JPH0371393B2 - - Google Patents
Info
- Publication number
- JPH0371393B2 JPH0371393B2 JP61110368A JP11036886A JPH0371393B2 JP H0371393 B2 JPH0371393 B2 JP H0371393B2 JP 61110368 A JP61110368 A JP 61110368A JP 11036886 A JP11036886 A JP 11036886A JP H0371393 B2 JPH0371393 B2 JP H0371393B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramics
- copper plate
- bonded
- ceramic
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Ceramic Products (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、セラミツクスと銅板とを割れなどを
発生することなく接合する、セラミツクスと銅板
との接合方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for joining ceramics and copper plates, which joins the ceramics and copper plates without causing cracks or the like.
従来の技術
セラミツクスは、耐熱性、耐摩耗性、耐食性な
どの点で、金属より優れた構造用材料として注目
されている。しかしセラミツクスには、金属に比
べて脆く、加工性が悪いという欠点がある。その
ため、構造用材料としてセラミツクスを広範囲に
使用するには、延性、加工性の優れた金属と接合
することが必要である。セラミツクスと金属を接
合する場合、まず変形しやすく、ろう付けやはん
だ付けが容易な銅板と接合し、しかる後接合すべ
き金属と銅板とをろう付けあるいははんだ付けす
ることが多い。しかしながら、セラミツクスと銅
板とを高温で接合した場合、冷却中に大きな熱応
力が発生し、セラミツクスに割れが発生すること
がある。一方、特開昭60−200870号公報に、金属
部材のセラミツクス焼結体に接合する面に、不連
続部（スリツト）を形成して接合したセラミツク
ス−金属接合体が開示され、セラミツクスの割れ
や剥離が無いことが示されている。BACKGROUND ART Ceramics are attracting attention as structural materials superior to metals in terms of heat resistance, wear resistance, corrosion resistance, etc. However, ceramics have the disadvantage that they are brittle and have poor workability compared to metals. Therefore, in order to widely use ceramics as a structural material, it is necessary to bond them with metals that have excellent ductility and workability. When joining ceramics and metal, it is often the case that a copper plate, which is easily deformed and can be easily brazed or soldered, is first joined, and then the metal to be joined and the copper plate are brazed or soldered. However, when ceramics and copper plates are bonded at high temperatures, large thermal stress is generated during cooling, which may cause cracks in the ceramics. On the other hand, Japanese Patent Application Laid-Open No. 60-200870 discloses a ceramic-metal bonded body in which a discontinuous portion (slit) is formed on the surface of a metal member to be bonded to a ceramic sintered body. It is shown that there is no peeling.
発明が解決しようとする問題点
上記のごとく、セラミツクスと金属とを接合す
るために、まず、セラミツクスと銅板とを高温で
接合した場合、冷却中に大きな熱応力が発生し、
比較的低強度のセラミツクスでは割れが発生する
ことがある。これは熱膨脹率が、銅は約18×
10-6／℃で、たとえばアルミナセラミツクスの約
８×10-6／℃の２倍以上と、大きいことに起因す
るものである。すなわち、セラミツクスと銅板と
を高温で接合した場合、冷却中に大きな熱応力が
発生し、その結果生じる銅板の上下面の収縮量の
差により、外周部が上方へ反ろうとし、これによ
つてアルミナセラミツクスの銅板との接合面近傍
の外周部では軸方向（厚さ方向）の引張応力が熱
反応として発生する。以上のごとく銅板は、セラ
ミツクスと比べて熱収縮率がかなり大きいため、
前記特開昭60−200870号公報で開示されたごとく
金属部材、すなわち銅板のセラミツクスに接合す
る面に不連続部を形成して接合しても、銅板の接
合面の反対面の大きな収縮により、セラミツクス
の銅板との接合面の外周部に依然として引張応力
が発生して、割れの原因となることが避けられな
い。Problems to be Solved by the Invention As mentioned above, in order to bond ceramics and metal, when ceramics and copper plates are first bonded at high temperature, large thermal stress is generated during cooling.
Cracks may occur in ceramics with relatively low strength. This is the thermal expansion coefficient of copper, which is approximately 18
This is due to the fact that it is larger than, for example, about 8×10 -6 /°C of alumina ceramics, which is 10 -6 /°C. In other words, when ceramics and copper plates are bonded at high temperatures, large thermal stress occurs during cooling, and the resulting difference in the amount of shrinkage between the top and bottom surfaces of the copper plates causes the outer periphery to warp upwards. Tensile stress in the axial direction (thickness direction) is generated as a thermal reaction at the outer periphery of the alumina ceramic near the joint surface with the copper plate. As mentioned above, copper plates have a much higher thermal shrinkage rate than ceramics, so
Even if a discontinuous portion is formed on the surface of a metal member, that is, a copper plate to be bonded to ceramics as disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 60-200870, large shrinkage of the surface opposite to the bonding surface of the copper plate causes It is unavoidable that tensile stress still occurs at the outer periphery of the bonding surface between the ceramic and the copper plate, causing cracks.
