, there is no need for large-scale mold replacement work. Regarding equipment.

[Conventional technology and problems]

In order to seal a semiconductor component with a resin, a method is used in which the semiconductor component is set in a cavity of a mold, a heated and softened resin is press-fitted into the cavity, and then heated and hardened.

Transfer molding is generally used for such molding, in which the resin is fed into the mold through a narrow gate, which results in uniform heating and uniform curing of the molded product, resulting in a product with good performance, and shortening the curing time. It is short and has good dimensional accuracy, and because softened and molten resin is injected, the inserted semiconductor components are less likely to be damaged or deformed.

However, in the transfer molding method, as shown in FIGS. 7 and 8, the heated and pressurized resin material is pressed by a plunger a and is transferred from a supply pot b to a cavity via an auxiliary runner c and a gate d. Only the resin material press-fitted into the cavity e becomes a product.

Therefore, other residual materials cannot be reused, resulting in a disadvantage that the yield of resin material is poor.

In order to eliminate these shortcomings, recently,
As shown in FIG. 9, a so-called multi-plunger type transfer is provided in which a large number of supply pots b are provided close to the cavity e via a gate d and a plunger corresponding to each supply pot b is provided to reduce residual resin material. Ar-forming molds began to be used.

A mold of this type is shown in FIG.

The mold is composed of a fixed upper mold 1 and a movable lower mold 2. On the upper mold side, an upper mold mounting plate 4 is attached to the lower surface of a heat insulating plate 3, and a compression spring 5 is interposed on the lower surface of the upper mold mounting plate 4. The upper ejector plate 6 is arranged so as to be removable.

An upper mold chase block 9 having an upper mold master die set 8 and a cavity e fixed to the upper mold master die set 8 is disposed below the ejector plate 6 with a gap 7 maintained therebetween.

Reference numeral 10 is an ejector pin which passes through the upper mold master die set 8 and the upper mold chase block 9 and whose base end is fixed to the upper ejector plate 6, so that the tip can protrude and retract from each cavity e and supply pot b. It's summery.

Further, an upper return pin 11 passing through the master die set 8 is fixed to the ejector plate 6.

Similar to the upper mold, the lower mold has a lower mold mounting plate 13 attached to the upper surface of the heat insulating plate 12, a lower ejector plate 15 is disposed with a gap 14 in between, and a spring is mounted above the lower ejector plate 15. A lower die master die set 18 having a lower die chase block 17 fixed to its upper surface via a die set 16 is disposed.

The lower master die set 18 is provided with a guide bush 20 that fits into a guide pin 19 provided in the upper master die set 8.

21 passes through the lower mold master die set 18 and the lower mold chase block 17, and is connected to the resin supply pot b of the lower mold chase block 17 by the equal pressure device 22.
It is a plunger that presses.

The lower ejector plate 15 has a lower die chase block 17 and a lower die master die set 18.
An ejector pin 23 that penetrates through and retracts from each cavity e, and a lower return pin 24 that abuts the upper return pin 11 are fixed.

25 is an ejector bar that can press the lower ejector plate 15 upward.

In order to resin-seal a semiconductor component using the mold device configured as described above, first open the upper and lower molds, set the semiconductor in the cavity e, and insert the resin material into the supply pot e. After the upper and lower molds are closed, the planar 21 is pressed upward by the equal pressure device 25 to press fit the resin material into the cavity e.

Next, when the mold is opened, the ejector pins 10 and 23 pressed by the spring 5 and the ejector bar 25 respectively protrude into the cavity e, and the product is ejected from the cavity e.

As described above, the same product can be produced one after another, but when switching to manufacturing another product, the mold must be replaced with a mold for molding the next product.

However, the chase blocks of both the upper and lower dies are bolted to the master die set, and the ejector pin passes through them, so replacing just the chase block is extremely troublesome and requires a lot of work. Requires replacement time.

Moreover, since the chase blocks of the upper and lower molds are at high temperatures due to heating of the resin material, it is not possible to immediately remove the mounting bolts.

Further, if the pitches of the plurality of plungers are different, each part of the lower mold having an insertion hole through which the plungers pass cannot be used.

Therefore, when replacing molds, the upper and lower molds are currently replaced as is, and it is necessary to prepare as many mold devices as there are types of each product.

However, preparing an entire set of expensive mold equipment for each type of product is a heavy economic burden, requires a large storage space for the molds, and requires heavy labor to replace the molds.

