JPH0370853U - - Google Patents
Info
- Publication number
- JPH0370853U JPH0370853U JP13139389U JP13139389U JPH0370853U JP H0370853 U JPH0370853 U JP H0370853U JP 13139389 U JP13139389 U JP 13139389U JP 13139389 U JP13139389 U JP 13139389U JP H0370853 U JPH0370853 U JP H0370853U
- Authority
- JP
- Japan
- Prior art keywords
- molten solder
- jet
- jet nozzle
- sensor
- primary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案に係る噴流式ハンダ付装置の全
体構成を示す概略図、第２図はセンサーを示す拡
大正面図、第３図ａ，ｂ，ｃはプリント配線板の
種類を示す一部分の平面図、第４図は従来の噴流
式ハンダ付装置の概略図である。
１……溶融ハンダ槽、３……一次噴流ノズル、
４……二次噴流ノズル、５……溶融ハンダ、１０
ａ，１０ｂ，１０ｃ……プリント配線板、１５…
…識別マーク、１７……センサ、１９……制御部
。
Fig. 1 is a schematic diagram showing the overall configuration of the jet soldering device according to the present invention, Fig. 2 is an enlarged front view showing the sensor, and Fig. 3 a, b, and c are partial views showing the types of printed wiring boards. The plan view and FIG. 4 are schematic diagrams of a conventional jet-type soldering device. 1... Molten solder tank, 3... Primary jet nozzle,
4... Secondary jet nozzle, 5... Molten solder, 10
a, 10b, 10c...printed wiring board, 15...
...Identification mark, 17...sensor, 19...control unit.
Claims (1)
ゆつたり噴流させる二次噴流ノズルとを備えた溶
融ハンダ槽と、前記溶融ハンダ槽の手前に設置さ
れ、プリント配線板に設けられた識別マークを検
出するセンサーと、前記センサーの検出信号に基
づいて前記一次噴流ノズル及び二次噴流ノズルか
らの溶融ハンダの噴流を制御する制御部とで構成
したことを特徴とする噴流式ハンダ付装置。 A molten solder bath is provided with a primary jet nozzle that makes a thin jet of molten solder and a secondary jet nozzle that makes a slow jet of molten solder, and is installed in front of the molten solder bath to detect an identification mark provided on a printed wiring board. A jet-type soldering device comprising: a sensor; and a control section that controls jets of molten solder from the primary jet nozzle and the secondary jet nozzle based on a detection signal from the sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989131393U JPH0726053Y2 (en) | 1989-11-10 | 1989-11-10 | Jet type soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989131393U JPH0726053Y2 (en) | 1989-11-10 | 1989-11-10 | Jet type soldering device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0370853U true JPH0370853U (en) | 1991-07-17 |
| JPH0726053Y2 JPH0726053Y2 (en) | 1995-06-14 |
Family
ID=31678904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989131393U Expired - Lifetime JPH0726053Y2 (en) | 1989-11-10 | 1989-11-10 | Jet type soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0726053Y2 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59174270A (en) * | 1983-03-23 | 1984-10-02 | Hitachi Ltd | Jet soldering device for printed wiring boards |
| JPS6390356A (en) * | 1986-10-02 | 1988-04-21 | Mitsubishi Electric Corp | Flow soldering method for printed circuit boards |
| JPS63137568A (en) * | 1986-11-27 | 1988-06-09 | Toshiba Corp | Method and device for jet soldering |
| JPH01266793A (en) * | 1988-04-19 | 1989-10-24 | Kenji Kondo | Method and apparatus for soldering printed board |
-
1989
- 1989-11-10 JP JP1989131393U patent/JPH0726053Y2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59174270A (en) * | 1983-03-23 | 1984-10-02 | Hitachi Ltd | Jet soldering device for printed wiring boards |
| JPS6390356A (en) * | 1986-10-02 | 1988-04-21 | Mitsubishi Electric Corp | Flow soldering method for printed circuit boards |
| JPS63137568A (en) * | 1986-11-27 | 1988-06-09 | Toshiba Corp | Method and device for jet soldering |
| JPH01266793A (en) * | 1988-04-19 | 1989-10-24 | Kenji Kondo | Method and apparatus for soldering printed board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0726053Y2 (en) | 1995-06-14 |