JPH0375404U - - Google Patents

Info

Publication number
JPH0375404U
JPH0375404U JP13755389U JP13755389U JPH0375404U JP H0375404 U JPH0375404 U JP H0375404U JP 13755389 U JP13755389 U JP 13755389U JP 13755389 U JP13755389 U JP 13755389U JP H0375404 U JPH0375404 U JP H0375404U
Authority
JP
Japan
Prior art keywords
metal cap
optical semiconductor
semiconductor device
glass plate
stem
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13755389U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13755389U priority Critical patent/JPH0375404U/ja
Publication of JPH0375404U publication Critical patent/JPH0375404U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Optical Couplings Of Light Guides (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す光半導体素子
容器および光学系の断面図、第2図は従来の一例
を示す光半導体素子容器および光学系の断面図で
ある。 1……金属キヤツプ、2……低融点ガラス、3
……ガラス板、4……鍔状段差部、5……ステム
、6……リード、7……絶縁体、8……ヒートシ
ンク、9……端面発光LED、10……ボンデイ
ングワイヤ、11……光透過穴、12……グリン
レンズ、13……光フアイバ。
FIG. 1 is a cross-sectional view of an optical semiconductor device container and optical system showing an embodiment of the present invention, and FIG. 2 is a cross-sectional view of a photosemiconductor device container and optical system showing a conventional example. 1...Metal cap, 2...Low melting point glass, 3
...Glass plate, 4 ... Flange-shaped step, 5 ... Stem, 6 ... Lead, 7 ... Insulator, 8 ... Heat sink, 9 ... Edge emitting LED, 10 ... Bonding wire, 11 ... Light transmission hole, 12... Green lens, 13... Optical fiber.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 中央に光取り出しのための穴を形成した金属キ
ヤツプと、前記金属キヤツプに低融点ガラスで接
着され且つ光取り出し窓を形成するためのガラス
板と、光半導体素子を搭載するステムとを有し、
前記ガラス板を接着した金属キヤツプを前記光半
導体素子の上から前記ステム上に固着する光半導
体素子容器において、前記金属キヤツプ上の周辺
部に鍔状段差部を形成し、前記鍔状段差部上で前
記ガラス板を低融点ガラスにより接着したことを
特徴とする光半導体素子容器。
It has a metal cap with a hole formed in the center for light extraction, a glass plate bonded to the metal cap with low melting point glass to form a light extraction window, and a stem on which an optical semiconductor element is mounted,
In an optical semiconductor device container in which a metal cap to which the glass plate is adhered is fixed onto the stem from above the optical semiconductor device, a flange-like step portion is formed at a peripheral portion of the metal cap, and a flange-like step portion is formed on the periphery of the metal cap. An optical semiconductor device container characterized in that the glass plate is bonded with low melting point glass.
JP13755389U 1989-11-27 1989-11-27 Pending JPH0375404U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13755389U JPH0375404U (en) 1989-11-27 1989-11-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13755389U JPH0375404U (en) 1989-11-27 1989-11-27

Publications (1)

Publication Number Publication Date
JPH0375404U true JPH0375404U (en) 1991-07-29

Family

ID=31684705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13755389U Pending JPH0375404U (en) 1989-11-27 1989-11-27

Country Status (1)

Country Link
JP (1) JPH0375404U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015103658A (en) * 2013-11-25 2015-06-04 株式会社リコー Compound semiconductor light emitting device manufacturing method and compound semiconductor light emitting device manufactured by the manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015103658A (en) * 2013-11-25 2015-06-04 株式会社リコー Compound semiconductor light emitting device manufacturing method and compound semiconductor light emitting device manufactured by the manufacturing method

Similar Documents

Publication Publication Date Title
JPS6320464U (en)
JPS59103462U (en) light emitting diode device
JPS5925284A (en) Photosemiconductor device
JPH0189761U (en)
JPS5851454U (en) semiconductor equipment
JPH0160555U (en)
JPS6236312Y2 (en)
JPS63164264U (en)
JPS6437065U (en)
JPS5923758U (en) semiconductor equipment
JPH0224556U (en)
JPS63148906U (en)
JPS587365U (en) Light condensing device for light emitting diodes for optical communication
JPS5993159U (en) light emitting diode device
JPS6452255U (en)
JPS6411558U (en)
JPH0425260U (en)
JPS60153538U (en) semiconductor element
JPH01145161U (en)
JPH0310557U (en)
JPH0481107U (en)
JPH0235454U (en)
JPH01162266U (en)
JPS6430856U (en)
JPH0474441U (en)