The present invention solves this problem by minimizing the number of chase blocks having mold parts to be replaced on the mold surface, the ejector pins and related parts required for each cavity, and reducing the pitch of the plunger. To provide a mold device that does not require an increase in replacement parts even if changes are made.

[Means for solving problems]

The present invention provides a mold device for a transfer molding mold having a plurality of plungers, and a lower mold master die set having a sliding groove into which a lower mold chase block is removably inserted, and a lower mold master die set that supports the lower mold master die set. The plunger insertion hole provided in the lower mold frame is one or more elongated holes.

[Effect]

With the above configuration, the plunger whose pitch is changed can be displaced within the elongated hole provided in the lower master die set and the lower mold mount to a predetermined pitch. There is no need to replace the pedestal.

〔Example〕

Embodiments of the present invention will be described with reference to the drawings.

Note that the same parts as in the conventional example are given the same reference numerals.

In this embodiment, the plunger for pressurizing the resin material in the material supply pot is provided on the lower mold side, but it may be provided on the upper mold side or on both sides of the upper mold and the lower mold.

4 to 6 show a mold apparatus, in which a plurality of cavities e are provided on the mold surfaces of an upper mold chase block 9 and a lower mold chase block 17, and a plurality of cavities e are provided on the mold surfaces of the lower mold chase block 17. A material supply pot b is provided which communicates with each cavity e.

An upper mold ejector pin 10 and a lower mold ejector pin 23, which are provided so as to be retractable into each cavity e in order to take out the product molded in each cavity e, are attached to the upper mold ejector plate 6 and the lower mold ejector plate 15, respectively. Fixed.

The upper die ejector plate 6 and the lower die ejector plate 15 are housed inside the upper die chase block 9 and the lower die chase block 17, respectively, so as to be vertically movable.

The upper die chase block 9 and the lower die chase block 17 are removably fitted into T-shaped sliding grooves 8a and 18a provided in the upper die master die set 8 and the lower die master die set 18, respectively.

Pin holes 9a and 17a are formed in the upper die chase block 9 and the lower die chase block 17, respectively, so that the pistons of the cylinders 27 and 28 installed in the upper die master die set 8 and the lower die master die set 18, respectively, are bored. When the pins 27a and 28a fit into the pin holes 9a and 17a, the inserted upper die chase block 9 and lower die chase block 17 are positioned and locked in their normal positions.

Handles 29 and 30 fixed to the side end surfaces of the upper chase block 9 and the lower chase block 17
is used for pulling out and inserting when changing molds.

Reference numeral 26 denotes a lower die mount supporting the lower master die set 18, but it may be integrated with the lower master die set 18.

The plunger 21, which pressurizes the material inserted into the plurality of material supply pots b, has insertion holes provided in the lower die chase block 17, the lower die ejector plate 15, the lower die master die set 18, and the lower die frame 26. The plunger 21 can be moved up and down by a lower transfer cylinder 31 attached to the lower end surface of the equal pressure device 22 which extends through the plunger 21 and supports the lower end of the plunger 21.

The lower transfer cylinder 31 may be a driving device that moves up and down using a screw or an electric jack instead of a cylinder.

Conventionally, the insertion hole through which the plunger 21 passes is
The lower die chase block 17, the lower die ejector plate 15, the lower die master die set 18, and the lower die mount 26 are all assembled as shown in FIG.
Independent insertion hole 17 for each plunger 21
However, in the present invention, the lower die chase block 17 and the lower die ejector plate 15 have through holes into which the individual plungers 21 are inserted, similar to the conventional example, and the plungers 21 of the lower die master die set 18 have through holes. The insertion holes 18b and 26a are one long hole as shown in FIG.

The length of the elongated hole can be changed by changing the mold by plunger 21.
The length is such that it can encompass all the moving positions of
The width of the elongated hole is such that the plunger 21 can be slidably guided.

There is no need to provide elongated holes at positions that do not interfere with the plunger 21 even when the plunger 21 is displaced by changing the mold.

Therefore, the plunger insertion holes 18b and 26a of the lower mold master die set 18 and the lower mold mount 26 are not opened only in positions where they do not interfere with the plunger 21, and are not opened in the middle as a plurality of elongated holes as shown in FIG. The part can be made into a reinforcing rib.

Next, a description will be given of mold replacement of the mold apparatus configured as described above.