本発明は、セラミツクスと銅板との接合の際、
セラミツクスにおける上記のごとき熱応力を緩和
して、セラミツクスの割れを生じることなく接合
し得る方法を提供しようとするものである。 In the present invention, when joining ceramics and a copper plate,
The present invention aims to provide a method that can reduce the above-mentioned thermal stress in ceramics and join the ceramics without causing cracks.
問題点を解決するための手段
本発明のセラミツクスと銅板との接合方法は、
セラミツクスと銅板とを高温で接合する際、銅板
のセラミツクスとの接合面の反対面に、冷却時に
おける熱応力緩和用の複数条の溝を格子状に設け
ることを特徴とするものである。Means for Solving the Problems The method for joining ceramics and copper plates of the present invention is as follows:
When a ceramic and a copper plate are bonded at a high temperature, a plurality of grooves are provided in a lattice pattern on the surface of the copper plate opposite to the surface to be bonded to the ceramic for relieving thermal stress during cooling.
作 用
上記のごとく、銅板のセラミツクスとの接合面
の反対面に、冷却時における熱応力緩和用の複数
条の溝が格子状に設けられていることにより、高
温で接合後の冷却過程における、銅板の接合面の
反対面外周部での収縮による反り上がりが減少
し、セラミツクス側に発生する引張応力が小さ
く、セラミツクスの割れが生じない。Function As mentioned above, multiple grooves are provided in a lattice pattern on the opposite side of the copper plate to the surface to be bonded to the ceramics to alleviate thermal stress during cooling, so that during the cooling process after bonding at high temperatures, Warpage due to shrinkage at the outer periphery of the copper plate opposite to the joint surface is reduced, the tensile stress generated on the ceramic side is small, and cracking of the ceramic does not occur.
実施例
直径20mm、厚さ７mmの高純度アルミナセラミツ
クス（＞98％Al2O3）１に、直径20mm、厚さ２mm
の銅板（無酸素銅）２を、片面に幅１mm、深さ
1.5mm、ピツチ３mmの熱応力緩和用の溝３を格子
状に設けて、第１図に示すごとく、溝を設けた面
の他面を接合面として積層し、アルミナセラミツ
クス１と銅板２が銅−チタン合金融液によつて接
合されるようチタン箔（99.9％Ti、厚さ20μｍ）
４を挟み、接合処理した。接合処理は、真空中で
接合面に対する外部からの加圧無しに、温度900
℃に５分間保持して行なつた。得られたアルミナ
セラミツクス−銅板接合物では、第２図に示すご
とく、アルミナセラミツクス１に割れは全く認め
られなかつた。Example High purity alumina ceramics (>98% Al 2 O 3 ) 1 with a diameter of 20 mm and a thickness of 7 mm, a diameter of 20 mm and a thickness of 2 mm
Copper plate (oxygen-free copper) 2 on one side with a width of 1 mm and a depth of
Grooves 3 for thermal stress relaxation of 1.5 mm and 3 mm pitch are provided in a lattice pattern, and as shown in Fig. 1, the other surface on which the grooves are provided is used as the bonding surface to laminate the alumina ceramics 1 and the copper plate 2. - Titanium foil (99.9% Ti, 20μm thick) to be bonded by titanium alloy liquid
4 was sandwiched and bonded. The bonding process is carried out in a vacuum at a temperature of 900℃ without any external pressure applied to the bonding surface.
The test was carried out by holding at ℃ for 5 minutes. In the resulting alumina ceramic-copper plate bonded product, no cracks were observed in the alumina ceramic 1, as shown in FIG.
これに対して、比較例として上記実施例のう
ち、片面に溝を設けない銅板を用いるほかは、全
く同様に接合処理したアルミナセラミツクス１１
と銅板１２の接合物では、第３図に示すごとく、
アルミナセラミツクス１１には銅板１２との接合
面の外周部からアルミナセラミツクス１１内部に
向つて割れ１３が生じており、この割れ発生の位
置は第３図に示した高い引張りの熱応力σZの発生
する位置と対応していた。 On the other hand, as a comparative example, alumina ceramics 11 was bonded in exactly the same manner as in the above embodiment except that a copper plate without grooves on one side was used.
As shown in FIG.
A crack 13 occurs in the alumina ceramic 11 from the outer periphery of the joint surface with the copper plate 12 toward the inside of the alumina ceramic 11, and the location of this crack is the occurrence of high tensile thermal stress σ Z shown in FIG. It corresponded to the position.
上記のごとく、銅板のセラミツクスとの接合面
の反対面に、冷却時における熱応力緩和用の溝を
設けて接合することにより、セラミツクスに割れ
が発生しないが、銅板に設ける溝は、銅板の大き
さ、厚さにもよるが、幅0.5〜２mm、深さ0.5〜２
mm、ピツチ１〜５mmが好ましい。 As mentioned above, cracks do not occur in the ceramic by providing grooves on the surface opposite to the surface to be bonded to the ceramic of the copper plate to relieve thermal stress during cooling, but the grooves provided in the copper plate are Depending on thickness, width 0.5-2mm, depth 0.5-2mm
mm, and the pitch is preferably 1 to 5 mm.
