JPH0371015U - - Google Patents
Info
- Publication number
- JPH0371015U JPH0371015U JP13309489U JP13309489U JPH0371015U JP H0371015 U JPH0371015 U JP H0371015U JP 13309489 U JP13309489 U JP 13309489U JP 13309489 U JP13309489 U JP 13309489U JP H0371015 U JPH0371015 U JP H0371015U
- Authority
- JP
- Japan
- Prior art keywords
- steel material
- duct
- arrangement structure
- steel
- prestressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000831 Steel Inorganic materials 0.000 claims description 6
- 239000010959 steel Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 239000002783 friction material Substances 0.000 claims description 2
- 239000002952 polymeric resin Substances 0.000 claims description 2
- 229920003002 synthetic resin Polymers 0.000 claims description 2
Landscapes
- Reinforcement Elements For Buildings (AREA)
Description
第１図は本考案の一実施例を示す斜視図、第２
図は第１図の−矢視断面図、第３図は要部拡
大断面図、第４図は本考案の他の実施例を示す要
部断面図、第５図は第４図の−矢視断面図で
ある。
１……コンクリート体、２……ダクト、３……
ＰＣ鋼材、５……低摩擦材（帯）、６……高分子
樹脂、２０……ダクト（スパイラルシース）。
Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is a sectional view taken along the - arrow in Fig. 1, Fig. 3 is an enlarged sectional view of the main part, Fig. 4 is a sectional view of the main part showing another embodiment of the present invention, and Fig. 5 is a sectional view taken along the - arrow in Fig. 4. FIG. 1... Concrete body, 2... Duct, 3...
PC steel material, 5...Low friction material (band), 6...Polymer resin, 20...Duct (spiral sheath).
Claims (1)
挿入されて、プレストレス導入のため緊張される
ＰＣ鋼材の配設構造において、上記ＰＣ鋼材に、
低摩擦材を装着したことを特徴とするＰＣ鋼材の
配設構造。 (2) 前記ＰＣ鋼材と前記ダクトとの間に、未硬
化状態の高分子樹脂を注入した請求項１記載のＰ
Ｃ鋼材の配設構造。[Scope of Claim for Utility Model Registration] (1) In a structure in which a prestressing steel material is inserted into a duct formed in a concrete body and is tensioned to introduce prestress, the above prestressing steel material:
A PC steel material arrangement structure characterized by being equipped with a low-friction material. (2) The PC according to claim 1, wherein an uncured polymer resin is injected between the PC steel material and the duct.
C steel arrangement structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989133094U JP2548020Y2 (en) | 1989-11-17 | 1989-11-17 | Arrangement structure of PC steel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989133094U JP2548020Y2 (en) | 1989-11-17 | 1989-11-17 | Arrangement structure of PC steel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0371015U true JPH0371015U (en) | 1991-07-17 |
| JP2548020Y2 JP2548020Y2 (en) | 1997-09-17 |
Family
ID=31680510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989133094U Expired - Lifetime JP2548020Y2 (en) | 1989-11-17 | 1989-11-17 | Arrangement structure of PC steel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2548020Y2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4124034Y1 (en) * | 1966-05-20 | 1966-12-07 | ||
| JPS5638746A (en) * | 1979-09-05 | 1981-04-14 | Toshiba Corp | Manufacture of implosion-proof cathode-ray tube |
| JPS6017450U (en) * | 1983-07-13 | 1985-02-06 | 京都電子工業株式会社 | Thermal conductivity measuring device |
-
1989
- 1989-11-17 JP JP1989133094U patent/JP2548020Y2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4124034Y1 (en) * | 1966-05-20 | 1966-12-07 | ||
| JPS5638746A (en) * | 1979-09-05 | 1981-04-14 | Toshiba Corp | Manufacture of implosion-proof cathode-ray tube |
| JPS6017450U (en) * | 1983-07-13 | 1985-02-06 | 京都電子工業株式会社 | Thermal conductivity measuring device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2548020Y2 (en) | 1997-09-17 |
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