As shown in FIG. 6, after lowering the plunger 21 from the lower chase block 17 and opening the upper and lower molds, the cylinders 27 and 28 are shortened, and the upper and lower chase blocks 9 and 1 are closed.
Pins 27a and 28a for positioning and locking 7 are separated.

Next, pull out the upper mold chase block 9 and lower mold chase block 17 using the handles 29 and 30, replace them with the upper mold and lower mold chase blocks for the next molding, and extend and position the cylinders 27 and 28. Fix it.

This completes the mold exchange.

If it is necessary to change the pitch of the plunger 21 due to mold replacement, either the plunger 21 and the equal pressure device 22 that supports the plunger 21 are replaced as is, or each equal pressure device 22 is fixed. is released and the planshear 21 is re-fixed after adjusting each position.

Lower mold master die set 18 and lower mold mount 26
Since the insertion holes 18b and 26a of the plunger 21 are elongated holes, insertion of the plunger 21 is allowed even after the position of each plunger 21 is changed.

The elongated holes 18b and 26a guide the plunger 21 only in the direction perpendicular to the elongated hole, and have no function of guiding the plunger 21 in the longitudinal direction of the elongated hole. Since the holes 17b are individually independent as in the conventional example shown in FIG. 3, and the plungers 21 are guided by the respective independent insertion holes 17b, no problem arises.

Therefore, when replacing the mold, each plunger 2
Even if the pitch of 1 is changed, there is no need for any setup change for the lower mold master die set 18 and the lower mold mount 26, which are the basis of the lower mold and are relatively heavy items, so the mold can be replaced. becomes extremely easy.

〔effect〕

The present invention provides a method for replacing molds in a mold device for a transfer molding mold having a plurality of plungers.
Conventionally, the entire mold device was replaced because there were many parts that needed to be replaced, but with the present invention, even when the pitch of the plunger is changed, the lower mold master die set and lower mold mount can be replaced. There is no need to replace it at all.

Since the lower mold master die set and the lower mold mount form the basis of the lower mold and are relatively heavy, replacing the lower mold is extremely easy, and the lower mold chase block can be simply moved from the sliding groove of the lower mold master die set. All you have to do is pull it out, insert the next lower mold master die set, and position and lock it, which greatly reduces the work time required to replace the mold.

In addition, when the pitch of the plunger is changed below the lower mold mount, the tip of the plunger does not have to be lowered until it comes out of the plunger insertion hole of the lower mold mount as shown in Fig. 6. Since the plunger can be displaced while it is in the elongated plunger insertion hole of the mount, there is also the effect that the amount of descent of the plunger can be reduced.

[Brief explanation of drawings]

1, 2, and 4 to 6 show embodiments of the present invention, and FIG. 1 is a cross-sectional view of essential parts showing a lower mold master die set and a plunger insertion hole of the lower mold,
Fig. 2 is another embodiment same as above, Fig. 3 is a conventional example same as above, Fig. 4 is a front view (sectional view) of the mold device, Fig. 5
The figure is a side view (cross-sectional view of the main part) of the same as above, Figure 6 is a front view (cross-sectional view) of the mold device showing the state of mold exchange, Figure 7
The figure is a plan view showing a part of the mold surface of the lower mold, FIG. 8 is a vertical cross-sectional view of a main part of the collision part of the upper mold and lower mold, and FIG. 9 is a plan view showing a part of the mold surface of the lower mold. 10 are longitudinal sectional views of a conventional mold device. 6... Upper die ejector plate, 8... Upper die master die set, 8a... Sliding groove, 9... Upper die chase block, 9a... Pin hole, 10...
Upper die ejector pin, 15...Lower die ejector plate, 17...Lower die chase block, 1
7a...pin hole, 17b...hole, 18...lower master die set, 18a...sliding groove, 18b...
...Insertion hole, 21...Plunger, 22...Isobaric device, 23...Lower ejector pin, 26...
Lower mold mount, 26a...Insertion hole, 27, 28...Cylinder, 27a, 28a...Pin, 29, 30
...Handle, 31...Lower transfer cylinder, b...Material supply pot, e...Cavity.

Claims (1)

[Claims] 1. The chase block is removably inserted into a mold device for a transfer mold that has the same number of plungers that pressurize resin material inserted into a plurality of material supply ports provided on the mold surface of the chase block. A mold device for a transfer mold, characterized in that the plunger insertion hole provided in the master die set has one or more elongated holes.