発明の効果
本発明によれば、セラミツクスと銅板とを、セ
ラミツクスに割れを生じることなく接合すること
ができる。得られたセラミツクス−銅板接合物
は、銅板面を鋼等の他の金属とろう付け、はんだ
付け等して接合すればよく、セラミツクスと鋼等
の金属との強固な接合を容易に行なうことができ
る。また、銅板に設けられる溝は格子状であるた
め、セラミツクスが平板であつても、問題なく接
合することができる。Effects of the Invention According to the present invention, ceramics and a copper plate can be joined without causing cracks in the ceramics. The obtained ceramic-copper plate bonded product may be joined by brazing, soldering, etc. on the surface of the copper plate with another metal such as steel, and strong bonding between ceramics and metal such as steel can be easily achieved. can. Furthermore, since the grooves provided in the copper plate are in the form of a lattice, even if the ceramics are flat plates, they can be joined without any problem.
第１図Ａは本発明の実施例における接合処理前
の積層物の側面図、Ｂは同平面図、第２図は本発
明の実施例により得られた接合物の縦断面図、第
３図は従来の方法により接合したアルミナセラミ
ツクス−銅板接合物の縦断面図である。
１……アルミナセラミツクス、２……銅板、３
……溝。
FIG. 1A is a side view of the laminate before the bonding process according to the embodiment of the present invention, B is a plan view thereof, FIG. 2 is a vertical cross-sectional view of the bonded product obtained according to the embodiment of the present invention, and FIG. 1 is a longitudinal cross-sectional view of an alumina ceramic-copper plate bonded product bonded by a conventional method. 1...Alumina ceramics, 2...Copper plate, 3
……groove.
Claims (1)
銅板のセラミツクスとの接合面の反対面に、冷却
時における熱応力緩和用の複数条の溝を格子状に
設けることを特徴とするセラミツクスと銅板との
接合方法。1 When joining ceramics and copper plates at high temperature,
A method for joining ceramics and a copper plate, characterized in that a plurality of grooves for relaxing thermal stress during cooling are provided in a lattice pattern on the opposite surface of the copper plate to the surface to be joined with the ceramics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11036886A JPS62265187A (en) | 1986-05-14 | 1986-05-14 | Method of bonding ceramics to cooper plates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11036886A JPS62265187A (en) | 1986-05-14 | 1986-05-14 | Method of bonding ceramics to cooper plates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62265187A JPS62265187A (en) | 1987-11-18 |
| JPH0371393B2 true JPH0371393B2 (en) | 1991-11-13 |
Family
ID=14534021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11036886A Granted JPS62265187A (en) | 1986-05-14 | 1986-05-14 | Method of bonding ceramics to cooper plates |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62265187A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100361935C (en) * | 2006-05-15 | 2008-01-16 | 西北工业大学 | Bonding method of carbon/carbon or carbon/silicon carbide composite material and heat-resistant alloy |
| WO2025202754A1 (en) * | 2024-03-29 | 2025-10-02 | 日本発條株式会社 | Joined body and production method for joined body |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59152274A (en) * | 1983-02-14 | 1984-08-30 | 日本電気株式会社 | Soldering method |
| JPH0218244Y2 (en) * | 1985-10-01 | 1990-05-22 |
-
1986
- 1986-05-14 JP JP11036886A patent/JPS62265187A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62265187A (en) | 1987-11-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP3057125B1 (en) | Substrate for heat sink-equipped power module, and production method for same | |
| US4602731A (en) | Direct liquid phase bonding of ceramics to metals | |
| JPH0525397B2 (en) | ||
| JPH0249267B2 (en) | ||
| EP0197397B1 (en) | A method for bonding ceramics to a metal | |
| JPH02196074A (en) | Production of ceramics-metal joined body | |
| JPH0662344B2 (en) | Ceramic and metal joint | |
| JPH0371393B2 (en) | ||
| JPS6081071A (en) | Metal sheet material for ceramic bonding | |
| JPH08102570A (en) | Ceramics circuit board | |
| JPH08274423A (en) | Ceramics circuit board | |
| JPH02175674A (en) | Joined body of ceramics and metallic body and method for joining thereof | |
| JPH0782050A (en) | How to join ceramics and metal | |
| JPH0672779A (en) | Method for joining carbon member | |
| JPS60145972A (en) | Ceramic-metal bonded body | |
| JPH0469594B2 (en) | ||
| JPH0234912B2 (en) | SERAMITSUKUSUTOKINZOKUTAITONOSETSUGOHOHO | |
| JPS6077181A (en) | Ceramic-metal bonded body | |
| JPH06263554A (en) | Ceramics-metal bonded substrate | |
| JPS5935074A (en) | Ceramic sheet | |
| JPS6197174A (en) | Diffusion bonding method between ceramics and metal | |
| JPH0243704B2 (en) | SERAMITSUKUSUTOKINZOKUTONOSETSUGOHOHO | |
| JPS6065774A (en) | Ceramic-metal bonded body and manufacture | |
| JPH01249669A (en) | Ceramic circuit board | |
| JP2650460B2 (en) | Joining method of alumina ceramic and metal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |