JPH0375531U - - Google Patents
Info
- Publication number
- JPH0375531U JPH0375531U JP1989137771U JP13777189U JPH0375531U JP H0375531 U JPH0375531 U JP H0375531U JP 1989137771 U JP1989137771 U JP 1989137771U JP 13777189 U JP13777189 U JP 13777189U JP H0375531 U JPH0375531 U JP H0375531U
- Authority
- JP
- Japan
- Prior art keywords
- conductive material
- electrode pads
- utility
- electrode pad
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/59—Bond pads specially adapted therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/981—Auxiliary members, e.g. spacers
- H10W72/983—Reinforcing structures, e.g. collars
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989137771U JPH0375531U (th) | 1989-11-27 | 1989-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989137771U JPH0375531U (th) | 1989-11-27 | 1989-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0375531U true JPH0375531U (th) | 1991-07-29 |
Family
ID=31684914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989137771U Pending JPH0375531U (th) | 1989-11-27 | 1989-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0375531U (th) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114062718A (zh) * | 2020-07-31 | 2022-02-18 | 矽创电子股份有限公司 | 芯片的测试垫结构 |
-
1989
- 1989-11-27 JP JP1989137771U patent/JPH0375531U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114062718A (zh) * | 2020-07-31 | 2022-02-18 | 矽创电子股份有限公司 | 芯片的测试垫结构 |
| JP2022031629A (ja) * | 2020-07-31 | 2022-02-22 | シトロニックス テクノロジー コーポレーション | チップのテストパッド構造 |
| US11694983B2 (en) | 2020-07-31 | 2023-07-04 | Sitronix Technology Corporation | Test pad structure of chip |
| TWI812987B (zh) * | 2020-07-31 | 2023-08-21 | 矽創電子股份有限公司 | 晶片之測試墊結構 |
| CN114062718B (zh) * | 2020-07-31 | 2025-11-11 | 矽创电子股份有限公司 | 芯片的测试垫结构 |