JPH0373477U - - Google Patents
Info
- Publication number
- JPH0373477U JPH0373477U JP13388089U JP13388089U JPH0373477U JP H0373477 U JPH0373477 U JP H0373477U JP 13388089 U JP13388089 U JP 13388089U JP 13388089 U JP13388089 U JP 13388089U JP H0373477 U JPH0373477 U JP H0373477U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- circuit pattern
- connection terminal
- circuit
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図〜第３図はこの考案の一実施例を説明す
るためのもので、このうち第１図は接合前の要部
の断面図、第２図は同要部の斜視図、第３図は接
合後の要部の断面図、第４図及び第５図はこの考
案の他の実施例を説明するためのもので、このう
ち第４図は接合前の要部の断面図、第５図は接合
後の要部の断面図である。
１……第１の回路基板、２……第２の回路基板
、１１，２１……基板本体、１２，２５……回路
パターン、１３……接続端子、１５……半田、２
３……上ランド、２４……下ランド。
Figures 1 to 3 are for explaining one embodiment of this invention, of which Figure 1 is a sectional view of the main parts before joining, Figure 2 is a perspective view of the main parts, and Figure 3 is a perspective view of the main parts. The figure is a sectional view of the main part after joining, and Figures 4 and 5 are for explaining other embodiments of this invention, of which Figure 4 is a sectional view of the main part before joining, and FIG. 5 is a sectional view of the main parts after joining. DESCRIPTION OF SYMBOLS 1... First circuit board, 2... Second circuit board, 11, 21... Board body, 12, 25... Circuit pattern, 13... Connection terminal, 15... Solder, 2
3...upper land, 24...lower land.
Claims (1)
回路パターンに接続された接続端子が設けられ、
前記接続端子に半田が被着された第１の回路基板
と、 基板本体の上（下）面に回路パターンが設けら
れかつ上下面にスルホールを介して接続された上
ランドと下ランドとが設けられ、前記上ランドが
前記回路パターンと接続された第２の回路基板と
を備え、 前記第１の回路基板の接続端子と前記第２の回
路基板の下（上）ランドとが前記半田を介して接
合されていることを特徴とする回路基板の接続構
造。[Claims for Utility Model Registration] A circuit pattern and a connection terminal connected to this circuit pattern are provided on the upper (lower) surface of the board body,
A first circuit board having solder adhered to the connection terminal; and a circuit pattern provided on the upper (lower) surface of the board body, and upper and lower lands connected via through holes on the upper and lower surfaces. a second circuit board, the upper land of which is connected to the circuit pattern, and the connection terminal of the first circuit board and the lower (upper) land of the second circuit board are connected via the solder. A circuit board connection structure characterized by being bonded together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13388089U JPH0373477U (en) | 1989-11-20 | 1989-11-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13388089U JPH0373477U (en) | 1989-11-20 | 1989-11-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0373477U true JPH0373477U (en) | 1991-07-24 |
Family
ID=31681266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13388089U Pending JPH0373477U (en) | 1989-11-20 | 1989-11-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0373477U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006093210A (en) * | 2004-09-21 | 2006-04-06 | Yazaki Corp | Electric circuit body |
-
1989
- 1989-11-20 JP JP13388089U patent/JPH0373477U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006093210A (en) * | 2004-09-21 | 2006-04-06 | Yazaki Corp | Electric circuit body |