JPH0375532U - - Google Patents
Info
- Publication number
- JPH0375532U JPH0375532U JP1989137554U JP13755489U JPH0375532U JP H0375532 U JPH0375532 U JP H0375532U JP 1989137554 U JP1989137554 U JP 1989137554U JP 13755489 U JP13755489 U JP 13755489U JP H0375532 U JPH0375532 U JP H0375532U
- Authority
- JP
- Japan
- Prior art keywords
- recess
- tapered side
- vacuum hole
- mounting collet
- dry air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Die Bonding (AREA)
Description
第１図は本考案の一実施例の縦断面図、第２図
は従来のコレツトの縦断面図である。 １……真空穴、２……高圧乾燥空気穴、３……
コレツト、４……ペレツト、５……接着剤、６…
…ケースキヤビテイ面、７……ケース。
は従来のコレツトの縦断面図である。 １……真空穴、２……高圧乾燥空気穴、３……
コレツト、４……ペレツト、５……接着剤、６…
…ケースキヤビテイ面、７……ケース。
Claims (1)
- 棒状体の先端に側面がテーパ状の凹部を有し、
該凹部の底面に通ずる真空穴により半導体チツプ
を前記テーパ状の側面に当接させて保持するマウ
ント用コレツトにおいて、前記真空穴と並行し、
前記凹部の底面に通ずるように高圧乾燥空気穴を
設けたことを特徴とするマウント用コレツト。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989137554U JPH0375532U (ja) | 1989-11-27 | 1989-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989137554U JPH0375532U (ja) | 1989-11-27 | 1989-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0375532U true JPH0375532U (ja) | 1991-07-29 |
Family
ID=31684706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989137554U Pending JPH0375532U (ja) | 1989-11-27 | 1989-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0375532U (ja) |
-
1989
- 1989-11-27 JP JP1989137554U patent/JPH0375532U/ja active Pending